The interfacial reactions in partial transient liquid-phase bonding of Si3N4 ceramics with Ti/Ni/Ti interlayers were studied by means of scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and...The interfacial reactions in partial transient liquid-phase bonding of Si3N4 ceramics with Ti/Ni/Ti interlayers were studied by means of scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and X-ray diffractometry (XRD). It was shown that the interfacial structure of Si3N4/TiN/Ti5Si3+Ti5Si4 + Ni3Si/ (NiTi ) /Ni3Ti/ Ni was formed after bonding. The activation energies for TiN layer and the mixed reaction layer of Ti5Si3 + Ti5Si4 + Ni3Si are 546. 8 kJ/mol and 543. 9 kJ/mol, respectively. The formation and transition processes of interface layer sequence in the joint were clarified by diffusion path. An important characteristic, which is different from the conventional brazing and soid-state diffusion bonding, has been found, i. e., during the partial transient liquid-phase bonding, not only the reaction layers which have formed grow, but also the diffusion path in the subsequent reaction changes because of the remarkable variation of the concentration on the metal side.展开更多
Effects of the main process parameters(temperature and time) on microstructure and properties of Ti(C, N)/Ni interface bonded by (Cu+Nb) interlayer in a vacuum diffusion bonding device were investigated. The in...Effects of the main process parameters(temperature and time) on microstructure and properties of Ti(C, N)/Ni interface bonded by (Cu+Nb) interlayer in a vacuum diffusion bonding device were investigated. The interfacial microstructures consisted initially of Ni3Nb metallic compound and eutectic of Ni3Nb + CuNiss, and finally transformed to (Ti, Nb) (C, N)+Ni3Nb near Ti (C, N) and NiCuss + Ni3Nb near Ni when diffusion bonding temperature was 1 523-1 573 K. It was clear that Cu was a constituent in the transient liquid phase (TLP) into which Ni was dissolved by forming Cu-Ni transition liquid. Nb was dissolved in Cu-Ni transition liquid rapidly. Ti (C, N) conld be wetted by resultant Ni-Nb-Cu transient liquid phase which was followed by a little (Ti, Nb) (C, N) solid solution formed at interface. This increased the interface combining capability. Ultimately the interface shear strength was able to reach 140 MPa. The theoretle analysis and experimental results show that the growth of interfacial reaction layer Ni3Nb accords with parabola law, and the activation energy of diffusion reaction is 115.0±0.5 kJ/mol, while the diffusion reaction speed constant is 12.53 mm/s^1/2.展开更多
The compact oxide on the surface of SiCp/Al metal matrix composite (SiCp/Al MMC) greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface...The compact oxide on the surface of SiCp/Al metal matrix composite (SiCp/Al MMC) greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase (TLP) bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy (SEM) was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.展开更多
Partial transient liquid-phase bonding (PTLP bonding) of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure an...Partial transient liquid-phase bonding (PTLP bonding) of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure and joint strength was discussed. The joint interface structures are investigated by scanning electron microscope (SEM) and energy dispersion spectroscopy(EDS). The results show that the maximum joint strength of 210 MPa is obtained at room temperature in the experiments. When joining temperature and time are not changed and the process of isothermal solidification is sufficient , interface structure, reaction layer thickness and isothermal solidification thickness change with the thickness of Ti foil.展开更多
With the use of Ti/Ni/Cu/Ni multiple foils as interlayer,carbon/carbon(C/C) composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique.The effect of bonding temperature on ...With the use of Ti/Ni/Cu/Ni multiple foils as interlayer,carbon/carbon(C/C) composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique.The effect of bonding temperature on the microstructures and strengths of the joints was investigated.The results showed that gradient structural multiple interlayers composed of ‘‘C–Ti reaction layer/Ti–Ni intermetallic compound layer/Ni–Cu sosoloid/residual Cu layer/Ni-GH3044 diffusion layer'' were formed between C/C composite and GH3044.The shear strength of the C/C composite/GH3044 joint reached the highest value of 26.1 MPa when the bonding temperature was 1,030 °C.In addition,the fracture morphology showed that the fracture mode changed with the increase of bonding temperature.展开更多
