Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joi...Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.展开更多
By employing the minimum energy theorem, the Potential energy controlling equation, which consists of surface energy and gravitational energy for molten meniscus, was investigated. The soder joint geometry of molten t...By employing the minimum energy theorem, the Potential energy controlling equation, which consists of surface energy and gravitational energy for molten meniscus, was investigated. The soder joint geometry of molten tin-lead soder alloy for chip component and thin quad flat package were simulated with finite element method. The simulation results 0f solder joint geometry are coincident well with the experimental results. The solder joint geometry was applied to study the solder joint reliability for chip component RC3216.The thermal cycling tests revealed that the solder joint geometry plays an important ro1e in solder joint reliability.展开更多
In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the therm...In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the thermal needs of different modules has become increasingly prominent,especially for small-size solder joints with high heat dissipation in high-power devices.Localized soldering is con-sidered a suitable choice to selectively heat the desired target while not affecting other heat-sensitive chips.This paper reviews several local-ized soldering processes,focusing on the size of solder joints,soldering materials,and current state of the technique.Each localized solder-ing process was discovered to have unique characteristics.The requirements for small-size solder joints are met by laser soldering,microres-istance soldering,and self-propagating soldering;however,laser soldering has difficulty meeting the requirements for large heat dissipation,microresistance soldering requires the application of pressure to joints,and self-propagating soldering requires ignition materials.However,for small-size solder junctions,selective wave soldering,microwave soldering,and ultrasonic soldering are not appropriate.Because the magnetic field can be focused on a tiny area and the output energy of induction heating is large,induction soldering can be employed as a significant trend in future research.展开更多
Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were ...Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were investigated. The results showed that the Sn-1Tisolder broke the oxide film on the surface of the Al substrate and induced intergranular diffusion in the Al substrate. When Ga was added tothe solder, severe dissolution pits appeared in the Al substrate due to the action of Sn-1Ti-0.3Ga solder, and many Al particles were flakedfrom the matrix into the solder seam. Under thermal stress and the Ti adsorption effect, the oxide film cracked. With increasing solderingtime, the shear strength of 5A06 Al alloy joints soldered with Sn-1Ti and Sn-1Ti-0.3Ga active solders increased. When soldered for 90 min,the joint soldered with Sn-1Ti-0.3Ga solder had a higher shear strength of 22.12 MPa when compared to Sn-1Ti solder.展开更多
The spacecraft for deep space exploration missions will face extreme environments,including cryogenic temperature,intense radiation,wide-range temperature variations and even the combination of conditions mentioned ab...The spacecraft for deep space exploration missions will face extreme environments,including cryogenic temperature,intense radiation,wide-range temperature variations and even the combination of conditions mentioned above.Harsh environments will lead to solder joints degradation or even failure,resulting in damage to onboard electronics.The research activities on high reliability solder joints using in extreme environments can not only reduce the use of onboard protection devices,but effectively improve the overall reliability of spacecraft,which is of great significance to the aviation industry.In this paper,we review the reliability research on SnPb solder alloys,Sn-based lead-free solder alloys and In-based solder alloys in extreme environments,and try to provide some suggestions for the follow-up studies,which focus on solder joint reliability under extreme environments.展开更多
There have been huge achievements of all-perovskite tandem solar cells,which recently realized the highest power conversion efficiency of 24.8%.However,the complex device structure and complicated manufacture processe...There have been huge achievements of all-perovskite tandem solar cells,which recently realized the highest power conversion efficiency of 24.8%.However,the complex device structure and complicated manufacture processes severely restrict the further development of all-perovskite tandem solar cells.In this work,we successfully fabricated high-efficiency hole transport material-free(HTM-free)Sn−Pb alloyed narrow bandgap perovskite solar cells(PSCs)by introducing guanidinium thiocyanate(GASCN)and hydroiodic acid(HI)into the perovskite precursor solution.GASCN and HI play a positive