The formation process, microstructure and mechanical properties of transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joint with copper interlayer were investigated. The formation process...The formation process, microstructure and mechanical properties of transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joint with copper interlayer were investigated. The formation process of the TLP joint comprises a number of stages: plastic deformation and solid diffusion (stage 1), dissolution of interlayer and base metal (stage 2), isothermal solidification (stage 3) and homogenization (stage 4). The microstructure of the joint depends on the joint formation process (distinct stages). The plastic deformation and solid diffusion in stage 1 favoure the intimate contact at interfaces and liquid layer formation. The microstructure of joint consists of aluminium solid solution, alumina particle, Al 2Cu and MgAl 2O 4 compounds in stage 2. The most pronounced feature of joint microstructure in stage 3 is the alumina particle segregation in the center of the joint. The increase of joint shear strength with increasing bonding temperature is mainly attributed to improving the fluidity and wettability of liquid phase and decreasing the amount of Al 2Cu brittle phase in the joint. The principal reason of higher bonding temperature (>600 ℃) resulting in lowering obviously the joint shear strength is the widening of alumina particle segregation region that acts as a preferential site for failure. The increase of joint shear strength with increasing holding time is mainly associated with decreasing the amount of Al 2Cu brittle phase and promoting homogenization of joint.展开更多
Transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joints can be classified into three distinct regions, i.e. the particulate segregation region, the denuded particulate region and the ...Transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joints can be classified into three distinct regions, i.e. the particulate segregation region, the denuded particulate region and the base material region. The microstructure of the particulate segregation region consists of alumina particulate and Al alloy matrix with the Al 2Cu and MgAl 2O 4. It contains more and smaller alumina particulates compared with the base material region. The TLP bonded joints have the tensile strength of 150 MPa ～200 MPa and the shear strength of 70 MPa ～100 MPa . With increasing tensile stress, cracks initiate in the particulate segregation region, especially in the particulate/particulate interface and the particulate/matrix interface, and propagate along particulate/matrix interface, througth thin matrix metal and by linking up the close cracks. The particulate segregation region is the weakest during tensile testing and shear testing due to obviously increased proportion of weak bonds (particulate particulate bond and particulate matrix bond).展开更多
Microstructures and mechanical properties of transient liquid phase （TLP） bonded magnesium metal matrix composite （ MMC） joints using copper interlayer have been investigated. With an increase of bonding times fro...Microstructures and mechanical properties of transient liquid phase （TLP） bonded magnesium metal matrix composite （ MMC） joints using copper interlayer have been investigated. With an increase of bonding times from 5 min to 50 min at bonding temperature of 510 ℃ , the average concentration of copper in the bonded zone decreased, the microstructure in the zone changed from Cu, α-Mg and CuMg2 to α-Mg, CuMg2 and TiC, and mechanical properties of the joint increased. The shear strength of the joint bonded at 510 ℃ for 50 min reached 64 MPa due to the metallurgical bonding of the joint and improving its homogeneity of composition and microstructure. It is favorable to increase the bonding time for improving mechanical properties of TLP bonded magnesium MMC joint.展开更多
Based on the situation of welding thermal conduction and thermo-elasto-platicity research, this paper explores some problems in this field. First, the boundary element method for nonlinear problems is improved by line...Based on the situation of welding thermal conduction and thermo-elasto-platicity research, this paper explores some problems in this field. First, the boundary element method for nonlinear problems is improved by linearization of nonlinear problems and used in welding thermal conduction analysis. Second, the thermo-elasto-plastic finite element method is used for the welding stress calculation, in which the phase transformation is considered by the 'equivalent linear expansion coefficient method'. The comparison of the calculated results with experimental data shows that the methods provided in this paper are available.展开更多