TiAl has been joined employing the transient liquid phase (TLP) bonding with Ti combined with Cu, Ni or Fe foils. Experimental results showed that though the interface structures of the joints are quite different, a...TiAl has been joined employing the transient liquid phase (TLP) bonding with Ti combined with Cu, Ni or Fe foils. Experimental results showed that though the interface structures of the joints are quite different, all the joined zones are composed of five sublayers, i.e. two diffusion zones, two interfacial zones and an interlayer. It has been convinced that the formation process of the transient liquid phase controls the diffusion behavior of melting point depressant (MPD) Cu, Ni, and Fe atoms, which leads to form different interface structures of the joints.展开更多
A kind of Ni-Cr-Fe-B-Si system amorphous alloy was used as interlayer in transient liquid-phase bonding(TLP bonding)of polycrystalline superalloy K465.The bonding behavior,microstructure feature and the tensile proper...A kind of Ni-Cr-Fe-B-Si system amorphous alloy was used as interlayer in transient liquid-phase bonding(TLP bonding)of polycrystalline superalloy K465.The bonding behavior,microstructure feature and the tensile properties of the joints were investigated.There are B-rich phase and Si-rich phase formed in the center of the seam after bonding at 1210℃for 30 min.The isothermal solidification is complete after bonding at 1210℃for 4 h.The relationship of the average width of the remnant eutectic zone and bonding time at 1210℃is nonlinear.The tensile strength of the bonded joint at room temperature and 900℃is comparable to that of K465 alloy.展开更多
Commercially available 000Cr3OMo2 ferritic stainless steel and 4J33 ferromagnetic expansion alloy were di- rectly bonded to silicated graphite at 1180-1200℃ and 1100-1150℃, respectively, Intedacial microstructures w...Commercially available 000Cr3OMo2 ferritic stainless steel and 4J33 ferromagnetic expansion alloy were di- rectly bonded to silicated graphite at 1180-1200℃ and 1100-1150℃, respectively, Intedacial microstructures were examined by scanning electron microscopy, electron probe microanalysis, and X-ray diffraction. The results showed that transient liquid-phase present during bonding promoted the interracial reactions during bonding. Plenty of brittle chromium carbides, such as (Cr, Fe)7C3 and (Cr2.5Fe4.3Mo0.1)C3, were observed in 000Cr3OMo2/silicated graphite joints. Besides, transverse cracks were also found. In case of 4J33/silicated graphite system, well bonded joints free of defects Were obtained.展开更多
Angle deviations between the two substrates during transient liquid phase (TLP) bonding single crystal superalloys cannot be avoided. In the present work, specimens have been prepared to investigate the influences o...Angle deviations between the two substrates during transient liquid phase (TLP) bonding single crystal superalloys cannot be avoided. In the present work, specimens have been prepared to investigate the influences of the various substrate orientations. It is found that the width of the non-isothermal solidification zone (NSZ) is linear with the square root of the isothermal solidification time. This suggests that the isothermal solidification process is B-diffusion controlled in different substrate orientation deviations. And also the width of the NSZ increases with increasing angle deviation, indicating that the isothermal solidification time needed in the TLP bonding increases with increasing orientation deviation between the two substrates.展开更多
A new Ni–Cr–Si–B–Fe fi ller material is prepared for transient liquid-phase(TLP)bonding of Inconel 718 superalloy by mechanical alloying technique.The melting temperature range of the fi ller material and its acti...A new Ni–Cr–Si–B–Fe fi ller material is prepared for transient liquid-phase(TLP)bonding of Inconel 718 superalloy by mechanical alloying technique.The melting temperature range of the fi ller material and its activation energy of melting are determined by diff erential scanning calorimetry technique.The activation energy and melting temperature of the alloy powder decrease with increasing milling time.Inconel 718 alloy was joined via TLP by using the newly developed fi ller material.The eff ect of TLP bonding temperature and time on microstructural evolution and mechanical properties of the joint was investigated.Three distinct microstructural regions were observed in the bonding area:isothermal solidifi cation zone consisting of a single-phase solid solution,diff usion aff ected zone consisting of extensive diff usion-induced precipitates of metallic boride,and unaff ected base material.The ultimate shear strength and microhardness of the TLP-bonded joint increase with bonding time and temperature.展开更多
