The interfacial reactions in partial transient liquid-phase bonding of Si3N4 ceramics with Ti/Ni/Ti interlayers were studied by means of scanning electron microscopy （SEM）, energy dispersive spectrometry （EDS） and...The interfacial reactions in partial transient liquid-phase bonding of Si3N4 ceramics with Ti/Ni/Ti interlayers were studied by means of scanning electron microscopy （SEM）, energy dispersive spectrometry （EDS） and X-ray diffractometry （XRD）. It was shown that the interfacial structure of Si3N4/TiN/Ti5Si3+Ti5Si4 + Ni3Si/ （NiTi ） /Ni3Ti/ Ni was formed after bonding. The activation energies for TiN layer and the mixed reaction layer of Ti5Si3 + Ti5Si4 + Ni3Si are 546. 8 kJ/mol and 543. 9 kJ/mol, respectively. The formation and transition processes of interface layer sequence in the joint were clarified by diffusion path. An important characteristic, which is different from the conventional brazing and soid-state diffusion bonding, has been found, i. e., during the partial transient liquid-phase bonding, not only the reaction layers which have formed grow, but also the diffusion path in the subsequent reaction changes because of the remarkable variation of the concentration on the metal side.展开更多
Effects of the main process parameters（temperature and time） on microstructure and properties of Ti（C, N）/Ni interface bonded by （Cu＋Nb） interlayer in a vacuum diffusion bonding device were investigated. The in...Effects of the main process parameters（temperature and time） on microstructure and properties of Ti（C, N）/Ni interface bonded by （Cu＋Nb） interlayer in a vacuum diffusion bonding device were investigated. The interfacial microstructures consisted initially of Ni3Nb metallic compound and eutectic of Ni3Nb ＋ CuNiss, and finally transformed to （Ti, Nb） （C, N）＋Ni3Nb near Ti （C, N） and NiCuss ＋ Ni3Nb near Ni when diffusion bonding temperature was 1 523-1 573 K. It was clear that Cu was a constituent in the transient liquid phase （TLP） into which Ni was dissolved by forming Cu-Ni transition liquid. Nb was dissolved in Cu-Ni transition liquid rapidly. Ti （C, N） conld be wetted by resultant Ni-Nb-Cu transient liquid phase which was followed by a little （Ti, Nb） （C, N） solid solution formed at interface. This increased the interface combining capability. Ultimately the interface shear strength was able to reach 140 MPa. The theoretle analysis and experimental results show that the growth of interfacial reaction layer Ni3Nb accords with parabola law, and the activation energy of diffusion reaction is 115.0±0.5 kJ/mol, while the diffusion reaction speed constant is 12.53 mm/s^1/2.展开更多
In this study, a two-step heating process is introduced for transient liquid phase （ TLP） diffusion bonding fo r sound joints with T91 heat resistant steels. At first, a short-time higher temperature heatin...In this study, a two-step heating process is introduced for transient liquid phase （ TLP） diffusion bonding fo r sound joints with T91 heat resistant steels. At first, a short-time higher temperature heating step is addressed to melt the interlayer, followed by the second step to complete isothermal solidification at a low temperature. The most critical feature of our new method is producing a non-planar interface at the T9／ heat resistant steels joint. We propose a transitional liquid phase bonding of T91 heat resistant steels by this approach. Since joint microstructures have been studied, we tested the tensile strength to assess joint mechanical property. The result indicates that the solidified bond may contain a primary solid-solution, similar composition to the parent metal and free from precipitates. Joint tensile strength of the joint is not lower than parent materials. Joint bend＇s strengths are enhanced due to the higher metal-to-metal junction producing a non-planar bond lines. Nevertheless, the traditional transient liquid phase diffusion bonding produces planar ones. Bonding parameters of new process are 1 260 °C for 0. 5 min and 1 230 °C fo r 4 min.展开更多
A new technology, the two-step transient liquid phase diffusion bonding （TLP-DB） technology for cobalt-based K640 superalloy, was investigated. The method consists of a short-time high temperature heating to melt in...A new technology, the two-step transient liquid phase diffusion bonding （TLP-DB） technology for cobalt-based K640 superalloy, was investigated. The method consists of a short-time high temperature heating to melt interlayer followed by isothermal solidification of liquid phase at a lower temperature than that of the conventional TLP-DB. The result indicates that the two-step TLP-DB can reliably produce an ideal joint with uniform chemical composition, which is superior to the joint welded by conventional TLP-DB in microstructure and mechanical properties. Bonding parameters of new process are 1 250℃ for 0. 5 h and 1 180℃ for 3 h. The high-temperature tensile strength of the joint by two-step TLP-DB reaches 74% of that of the base material on an equal basis, but the high-temperature tensile strength of the joint by conventional TLP-DB is only 58% of that of the base material.展开更多