To improve the mechanical properties of the parts fabricated by Laser Direct Metal Shaping(LDMS),it is of great significance to understand the distribution regularities of transient temperature field during LDMS proce...To improve the mechanical properties of the parts fabricated by Laser Direct Metal Shaping(LDMS),it is of great significance to understand the distribution regularities of transient temperature field during LDMS process.Based on the“el- ement birth and death”technique of finite element method,a three-dimensional multi-track and multi-layer model for the transient temperature field analysis of LDMS is developed by ANSYS Parametric Design Language(APDL)for the first time.In the fab- ricated modal,X-direction parallel reciprocating scanning paths is introduced.Using the same process parameters,the simulation results show good agreement with the microstructure features of samples which fabricated by LDMS.展开更多
To improve the wettability of common fiUer metals on Al metal matrix composites （ AI-MMCs ） , three kinds of active ternary filler metals, Al-Si-Ti, Zn-Al-Ti and Cu-Al-Ti systems, were prepared by the addition of Ti...To improve the wettability of common fiUer metals on Al metal matrix composites （ AI-MMCs ） , three kinds of active ternary filler metals, Al-Si-Ti, Zn-Al-Ti and Cu-Al-Ti systems, were prepared by the addition of Ti. Excessive melting temperature made the gravity segregation of Ti remarkable in ingot. The effect of Ti content on the melting point for AI-Si-Ti ternary system was not as sensitive as that for Al-Ti binary system. The Al-12Si-1Ti filler metal showed good ability to form brazing foil during rapid cooling, ductile fracture surface and similar shear strength to conventional Al-12Si filler metal. Moreover, the Al2 03 reinforcements on initial surface could be covered by the Al-12Si-1Ti filler metal without interfacial gaps after sessile drop test. For Zn-9.5Al-0. 5 Ti braze alloy, severe vaporization of Zn and severe segregation of Ti Occurred. During wettability test for traditional Al-12Si and Zn-9.5Al-0. 5Ti, although some Si or Zn could penetrate into the composite, interfacial gap still remained. The prepared Cu-19Al-1 Ti interlayer consisted of primary phase of Al4Cu9 and network Cu-Al-Ti ternary intermetaUic compound, showing poor ability to form foil and very brittle nature. These results demonstrated that Al-Si-Ti system should be promising for Al-MMCs.展开更多
Within the bonded interface of metal bars joint produced by conventional solid state bonding process （ such as flash welding, resistance butt welding, friction welding and so on）, the inclusions are often present, w...Within the bonded interface of metal bars joint produced by conventional solid state bonding process （ such as flash welding, resistance butt welding, friction welding and so on）, the inclusions are often present, which degrade the ductility of joint. A new process of transformation-diffusion brazing is proposed, in which an amorphous foil containing melting point depressant is preplaced between the interfaces to be joined, and the assembly is repeatedly heated/cooled without holding time at peak temperature. A low carbon steel bars, BNi-2 amorphous foil and resistance butt welding machine were used. The results show that surfuce contamination can be disrupted by the dissolution of base metal into molten interlayer in comparison with conventional process, and the ductility of joint can be improved by increasing the times of temperature cycles on line. In addition, transformation-diffusion brazing can be done with relatively simple and inexpensive system in comparison with transient liquid phase bonding.展开更多
Miniaturization of electronic package leads to high heat density and heat accumulation in electronics device, resulting in short life time and premature failure of the device. Junction temperature and thermal resistan...Miniaturization of electronic package leads to high heat density and heat accumulation in electronics device, resulting in short life time and premature failure of the device. Junction temperature and thermal resistance are the critical parameters that determine the thermal management and reliability in electronics cooling. Metal oxide field effect transistor（MOSFET）is an important semiconductor device for light emitting diode-integrated circuit（LED IC） driver application, and thermal management in MOSFET is a major challenge. In this study, investigations on thermal performance of MOSFET are performed for evaluating the junction temperature and thermal resistance. Suitable modifications in FR4 substrates are proposed by introducing thermal vias and copper layer coating to improve the thermal performance of MOSFET. Experiments are conducted using thermal transient tester（T3ster） at 2.0 A input current and ambient temperature varying from25℃ to 75℃. The thermal parameters are measured for three proposed designs： FR4 with circular thermal vias, FR4 with single strip of copper layer and embedded vias, and FR4 with I-shaped copper layer, and compared with that of plain FR4 substrate. From the experimental results, FR4I-shaped shows promising results by 33.71% reduction in junction temperature and 54.19% reduction in thermal resistance. For elevated temperature, the relative increases in junction temperature and thermal resistance are lower for FR4I-shaped than those for other substrates considered. The introduction of thermal vias and copper layer plays a significant role in thermal performance.展开更多
