We experimentally evaluated the interface state density of GaN MIS-HEMTs during time-dependent dielectric breakdown(TDDB).Under a high forward gate bias stress,newly increased traps generate both at the SiNx/AlGaN int...We experimentally evaluated the interface state density of GaN MIS-HEMTs during time-dependent dielectric breakdown(TDDB).Under a high forward gate bias stress,newly increased traps generate both at the SiNx/AlGaN interface and the SiNx bulk,resulting in the voltage shift and the increase of the voltage hysteresis.When prolonging the stress duration,the defects density generated in the SiNx dielectric becomes dominating,which drastically increases the gate leakage current and causes the catastrophic failure.After recovery by UV light illumination,the negative shift in threshold voltage(compared with the fresh one)confirms the accumulation of positive charge at the SiNx/AlGaN interface and/or in SiNx bulk,which is possibly ascribed to the broken bonds after long-term stress.These results experimentally confirm the role of defects in the TDDB of GaN-based MIS-HEMTs.展开更多
For many years, a Lorentz factor of L = 1/3 has been used to describe the local electric field in thin amorphous dielectrics. However, the exact meaning of thin has been unclear. The local electric field E<sub>l...For many years, a Lorentz factor of L = 1/3 has been used to describe the local electric field in thin amorphous dielectrics. However, the exact meaning of thin has been unclear. The local electric field E<sub>loc</sub> modeling presented in this work indicates that L = 1/3 is indeed valid for very thin solid dielectrics (t<sub>diel</sub> ≤ 20 monolayers) but significant deviations from L = 1/3 start to occur for thicker dielectrics. For example, L ≈ 2/3 for dielectric thicknesses of t<sub>diel</sub> = 50 monolayers and increases to L ≈ 1 for dielectric thicknesses t<sub>diel</sub> > 200 monolayers. The increase in L with t<sub>diel</sub> means that the local electric fields are significantly higher in thicker dielectrics and explains why the breakdown strength E<sub>bd</sub> of solid polar dielectrics generally reduces with dielectric thickness t<sub>diel</sub>. For example, E<sub>bd</sub> for SiO<sub>2</sub> reduces from approximately E<sub>bd</sub> ≈ 25 MV/cm at t<sub>diel</sub> = 2 nm to E<sub>bd</sub> ≈ 10 MV/cm at t<sub>diel</sub> = 50 nm. However, while E<sub>bd</sub> for SiO<sub>2</sub> reduces with t<sub>diel</sub>, all SiO<sub>2</sub> thicknesses are found to breakdown at approximately the same local electric field (E<sub>loc</sub>)<sub>bd</sub> ≈ 40 MV/cm. This corresponds to a coordination bond strength of 2.7 eV for the silicon-ion to transition from four-fold to three-fold coordination in the tetrahedral structure.展开更多
利用等效1 MeV中子和γ射线对1200 V SiC功率MOSFET进行辐射,研究了电离损伤和位移损伤对器件的影响,并分析了辐射后器件栅氧长期可靠性。结果表明:中子辐射后器件导通电阻发生明显退化,与辐射引入近界面缺陷降低载流子寿命和载流子迁...利用等效1 MeV中子和γ射线对1200 V SiC功率MOSFET进行辐射,研究了电离损伤和位移损伤对器件的影响,并分析了辐射后器件栅氧长期可靠性。结果表明:中子辐射后器件导通电阻发生明显退化,与辐射引入近界面缺陷降低载流子寿命和载流子迁移率有关。时间依赖的介质击穿(TDDB)结果表明,栅泄漏电流呈现先增加后降低趋势,与空穴捕获和电子捕获效应有关。中子辐射后栅漏电演化形式未改变,但氧化层击穿时间增加,这是中子辐射缺陷增加了Fowler-Nordheim(FN)隧穿势垒的缘故。总剂量辐射在器件氧化层内引入陷阱电荷,使得器件阈值电压负向漂移。随后的TDDB测试表明,与中子辐射一致,总剂量辐射未改变栅漏电演化形式,但氧化层击穿时间提前。这是总剂量辐射在氧化层内引入额外空穴陷阱和中性电子陷阱的缘故。展开更多
SiC MOS器件氧化膜可靠性是SiC器件研究中的重要方面。本文对4H-SiC MOS结构进行电子回旋共振(ECR)氮等离子体氧化后退火工艺处理,采用阶跃电流经时击穿以及XPS分析的方法对其氧化膜稳定性进行了电学以及物理性质方面上的分析。经分析...SiC MOS器件氧化膜可靠性是SiC器件研究中的重要方面。本文对4H-SiC MOS结构进行电子回旋共振(ECR)氮等离子体氧化后退火工艺处理,采用阶跃电流经时击穿以及XPS分析的方法对其氧化膜稳定性进行了电学以及物理性质方面上的分析。经分析氮等离子体处理8min的样品击穿时间和单位面积击穿电荷量都有了明显提高,并且早期失效比率有了明显降低。实验结果表明,经过适当时间的处理,ECR氮等离子体氧化后退火工艺可以有效地降低界面缺陷的密度,提高界面处激活能,从而提高绝缘膜耐受电流应力的能力。展开更多
基金National Key Research and Development Program of China(Grant No.2017YFB0402800)the Key Research and Development Program of Guangdong Province,China(Grant Nos.2019B010128002 and 2020B010173001)+2 种基金the National Natural Science Foundation of China(Grant Nos.U1601210 and 61904207)the Natural Science Foundation of Guangdong Province of China(Grant No.2015A030312011)the China Postdoctoral Science Foundation(Grant No.2019M663233).