Microstructure of transient liquid phase( TLP) diffusion bonded a third generation single crystal superalloy joint was investigated using scanning electron microscopy( SEM),and mechanical properties test of joint was ...Microstructure of transient liquid phase( TLP) diffusion bonded a third generation single crystal superalloy joint was investigated using scanning electron microscopy( SEM),and mechanical properties test of joint was carried out,for obtaining relationship between microstructure and mechanical properties of joint. The results showed that the joint contained bonding zone and base metal. The diffusion zone was obviously observed. When it was not finished for isothermal solidification process,the bonding zone would contain isothermal solidification zone and rapid solidification zone. Metallographic examination revealed that isothermal solidification zone was consisted of γ and γ' phase. Rapid solidification zone was consisted of two different structures,which were ternary eutectic of borides,γ and γ' phase developing at the edge of joint,binary eutectic of γ and γ' phase appearing in the portion of joint. When it was not enough for homogenization process under the condition of finishing isothermal solidification process,the bonding zone would contain isothermal solidification zone and borides at the interface. Under the conditions of relatively high welding temperature and long welding time,average tensile strength of joint was equivalent to that of parent material.展开更多
The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface...The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase （TLP） bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy （SEM） was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.展开更多
Partial transient liquid-phase bonding （PTLP bonding） of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure an...Partial transient liquid-phase bonding （PTLP bonding） of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure and joint strength was discussed. The joint interface structures are investigated by scanning electron microscope （SEM） and energy dispersion spectroscopy（EDS）. The results show that the maximum joint strength of 210 MPa is obtained at room temperature in the experiments. When joining temperature and time are not changed and the process of isothermal solidification is sufficient , interface structure, reaction layer thickness and isothermal solidification thickness change with the thickness of Ti foil.展开更多
Within the bonded interface of metal bars joint produced by conventional solid state bonding process （ such as flash welding, resistance butt welding, friction welding and so on）, the inclusions are often present, w...Within the bonded interface of metal bars joint produced by conventional solid state bonding process （ such as flash welding, resistance butt welding, friction welding and so on）, the inclusions are often present, which degrade the ductility of joint. A new process of transformation-diffusion brazing is proposed, in which an amorphous foil containing melting point depressant is preplaced between the interfaces to be joined, and the assembly is repeatedly heated/cooled without holding time at peak temperature. A low carbon steel bars, BNi-2 amorphous foil and resistance butt welding machine were used. The results show that surfuce contamination can be disrupted by the dissolution of base metal into molten interlayer in comparison with conventional process, and the ductility of joint can be improved by increasing the times of temperature cycles on line. In addition, transformation-diffusion brazing can be done with relatively simple and inexpensive system in comparison with transient liquid phase bonding.展开更多