synergy effect during perovskite crystallization process resulting in larger grain size,fewer surface defects,and lower trap density to suppress the Sn^(2+)oxidation degradation.Furthermore,they could effectively adjust the energy level of perovskite materials,reduce the energy level difference between perovskite and ITO resulting in more efficiently transport of free hole charge carriers.As a result,with adding GASCN and HI,the achieved highest power conversion efficiency of HTM-free devices increased from 12.58%to 17.85%,which is one of the highest PCEs among all values reported to date for the HTM-free narrow-bandgap(1.2-1.4 eV)Sn−Pb binary PSCs.Moreover,the optimized device shows improved environmental stability.Our additive strategy manifests a remarkable step towards the facile,cost-efficient fabrication of HTM-free perovskite-based tandem solar cells with both high efficiency and simple fabrication process.展开更多
The tensile properties of Sn-9Zn-xAg-ySb;{(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} lead-free solders were investigated. All the test samples were annealed at 150°C for 1 hour. The tests are carrie...The tensile properties of Sn-9Zn-xAg-ySb;{(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} lead-free solders were investigated. All the test samples were annealed at 150°C for 1 hour. The tests are carried out at room temperature at the strain rate of 4.17 × 10<sup>-3</sup> s<sup>-1</sup>, 20.85 × 10<sup>-3</sup> s<sup>-1</sup>, and 208.5 × 10<sup>-3</sup> s<sup>-1</sup>. It is seen that the tensile strength increases and the ductility decrease with increasing the strain rate over the investigated range. From the strain rate change test results, the strain sensitivity values are found in the range of 0.0831 to 0.1455 due to the addition of different alloying elements.展开更多
基金financial support from the National Natural Science Foundation of China(grant numbers 52275385 and U2167216)the Sichuan Province Science and Technology Support Program(grant number 2022YFG0086)。
文摘Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.
文摘By employing the minimum energy theorem, the Potential energy controlling equation, which consists of surface energy and gravitational energy for molten meniscus, was investigated. The soder joint geometry of molten tin-lead soder alloy for chip component and thin quad flat package were simulated with finite element method. The simulation results 0f solder joint geometry are coincident well with the experimental results. The solder joint geometry was applied to study the solder joint reliability for chip component RC3216.The thermal cycling tests revealed that the solder joint geometry plays an important ro1e in solder joint reliability.
基金The research was supported by the National Natural Science Foundation of China(Grant No.52105331)the Shenzhen Science and Technology Innovation Committee(Grant No.JSGG20201102154600003,GXWD20220818163456002,JCYJ20210324124203009).
文摘In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the thermal needs of different modules has become increasingly prominent,especially for small-size solder joints with high heat dissipation in high-power devices.Localized soldering is con-sidered a suitable choice to selectively heat the desired target while not affecting other heat-sensitive chips.This paper reviews several local-ized soldering processes,focusing on the size of solder joints,soldering materials,and current state of the technique.Each localized solder-ing process was discovered to have unique characteristics.The requirements for small-size solder joints are met by laser soldering,microres-istance soldering,and self-propagating soldering;however,laser soldering has difficulty meeting the requirements for large heat dissipation,microresistance soldering requires the application of pressure to joints,and self-propagating soldering requires ignition materials.However,for small-size solder junctions,selective wave soldering,microwave soldering,and ultrasonic soldering are not appropriate.Because the magnetic field can be focused on a tiny area and the output energy of induction heating is large,induction soldering can be employed as a significant trend in future research.
基金the National Natural Science Foundation of China(No.52171045).
文摘Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were investigated. The results showed that the Sn-1Tisolder broke the oxide film on the surface of the Al substrate and induced intergranular diffusion in the Al substrate. When Ga was added tothe solder, severe dissolution pits appeared in the Al substrate due to the action of Sn-1Ti-0.3Ga solder, and many Al particles were flakedfrom the matrix into the solder seam. Under thermal stress and the Ti adsorption effect, the oxide film cracked. With increasing solderingtime, the shear strength of 5A06 Al alloy joints soldered with Sn-1Ti and Sn-1Ti-0.3Ga active solders increased. When soldered for 90 min,the joint soldered with Sn-1Ti-0.3Ga solder had a higher shear strength of 22.12 MPa when compared to Sn-1Ti solder.