在评估和优化半导体器件开关瞬态特性领域,解析模型因具有简单、直观、应用便捷等优点得到广泛研究。相较同等功率等级的硅基功率器件,碳化硅(silicon carbide,SiC)金属氧化物半导体场效应晶体管(metal-oxide-semiconductor field effec...在评估和优化半导体器件开关瞬态特性领域,解析模型因具有简单、直观、应用便捷等优点得到广泛研究。相较同等功率等级的硅基功率器件,碳化硅(silicon carbide,SiC)金属氧化物半导体场效应晶体管(metal-oxide-semiconductor field effect transistor,MOSFET)可以应用于更高开关速度,其开关瞬态特性更为复杂,开关瞬态解析建模也更加困难。该文总结现有的针对SiC MOSFET与二极管换流对的开关瞬态解析建模方法,在建模过程中依次引入各种简化假设,按照简化程度由低到高的顺序,梳理解析建模的逐步简化过程。通过对比,评估各模型的优缺点以及适用场合,对其中准确性、实用性都较强的分段线性模型进行详细介绍;之后,对开关瞬态建模中关键参数的建模方法进行总结与评价;最后,指出现有SiC MOSFET开关瞬态解析模型中存在的问题,并对其未来发展给出建议。展开更多
文摘The formation process, microstructure and mechanical properties of transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joint with copper interlayer were investigated. The formation process of the TLP joint comprises a number of stages: plastic deformation and solid diffusion (stage 1), dissolution of interlayer and base metal (stage 2), isothermal solidification (stage 3) and homogenization (stage 4). The microstructure of the joint depends on the joint formation process (distinct stages). The plastic deformation and solid diffusion in stage 1 favoure the intimate contact at interfaces and liquid layer formation. The microstructure of joint consists of aluminium solid solution, alumina particle, Al 2Cu and MgAl 2O 4 compounds in stage 2. The most pronounced feature of joint microstructure in stage 3 is the alumina particle segregation in the center of the joint. The increase of joint shear strength with increasing bonding temperature is mainly attributed to improving the fluidity and wettability of liquid phase and decreasing the amount of Al 2Cu brittle phase in the joint. The principal reason of higher bonding temperature (>600 ℃) resulting in lowering obviously the joint shear strength is the widening of alumina particle segregation region that acts as a preferential site for failure. The increase of joint shear strength with increasing holding time is mainly associated with decreasing the amount of Al 2Cu brittle phase and promoting homogenization of joint.
文摘Transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joints can be classified into three distinct regions, i.e. the particulate segregation region, the denuded particulate region and the base material region. The microstructure of the particulate segregation region consists of alumina particulate and Al alloy matrix with the Al 2Cu and MgAl 2O 4. It contains more and smaller alumina particulates compared with the base material region. The TLP bonded joints have the tensile strength of 150 MPa ～200 MPa and the shear strength of 70 MPa ～100 MPa . With increasing tensile stress, cracks initiate in the particulate segregation region, especially in the particulate/particulate interface and the particulate/matrix interface, and propagate along particulate/matrix interface, througth thin matrix metal and by linking up the close cracks. The particulate segregation region is the weakest during tensile testing and shear testing due to obviously increased proportion of weak bonds (particulate particulate bond and particulate matrix bond).
文摘Microstructures and mechanical properties of transient liquid phase （TLP） bonded magnesium metal matrix composite （ MMC） joints using copper interlayer have been investigated. With an increase of bonding times from 5 min to 50 min at bonding temperature of 510 ℃ , the average concentration of copper in the bonded zone decreased, the microstructure in the zone changed from Cu, α-Mg and CuMg2 to α-Mg, CuMg2 and TiC, and mechanical properties of the joint increased. The shear strength of the joint bonded at 510 ℃ for 50 min reached 64 MPa due to the metallurgical bonding of the joint and improving its homogeneity of composition and microstructure. It is favorable to increase the bonding time for improving mechanical properties of TLP bonded magnesium MMC joint.
文摘Based on the situation of welding thermal conduction and thermo-elasto-platicity research, this paper explores some problems in this field. First, the boundary element method for nonlinear problems is improved by linearization of nonlinear problems and used in welding thermal conduction analysis. Second, the thermo-elasto-plastic finite element method is used for the welding stress calculation, in which the phase transformation is considered by the 'equivalent linear expansion coefficient method'. The comparison of the calculated results with experimental data shows that the methods provided in this paper are available.