文摘The interfacial reactions in partial transient liquid-phase bonding of Si3N4 ceramics with Ti/Ni/Ti interlayers were studied by means of scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and X-ray diffractometry (XRD). It was shown that the interfacial structure of Si3N4/TiN/Ti5Si3+Ti5Si4 + Ni3Si/ (NiTi ) /Ni3Ti/ Ni was formed after bonding. The activation energies for TiN layer and the mixed reaction layer of Ti5Si3 + Ti5Si4 + Ni3Si are 546. 8 kJ/mol and 543. 9 kJ/mol, respectively. The formation and transition processes of interface layer sequence in the joint were clarified by diffusion path. An important characteristic, which is different from the conventional brazing and soid-state diffusion bonding, has been found, i. e., during the partial transient liquid-phase bonding, not only the reaction layers which have formed grow, but also the diffusion path in the subsequent reaction changes because of the remarkable variation of the concentration on the metal side.
基金Funded by the National Natural Science Foundation of China (No.50074017/E0408)
文摘Effects of the main process parameters(temperature and time) on microstructure and properties of Ti(C, N)/Ni interface bonded by (Cu+Nb) interlayer in a vacuum diffusion bonding device were investigated. The interfacial microstructures consisted initially of Ni3Nb metallic compound and eutectic of Ni3Nb + CuNiss, and finally transformed to (Ti, Nb) (C, N)+Ni3Nb near Ti (C, N) and NiCuss + Ni3Nb near Ni when diffusion bonding temperature was 1 523-1 573 K. It was clear that Cu was a constituent in the transient liquid phase (TLP) into which Ni was dissolved by forming Cu-Ni transition liquid. Nb was dissolved in Cu-Ni transition liquid rapidly. Ti (C, N) conld be wetted by resultant Ni-Nb-Cu transient liquid phase which was followed by a little (Ti, Nb) (C, N) solid solution formed at interface. This increased the interface combining capability. Ultimately the interface shear strength was able to reach 140 MPa. The theoretle analysis and experimental results show that the growth of interfacial reaction layer Ni3Nb accords with parabola law, and the activation energy of diffusion reaction is 115.0±0.5 kJ/mol, while the diffusion reaction speed constant is 12.53 mm/s^1/2.
基金The work was financially supported by the National Natural Science Foundation of China under grant Nos. 50275076 and 50075039.
文摘The compact oxide on the surface of SiCp/Al metal matrix composite (SiCp/Al MMC) greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase (TLP) bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy (SEM) was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.
文摘Partial transient liquid-phase bonding (PTLP bonding) of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure and joint strength was discussed. The joint interface structures are investigated by scanning electron microscope (SEM) and energy dispersion spectroscopy(EDS). The results show that the maximum joint strength of 210 MPa is obtained at room temperature in the experiments. When joining temperature and time are not changed and the process of isothermal solidification is sufficient , interface structure, reaction layer thickness and isothermal solidification thickness change with the thickness of Ti foil.
基金financially supported by the National Natural Science Foundation of China(Nos.51202193 and 51221001)the Fundamental Research Foundation of Northwestern Polytechnical University(No.GBKY1021)the‘‘111’’Project(No.08040)
文摘With the use of Ti/Ni/Cu/Ni multiple foils as interlayer,carbon/carbon(C/C) composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique.The effect of bonding temperature on the microstructures and strengths of the joints was investigated.The results showed that gradient structural multiple interlayers composed of ‘‘C–Ti reaction layer/Ti–Ni intermetallic compound layer/Ni–Cu sosoloid/residual Cu layer/Ni-GH3044 diffusion layer'' were formed between C/C composite and GH3044.The shear strength of the C/C composite/GH3044 joint reached the highest value of 26.1 MPa when the bonding temperature was 1,030 °C.In addition,the fracture morphology showed that the fracture mode changed with the increase of bonding temperature.