基金Supported by National Natural Science Foundation of China (Grant No.51775141)Heilongjiang Touyan Innovation Team Program。
文摘The spacecraft for deep space exploration missions will face extreme environments,including cryogenic temperature,intense radiation,wide-range temperature variations and even the combination of conditions mentioned above.Harsh environments will lead to solder joints degradation or even failure,resulting in damage to onboard electronics.The research activities on high reliability solder joints using in extreme environments can not only reduce the use of onboard protection devices,but effectively improve the overall reliability of spacecraft,which is of great significance to the aviation industry.In this paper,we review the reliability research on SnPb solder alloys,Sn-based lead-free solder alloys and In-based solder alloys in extreme environments,and try to provide some suggestions for the follow-up studies,which focus on solder joint reliability under extreme environments.
基金financially supported by the Joint Funds Project funding from Guangdong Basic and Applied Basic Research Foundation(Grant No.2019B1515120083)the National Natural Science Foundation of China(Grant No.U19A2089)+4 种基金the Key Fundamental Research Project funding from the Shenzhen Science and Technology Innovation Committee(Grant No.JCYJ20200109141014474)the National Key Research and Development Project from the Ministry of Science and Technology of China(Grants Nos.2016YFA0202400 and 2016YFA0202404)the Peacock Team Project from Shenzhen Science and Technology Innovation Committee(Grant No.KQTD2015033110182370)Shenzhen Engineering R&D Center for Flexible Solar Cells project funding from Shenzhen Development and Reform Committee(Grant No.2019-126)the Guangdong-Hong Kong-Macao Joint Laboratory(Grant No.2019B121205001).
文摘There have been huge achievements of all-perovskite tandem solar cells,which recently realized the highest power conversion efficiency of 24.8%.However,the complex device structure and complicated manufacture processes severely restrict the further development of all-perovskite tandem solar cells.In this work,we successfully fabricated high-efficiency hole transport material-free(HTM-free)Sn−Pb alloyed narrow bandgap perovskite solar cells(PSCs)by introducing guanidinium thiocyanate(GASCN)and hydroiodic acid(HI)into the perovskite precursor solution.GASCN and HI play a positive synergy effect during perovskite crystallization process resulting in larger grain size,fewer surface defects,and lower trap density to suppress the Sn^(2+)oxidation degradation.Furthermore,they could effectively adjust the energy level of perovskite materials,reduce the energy level difference between perovskite and ITO resulting in more efficiently transport of free hole charge carriers.As a result,with adding GASCN and HI,the achieved highest power conversion efficiency of HTM-free devices increased from 12.58%to 17.85%,which is one of the highest PCEs among all values reported to date for the HTM-free narrow-bandgap(1.2-1.4 eV)Sn−Pb binary PSCs.Moreover,the optimized device shows improved environmental stability.Our additive strategy manifests a remarkable step towards the facile,cost-efficient fabrication of HTM-free perovskite-based tandem solar cells with both high efficiency and simple fabrication process.
文摘The tensile properties of Sn-9Zn-xAg-ySb;{(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} lead-free solders were investigated. All the test samples were annealed at 150°C for 1 hour. The tests are carried out at room temperature at the strain rate of 4.17 × 10<sup>-3</sup> s<sup>-1</sup>, 20.85 × 10<sup>-3</sup> s<sup>-1</sup>, and 208.5 × 10<sup>-3</sup> s<sup>-1</sup>. It is seen that the tensile strength increases and the ductility decrease with increasing the strain rate over the investigated range. From the strain rate change test results, the strain sensitivity values are found in the range of 0.0831 to 0.1455 due to the addition of different alloying elements.