One of the challenges for bimetal manufacturing is the joining process.Hence,transient liquid phase(TLP)bonding was performed between 304L stainless steel and Cp-Ti using an Ag-Cu interlayer with a thickness of 75μm ...One of the challenges for bimetal manufacturing is the joining process.Hence,transient liquid phase(TLP)bonding was performed between 304L stainless steel and Cp-Ti using an Ag-Cu interlayer with a thickness of 75μm for bonding time of 20,40,60,and 90 min.The bonding temperature of 860℃ was considered,which is under the β transus temperature of Cp-Ti.During TLP bonding,various intermetallic compounds(IMCs),including Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe),Ti_(2)(Cu,Ag),and Ti_(2)Cu from 304L toward Cp-Ti formed in the joint.Also,on the one side,with the increase in time,further diffusion of elements decreases the blocky IMCs such as Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe)in the 304L diffusion-affected zone(DAZ)and reaction zone,and on the other side,Ti_(2)(Cu,Ag)IMC transformed into fine morphology toward Cp-Ti DAZ.The microhardness test also demonstrated that the(Cr,Fe)_(2)Ti+Ti_(5)Cr_(7)Fe_(17) IMCs in the DAZ on the side of 304L have a hardness value of HV 564,making it the hardest phase.The maximum and minimum shear strength values are equal to 78.84 and 29.0 MPa,respectively.The cleavage pattern dominated fracture surfaces due to the formation of brittle phases in dissimilar joints.展开更多
A kind of Ni-Cr-Fe-B-Si system amorphous alloy was used as interlayer in transient liquid-phase bonding(TLP bonding)of polycrystalline superalloy K465.The bonding behavior,microstructure feature and the tensile proper...A kind of Ni-Cr-Fe-B-Si system amorphous alloy was used as interlayer in transient liquid-phase bonding(TLP bonding)of polycrystalline superalloy K465.The bonding behavior,microstructure feature and the tensile properties of the joints were investigated.There are B-rich phase and Si-rich phase formed in the center of the seam after bonding at 1210℃for 30 min.The isothermal solidification is complete after bonding at 1210℃for 4 h.The relationship of the average width of the remnant eutectic zone and bonding time at 1210℃is nonlinear.The tensile strength of the bonded joint at room temperature and 900℃is comparable to that of K465 alloy.展开更多
With the use of Ti/Ni/Cu/Ni multiple foils as interlayer,carbon/carbon（C/C） composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique.The effect of bonding temperature on ...With the use of Ti/Ni/Cu/Ni multiple foils as interlayer,carbon/carbon（C/C） composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique.The effect of bonding temperature on the microstructures and strengths of the joints was investigated.The results showed that gradient structural multiple interlayers composed of ‘‘C–Ti reaction layer/Ti–Ni intermetallic compound layer/Ni–Cu sosoloid/residual Cu layer/Ni-GH3044 diffusion layer＇＇ were formed between C/C composite and GH3044.The shear strength of the C/C composite/GH3044 joint reached the highest value of 26.1 MPa when the bonding temperature was 1,030 °C.In addition,the fracture morphology showed that the fracture mode changed with the increase of bonding temperature.展开更多
Commercially available 000Cr3OMo2 ferritic stainless steel and 4J33 ferromagnetic expansion alloy were di- rectly bonded to silicated graphite at 1180-1200℃ and 1100-1150℃, respectively, Intedacial microstructures w...Commercially available 000Cr3OMo2 ferritic stainless steel and 4J33 ferromagnetic expansion alloy were di- rectly bonded to silicated graphite at 1180-1200℃ and 1100-1150℃, respectively, Intedacial microstructures were examined by scanning electron microscopy, electron probe microanalysis, and X-ray diffraction. The results showed that transient liquid-phase present during bonding promoted the interracial reactions during bonding. Plenty of brittle chromium carbides, such as （Cr, Fe）7C3 and （Cr2.5Fe4.3Mo0.1）C3, were observed in 000Cr3OMo2/silicated graphite joints. Besides, transverse cracks were also found. In case of 4J33/silicated graphite system, well bonded joints free of defects Were obtained.展开更多
文摘The interfacial reactions in partial transient liquid-phase bonding of Si3N4 ceramics with Ti/Ni/Ti interlayers were studied by means of scanning electron microscopy （SEM）, energy dispersive spectrometry （EDS） and X-ray diffractometry （XRD）. It was shown that the interfacial structure of Si3N4/TiN/Ti5Si3+Ti5Si4 + Ni3Si/ （NiTi ） /Ni3Ti/ Ni was formed after bonding. The activation energies for TiN layer and the mixed reaction layer of Ti5Si3 + Ti5Si4 + Ni3Si are 546. 8 kJ/mol and 543. 9 kJ/mol, respectively. The formation and transition processes of interface layer sequence in the joint were clarified by diffusion path. An important characteristic, which is different from the conventional brazing and soid-state diffusion bonding, has been found, i. e., during the partial transient liquid-phase bonding, not only the reaction layers which have formed grow, but also the diffusion path in the subsequent reaction changes because of the remarkable variation of the concentration on the metal side.