文摘To improve the mechanical properties of the parts fabricated by Laser Direct Metal Shaping(LDMS),it is of great significance to understand the distribution regularities of transient temperature field during LDMS process.Based on the“el- ement birth and death”technique of finite element method,a three-dimensional multi-track and multi-layer model for the transient temperature field analysis of LDMS is developed by ANSYS Parametric Design Language(APDL)for the first time.In the fab- ricated modal,X-direction parallel reciprocating scanning paths is introduced.Using the same process parameters,the simulation results show good agreement with the microstructure features of samples which fabricated by LDMS.
基金The present research was sponsored by the National Natural Science Foundation of China （ No. 50875199）, and by State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, China.
文摘To improve the wettability of common fiUer metals on Al metal matrix composites （ AI-MMCs ） , three kinds of active ternary filler metals, Al-Si-Ti, Zn-Al-Ti and Cu-Al-Ti systems, were prepared by the addition of Ti. Excessive melting temperature made the gravity segregation of Ti remarkable in ingot. The effect of Ti content on the melting point for AI-Si-Ti ternary system was not as sensitive as that for Al-Ti binary system. The Al-12Si-1Ti filler metal showed good ability to form brazing foil during rapid cooling, ductile fracture surface and similar shear strength to conventional Al-12Si filler metal. Moreover, the Al2 03 reinforcements on initial surface could be covered by the Al-12Si-1Ti filler metal without interfacial gaps after sessile drop test. For Zn-9.5Al-0. 5 Ti braze alloy, severe vaporization of Zn and severe segregation of Ti Occurred. During wettability test for traditional Al-12Si and Zn-9.5Al-0. 5Ti, although some Si or Zn could penetrate into the composite, interfacial gap still remained. The prepared Cu-19Al-1 Ti interlayer consisted of primary phase of Al4Cu9 and network Cu-Al-Ti ternary intermetaUic compound, showing poor ability to form foil and very brittle nature. These results demonstrated that Al-Si-Ti system should be promising for Al-MMCs.
文摘Within the bonded interface of metal bars joint produced by conventional solid state bonding process （ such as flash welding, resistance butt welding, friction welding and so on）, the inclusions are often present, which degrade the ductility of joint. A new process of transformation-diffusion brazing is proposed, in which an amorphous foil containing melting point depressant is preplaced between the interfaces to be joined, and the assembly is repeatedly heated/cooled without holding time at peak temperature. A low carbon steel bars, BNi-2 amorphous foil and resistance butt welding machine were used. The results show that surfuce contamination can be disrupted by the dissolution of base metal into molten interlayer in comparison with conventional process, and the ductility of joint can be improved by increasing the times of temperature cycles on line. In addition, transformation-diffusion brazing can be done with relatively simple and inexpensive system in comparison with transient liquid phase bonding.
基金Project supported by the Collaborative Research in Engineering,Science&Technology(Grant No.P28C2-13)
文摘Miniaturization of electronic package leads to high heat density and heat accumulation in electronics device, resulting in short life time and premature failure of the device. Junction temperature and thermal resistance are the critical parameters that determine the thermal management and reliability in electronics cooling. Metal oxide field effect transistor（MOSFET）is an important semiconductor device for light emitting diode-integrated circuit（LED IC） driver application, and thermal management in MOSFET is a major challenge. In this study, investigations on thermal performance of MOSFET are performed for evaluating the junction temperature and thermal resistance. Suitable modifications in FR4 substrates are proposed by introducing thermal vias and copper layer coating to improve the thermal performance of MOSFET. Experiments are conducted using thermal transient tester（T3ster） at 2.0 A input current and ambient temperature varying from25℃ to 75℃. The thermal parameters are measured for three proposed designs： FR4 with circular thermal vias, FR4 with single strip of copper layer and embedded vias, and FR4 with I-shaped copper layer, and compared with that of plain FR4 substrate. From the experimental results, FR4I-shaped shows promising results by 33.71% reduction in junction temperature and 54.19% reduction in thermal resistance. For elevated temperature, the relative increases in junction temperature and thermal resistance are lower for FR4I-shaped than those for other substrates considered. The introduction of thermal vias and copper layer plays a significant role in thermal performance.
