Using a transient thermoreflectance （TTR） technique, several Au films with different thicknesses on glass and SiC substrates are measured for thermal characterization of metMlic nano-films, including the electron ph...Using a transient thermoreflectance （TTR） technique, several Au films with different thicknesses on glass and SiC substrates are measured for thermal characterization of metMlic nano-films, including the electron phonon coupling factor G, interfazial thermal resistance R, and thermal conductivity Ks of the substrate. The rear heating-front detecting （RF） method is used to ensure the femtosecond temporal resolution. An intense laser beam is focused on the rear surface to heat the film, and another weak laser beam is focused on the very spot of the front surface to detect the change in the electron temperature. By varying the optical path delay between the two beams, a complete electron temperature profile can be scanned. Different from the normally used single-layer model, the double-layer model involving interfaciM thermal resistance is studied here. The electron temperature cooling profile can be affected by the electron energy transfer into the substrate or the electron-phonon interactions in the metallic films. For multiple-target optimization, the genetic algorithm （GA） is used to obtain both G and R. The experimental result gives a deep understanding of the mechanism of ultra-fast heat transfer in metals.展开更多
Due to the incompatibility of the interlaminar deformations,the interface debonding or cracking usually happens in a layered magnetoelectric(ME)structure under an applied load.In this paper,the transient responses of ...Due to the incompatibility of the interlaminar deformations,the interface debonding or cracking usually happens in a layered magnetoelectric(ME)structure under an applied load.In this paper,the transient responses of the anti-plane interface cracks in piezoelectric(PE)-piezomagnetic(PM)sandwich structures are studied by the standard methods of the integral transform and singular integral equation.Discussion on the numerical examples indicates that the PE-PM-PE structure under electric impact is more likely to fracture than the PM-PE-PM structure under a magnetic impact.The dynamic stress intensity factors(DSIFs)are more sensitive to the variation of the active layer thickness.The effects of the material constants on the DSIFs are dependent on the roles played by PE and PM media during the deformation process.展开更多
基金supported by the National Natural Science Foundation of China (Grant Nos. 50730006,50976053,and 50906042)
文摘Using a transient thermoreflectance （TTR） technique, several Au films with different thicknesses on glass and SiC substrates are measured for thermal characterization of metMlic nano-films, including the electron phonon coupling factor G, interfazial thermal resistance R, and thermal conductivity Ks of the substrate. The rear heating-front detecting （RF） method is used to ensure the femtosecond temporal resolution. An intense laser beam is focused on the rear surface to heat the film, and another weak laser beam is focused on the very spot of the front surface to detect the change in the electron temperature. By varying the optical path delay between the two beams, a complete electron temperature profile can be scanned. Different from the normally used single-layer model, the double-layer model involving interfaciM thermal resistance is studied here. The electron temperature cooling profile can be affected by the electron energy transfer into the substrate or the electron-phonon interactions in the metallic films. For multiple-target optimization, the genetic algorithm （GA） is used to obtain both G and R. The experimental result gives a deep understanding of the mechanism of ultra-fast heat transfer in metals.
基金Project supported by the National Natural Science Foundation of China(Nos.11272222,11502108,and 11611530686)the Natural Science Foundation for Distinguished Young Scholars of Jiangsu Province of China(No.BK20140037)
文摘Due to the incompatibility of the interlaminar deformations,the interface debonding or cracking usually happens in a layered magnetoelectric(ME)structure under an applied load.In this paper,the transient responses of the anti-plane interface cracks in piezoelectric(PE)-piezomagnetic(PM)sandwich structures are studied by the standard methods of the integral transform and singular integral equation.Discussion on the numerical examples indicates that the PE-PM-PE structure under electric impact is more likely to fracture than the PM-PE-PM structure under a magnetic impact.The dynamic stress intensity factors(DSIFs)are more sensitive to the variation of the active layer thickness.The effects of the material constants on the DSIFs are dependent on the roles played by PE and PM media during the deformation process.