基金Funded by the National Natural Science Foundation of China (No.50074017/E0408)
文摘Effects of the main process parameters（temperature and time） on microstructure and properties of Ti（C, N）/Ni interface bonded by （Cu＋Nb） interlayer in a vacuum diffusion bonding device were investigated. The interfacial microstructures consisted initially of Ni3Nb metallic compound and eutectic of Ni3Nb ＋ CuNiss, and finally transformed to （Ti, Nb） （C, N）＋Ni3Nb near Ti （C, N） and NiCuss ＋ Ni3Nb near Ni when diffusion bonding temperature was 1 523-1 573 K. It was clear that Cu was a constituent in the transient liquid phase （TLP） into which Ni was dissolved by forming Cu-Ni transition liquid. Nb was dissolved in Cu-Ni transition liquid rapidly. Ti （C, N） conld be wetted by resultant Ni-Nb-Cu transient liquid phase which was followed by a little （Ti, Nb） （C, N） solid solution formed at interface. This increased the interface combining capability. Ultimately the interface shear strength was able to reach 140 MPa. The theoretle analysis and experimental results show that the growth of interfacial reaction layer Ni3Nb accords with parabola law, and the activation energy of diffusion reaction is 115.0±0.5 kJ/mol, while the diffusion reaction speed constant is 12.53 mm/s^1/2.
基金supported by the Natural Science Foundation of Henan Province(Grant No.152107000047)
文摘In this study, a two-step heating process is introduced for transient liquid phase （ TLP） diffusion bonding fo r sound joints with T91 heat resistant steels. At first, a short-time higher temperature heating step is addressed to melt the interlayer, followed by the second step to complete isothermal solidification at a low temperature. The most critical feature of our new method is producing a non-planar interface at the T9／ heat resistant steels joint. We propose a transitional liquid phase bonding of T91 heat resistant steels by this approach. Since joint microstructures have been studied, we tested the tensile strength to assess joint mechanical property. The result indicates that the solidified bond may contain a primary solid-solution, similar composition to the parent metal and free from precipitates. Joint tensile strength of the joint is not lower than parent materials. Joint bend＇s strengths are enhanced due to the higher metal-to-metal junction producing a non-planar bond lines. Nevertheless, the traditional transient liquid phase diffusion bonding produces planar ones. Bonding parameters of new process are 1 260 °C for 0. 5 min and 1 230 °C fo r 4 min.
文摘A new technology, the two-step transient liquid phase diffusion bonding （TLP-DB） technology for cobalt-based K640 superalloy, was investigated. The method consists of a short-time high temperature heating to melt interlayer followed by isothermal solidification of liquid phase at a lower temperature than that of the conventional TLP-DB. The result indicates that the two-step TLP-DB can reliably produce an ideal joint with uniform chemical composition, which is superior to the joint welded by conventional TLP-DB in microstructure and mechanical properties. Bonding parameters of new process are 1 250℃ for 0. 5 h and 1 180℃ for 3 h. The high-temperature tensile strength of the joint by two-step TLP-DB reaches 74% of that of the base material on an equal basis, but the high-temperature tensile strength of the joint by conventional TLP-DB is only 58% of that of the base material.
文摘Microstructure of transient liquid phase( TLP) diffusion bonded a third generation single crystal superalloy joint was investigated using scanning electron microscopy( SEM),and mechanical properties test of joint was carried out,for obtaining relationship between microstructure and mechanical properties of joint. The results showed that the joint contained bonding zone and base metal. The diffusion zone was obviously observed. When it was not finished for isothermal solidification process,the bonding zone would contain isothermal solidification zone and rapid solidification zone. Metallographic examination revealed that isothermal solidification zone was consisted of γ and γ' phase. Rapid solidification zone was consisted of two different structures,which were ternary eutectic of borides,γ and γ' phase developing at the edge of joint,binary eutectic of γ and γ' phase appearing in the portion of joint. When it was not enough for homogenization process under the condition of finishing isothermal solidification process,the bonding zone would contain isothermal solidification zone and borides at the interface. Under the conditions of relatively high welding temperature and long welding time,average tensile strength of joint was equivalent to that of parent material.
基金The work was financially supported by the National Natural Science Foundation of China under grant Nos. 50275076 and 50075039.
文摘The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase （TLP） bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy （SEM） was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.
文摘Partial transient liquid-phase bonding （PTLP bonding） of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure and joint strength was discussed. The joint interface structures are investigated by scanning electron microscope （SEM） and energy dispersion spectroscopy（EDS）. The results show that the maximum joint strength of 210 MPa is obtained at room temperature in the experiments. When joining temperature and time are not changed and the process of isothermal solidification is sufficient , interface structure, reaction layer thickness and isothermal solidification thickness change with the thickness of Ti foil.