文摘TiAl has been joined employing the transient liquid phase (TLP) bonding with Ti combined with Cu, Ni or Fe foils. Experimental results showed that though the interface structures of the joints are quite different, all the joined zones are composed of five sublayers, i.e. two diffusion zones, two interfacial zones and an interlayer. It has been convinced that the formation process of the transient liquid phase controls the diffusion behavior of melting point depressant (MPD) Cu, Ni, and Fe atoms, which leads to form different interface structures of the joints.
基金financially supported by the National Basic Research Program China(Nos.2010CB631200 and 2010CB631206)the National Natural Science Foundation of China(Nos.50971124,50904059,51071165,U1037601 and 51204156)
文摘A kind of Ni-Cr-Fe-B-Si system amorphous alloy was used as interlayer in transient liquid-phase bonding(TLP bonding)of polycrystalline superalloy K465.The bonding behavior,microstructure feature and the tensile properties of the joints were investigated.There are B-rich phase and Si-rich phase formed in the center of the seam after bonding at 1210℃for 30 min.The isothermal solidification is complete after bonding at 1210℃for 4 h.The relationship of the average width of the remnant eutectic zone and bonding time at 1210℃is nonlinear.The tensile strength of the bonded joint at room temperature and 900℃is comparable to that of K465 alloy.
文摘Commercially available 000Cr3OMo2 ferritic stainless steel and 4J33 ferromagnetic expansion alloy were di- rectly bonded to silicated graphite at 1180-1200℃ and 1100-1150℃, respectively, Intedacial microstructures were examined by scanning electron microscopy, electron probe microanalysis, and X-ray diffraction. The results showed that transient liquid-phase present during bonding promoted the interracial reactions during bonding. Plenty of brittle chromium carbides, such as (Cr, Fe)7C3 and (Cr2.5Fe4.3Mo0.1)C3, were observed in 000Cr3OMo2/silicated graphite joints. Besides, transverse cracks were also found. In case of 4J33/silicated graphite system, well bonded joints free of defects Were obtained.
基金financially supported by the National Basic Research Program (973 Program) of China under Grant Nos. 2010CB631200 and 2010CB631206the National Natural Science Foundation of China (NSFC) under Grant Nos. 50971124, 50904059, 51071165 and 51204156
文摘Angle deviations between the two substrates during transient liquid phase (TLP) bonding single crystal superalloys cannot be avoided. In the present work, specimens have been prepared to investigate the influences of the various substrate orientations. It is found that the width of the non-isothermal solidification zone (NSZ) is linear with the square root of the isothermal solidification time. This suggests that the isothermal solidification process is B-diffusion controlled in different substrate orientation deviations. And also the width of the NSZ increases with increasing angle deviation, indicating that the isothermal solidification time needed in the TLP bonding increases with increasing orientation deviation between the two substrates.
基金financially supported by the Department of Mechanical engineering and Central Instruments Facility of Indian Institute of Technology Guwahati,India-781039。
文摘A new Ni–Cr–Si–B–Fe fi ller material is prepared for transient liquid-phase(TLP)bonding of Inconel 718 superalloy by mechanical alloying technique.The melting temperature range of the fi ller material and its activation energy of melting are determined by diff erential scanning calorimetry technique.The activation energy and melting temperature of the alloy powder decrease with increasing milling time.Inconel 718 alloy was joined via TLP by using the newly developed fi ller material.The eff ect of TLP bonding temperature and time on microstructural evolution and mechanical properties of the joint was investigated.Three distinct microstructural regions were observed in the bonding area:isothermal solidifi cation zone consisting of a single-phase solid solution,diff usion aff ected zone consisting of extensive diff usion-induced precipitates of metallic boride,and unaff ected base material.The ultimate shear strength and microhardness of the TLP-bonded joint increase with bonding time and temperature.