文摘We experimentally evaluated the interface state density of GaN MIS-HEMTs during time-dependent dielectric breakdown(TDDB).Under a high forward gate bias stress,newly increased traps generate both at the SiNx/AlGaN interface and the SiNx bulk,resulting in the voltage shift and the increase of the voltage hysteresis.When prolonging the stress duration,the defects density generated in the SiNx dielectric becomes dominating,which drastically increases the gate leakage current and causes the catastrophic failure.After recovery by UV light illumination,the negative shift in threshold voltage(compared with the fresh one)confirms the accumulation of positive charge at the SiNx/AlGaN interface and/or in SiNx bulk,which is possibly ascribed to the broken bonds after long-term stress.These results experimentally confirm the role of defects in the TDDB of GaN-based MIS-HEMTs.
文摘For many years, a Lorentz factor of L = 1/3 has been used to describe the local electric field in thin amorphous dielectrics. However, the exact meaning of thin has been unclear. The local electric field E<sub>loc</sub> modeling presented in this work indicates that L = 1/3 is indeed valid for very thin solid dielectrics (t<sub>diel</sub> ≤ 20 monolayers) but significant deviations from L = 1/3 start to occur for thicker dielectrics. For example, L ≈ 2/3 for dielectric thicknesses of t<sub>diel</sub> = 50 monolayers and increases to L ≈ 1 for dielectric thicknesses t<sub>diel</sub> > 200 monolayers. The increase in L with t<sub>diel</sub> means that the local electric fields are significantly higher in thicker dielectrics and explains why the breakdown strength E<sub>bd</sub> of solid polar dielectrics generally reduces with dielectric thickness t<sub>diel</sub>. For example, E<sub>bd</sub> for SiO<sub>2</sub> reduces from approximately E<sub>bd</sub> ≈ 25 MV/cm at t<sub>diel</sub> = 2 nm to E<sub>bd</sub> ≈ 10 MV/cm at t<sub>diel</sub> = 50 nm. However, while E<sub>bd</sub> for SiO<sub>2</sub> reduces with t<sub>diel</sub>, all SiO<sub>2</sub> thicknesses are found to breakdown at approximately the same local electric field (E<sub>loc</sub>)<sub>bd</sub> ≈ 40 MV/cm. This corresponds to a coordination bond strength of 2.7 eV for the silicon-ion to transition from four-fold to three-fold coordination in the tetrahedral structure.
文摘利用等效1 MeV中子和γ射线对1200 V SiC功率MOSFET进行辐射,研究了电离损伤和位移损伤对器件的影响,并分析了辐射后器件栅氧长期可靠性。结果表明:中子辐射后器件导通电阻发生明显退化,与辐射引入近界面缺陷降低载流子寿命和载流子迁移率有关。时间依赖的介质击穿(TDDB)结果表明,栅泄漏电流呈现先增加后降低趋势,与空穴捕获和电子捕获效应有关。中子辐射后栅漏电演化形式未改变,但氧化层击穿时间增加,这是中子辐射缺陷增加了Fowler-Nordheim(FN)隧穿势垒的缘故。总剂量辐射在器件氧化层内引入陷阱电荷,使得器件阈值电压负向漂移。随后的TDDB测试表明,与中子辐射一致,总剂量辐射未改变栅漏电演化形式,但氧化层击穿时间提前。这是总剂量辐射在氧化层内引入额外空穴陷阱和中性电子陷阱的缘故。