文摘Within the bonded interface of metal bars joint produced by conventional solid state bonding process （ such as flash welding, resistance butt welding, friction welding and so on）, the inclusions are often present, which degrade the ductility of joint. A new process of transformation-diffusion brazing is proposed, in which an amorphous foil containing melting point depressant is preplaced between the interfaces to be joined, and the assembly is repeatedly heated/cooled without holding time at peak temperature. A low carbon steel bars, BNi-2 amorphous foil and resistance butt welding machine were used. The results show that surfuce contamination can be disrupted by the dissolution of base metal into molten interlayer in comparison with conventional process, and the ductility of joint can be improved by increasing the times of temperature cycles on line. In addition, transformation-diffusion brazing can be done with relatively simple and inexpensive system in comparison with transient liquid phase bonding.
文摘One of the challenges for bimetal manufacturing is the joining process.Hence,transient liquid phase(TLP)bonding was performed between 304L stainless steel and Cp-Ti using an Ag-Cu interlayer with a thickness of 75μm for bonding time of 20,40,60,and 90 min.The bonding temperature of 860℃ was considered,which is under the β transus temperature of Cp-Ti.During TLP bonding,various intermetallic compounds(IMCs),including Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe),Ti_(2)(Cu,Ag),and Ti_(2)Cu from 304L toward Cp-Ti formed in the joint.Also,on the one side,with the increase in time,further diffusion of elements decreases the blocky IMCs such as Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe)in the 304L diffusion-affected zone(DAZ)and reaction zone,and on the other side,Ti_(2)(Cu,Ag)IMC transformed into fine morphology toward Cp-Ti DAZ.The microhardness test also demonstrated that the(Cr,Fe)_(2)Ti+Ti_(5)Cr_(7)Fe_(17) IMCs in the DAZ on the side of 304L have a hardness value of HV 564,making it the hardest phase.The maximum and minimum shear strength values are equal to 78.84 and 29.0 MPa,respectively.The cleavage pattern dominated fracture surfaces due to the formation of brittle phases in dissimilar joints.
基金financially supported by the National Basic Research Program China(Nos.2010CB631200 and 2010CB631206)the National Natural Science Foundation of China(Nos.50971124,50904059,51071165,U1037601 and 51204156)
文摘A kind of Ni-Cr-Fe-B-Si system amorphous alloy was used as interlayer in transient liquid-phase bonding(TLP bonding)of polycrystalline superalloy K465.The bonding behavior,microstructure feature and the tensile properties of the joints were investigated.There are B-rich phase and Si-rich phase formed in the center of the seam after bonding at 1210℃for 30 min.The isothermal solidification is complete after bonding at 1210℃for 4 h.The relationship of the average width of the remnant eutectic zone and bonding time at 1210℃is nonlinear.The tensile strength of the bonded joint at room temperature and 900℃is comparable to that of K465 alloy.
基金financially supported by the National Natural Science Foundation of China(Nos.51202193 and 51221001)the Fundamental Research Foundation of Northwestern Polytechnical University(No.GBKY1021)the‘‘111’’Project(No.08040)
文摘With the use of Ti/Ni/Cu/Ni multiple foils as interlayer,carbon/carbon（C/C） composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique.The effect of bonding temperature on the microstructures and strengths of the joints was investigated.The results showed that gradient structural multiple interlayers composed of ‘‘C–Ti reaction layer/Ti–Ni intermetallic compound layer/Ni–Cu sosoloid/residual Cu layer/Ni-GH3044 diffusion layer＇＇ were formed between C/C composite and GH3044.The shear strength of the C/C composite/GH3044 joint reached the highest value of 26.1 MPa when the bonding temperature was 1,030 °C.In addition,the fracture morphology showed that the fracture mode changed with the increase of bonding temperature.
文摘Commercially available 000Cr3OMo2 ferritic stainless steel and 4J33 ferromagnetic expansion alloy were di- rectly bonded to silicated graphite at 1180-1200℃ and 1100-1150℃, respectively, Intedacial microstructures were examined by scanning electron microscopy, electron probe microanalysis, and X-ray diffraction. The results showed that transient liquid-phase present during bonding promoted the interracial reactions during bonding. Plenty of brittle chromium carbides, such as （Cr, Fe）7C3 and （Cr2.5Fe4.3Mo0.1）C3, were observed in 000Cr3OMo2/silicated graphite joints. Besides, transverse cracks were also found. In case of 4J33/silicated graphite system, well bonded joints free of defects Were obtained.
