Transient thermal behavior of radial fins of rectangular,triangular and hyperbolic profiles with temperature-dependent properties using DTM-FDM

This work focuses on transient thermal behavior of radial fins of rectangular,triangular and hyperbolic profiles with temperature-dependent properties.A hybrid numerical algorithm which combines differential transformation(DTM) and finite difference(FDM) methods is utilized to theoretically study the present problem.DTM and FDM are applied to the time and space domains of the problem,respectively.The accuracy of this method solution is checked against the numerical solution.Then,the effects of some applicable parameters were studied comparatively.Since a broad range of governing parameters are investigated,the results could be useful in a number of industrial and engineering applications.

Transient thermal analysis as measurement method for IC package structural integrity

Practices of IC package reliability testing are reviewed briefly, and the application of transient thermal analysis is examined in great depth. For the design of light sources based on light emitting diode （LED） efficient and accurate reliability testing is required to realize the potential lifetimes of 105 h. Transient thermal analysis is a standard method to determine the transient thermal impedance of semiconductor devices, e.g. power electronics and LEDs. The temperature of the semiconductor junctions is assessed by time-resolved measurement of their forward voltage （Vf）. The thermal path in the IC package is resolved by the transient technique in the time domain. This enables analyzing the structural integrity of the semiconductor package. However, to evaluate thermal resistance, one must also measure the dissipated energy of the device （i.e., the thermal load） and the k-factor. This is time consuming, and measurement errors reduce the accuracy. To overcome these limitations, an innovative approach, the relative thermal resistance method, was developed to reduce the measurement effort, increase accuracy and enable automatic data evaluation. This new way of evaluating data simplifies the thermal transient analysis by eliminating measurement of the k-factor and thermal load, i.e. measurement of the lumen flux for LEDs, by normalizing the transient Vf data. This is especially advantageous for reliability testing where changes in the thermal path, like cracks and delaminations, can be determined without measuring the k-factor and thermal load. Different failure modes can be separated in the time domain. The sensitivity of the method is demonstrated by its application to high- power white InGaN LEDs. For detailed analysis and identification of the failure mode of the LED packages, the transient signals are simulated by time-resolved finite element （FE） simulations. Using the new approach, the transient thermal analysis is enhanced to a powerful tool for reliability investigation of semiconductor packages in accelerated lifetime tests and for inline inspection. This enables automatic data analysis of the transient thermal data required for processing a large amount of data in production and reliability testing. Based on the method, the integrity of LED packages can be tested by inline, outgoing inspection and the lifetime prediction of the products is improved.

COUPLED THERMAL/MECHANICAL ANALYSIS FOR THE FRACTURE OF FUNCTIONALLY GRADED MATERIALS UNDER TRANSIENT THERMAL LOADING

A comprehensive treatment of fracture of functionally gradedmaterials (FGMs) is provided. It is assumed that the materialproperties depend only on the coordinate perpendicular to the cracksurface And vary continuously along the crack faces. By using alaminated composite plate model to simulate the ma- Terialnon-homogeneity, an algorithm for solving the system based on Laplacetransform and Fourier transform Techniques is presented. Unlikeearlier studies that considered certain assumed propertydistributions and a Single crack problem, the current investigationstudies multiple crack problem in the FGMs with arbitrarily Varyingmaterial properties. Transient thermal stresses are presented.

基于Transient Thermal的回流焊温度曲线仿真技术研究

回流焊工艺是表面组装技术SMT的重要一环,决定了电子器件焊接的质量与速度。作为回流焊工艺重要环节,回流焊温度曲线直接影响PCB板的质量。本文针对某回焊炉,通过热传导模型求解出稳定工作时炉内温度曲线,建立了基于Transient Thermal的回流焊温度曲线仿真模型,优化包括温区温度设定以及传送带速度的因素。根据得到的仿真实验数据,通过逐步回归,分析出制程界限与各因素的关系,在制程界限下通过仿真建模,求解出最优的回流温度曲线。最后求出传送带速度为82.44 cm/s,五大温区温度设置分别为165℃、185℃、225℃、265℃、25℃,进一步优化了回流焊温度曲线。对比传统的反复实验调整,基于Transient Thermal的仿真建模方法可以在更高效率下得到更精确地优化控制。该方法能以其高效率与低能耗的优势,更好为回焊炉参数设置提供决策支持。

Finite element analysis of three-dimensional laser-induced transient thermal grating in diamond/ZnSe system

This paper uses finite element method to obtain the three-dimensional temperature field of laser-induced transient thermal grating （TTG） for two-layered structure of diamond film on ZnSe substrate. The numerical results indicate that unique two-times heating process is gradually experienced in the area between two adjacent grating stripes. However, there is a little change for the temperature field along the depth direction for the diamond film due to its great thermal conductivity. It further finds that the thickness of the diamond film has a significant influence on the temperature field in diamond/ZnSe system. The results are useful for the application of laser-induced TTG technique in film/substrate system.

ANALYSIS OF TRANSIENT THERMAL STRESS IN CYLINDRICALLY ORTHOTROPIC TUBES

The incorrect deduction of equations in the research works devoted to the studies of transient stress in cylindrically orthotropic tubes and done by Kardomateas (Journal of Applied Mechanics, 1989, 1990) leads to the wrong results. The errata (1991) correct the deduction error, but do not give the right numerical results. All errors are corrected, and the Mathematica is adopted to solve the large argument problem for Bessel function. A theoretical solution of the transient thermal stresses in tubes with uniform form is presented, and a numerical example is studied.

Transient Thermal Modeling in Laser Welding of Metallic/Nonmetallic Joints Using SolidWorks^(█) Software

The purpose of this research is to develop a SolidWorks? model for transient temperature field of laser welding of PMMA/SS 304 materials for application in fabrication of the ultrasonic back-plate, with a view of optimizing the experimental conditions. The study is carried out on these materials because of the increasing application of both metals and non-metals. The work focuses specifically on these materials because they have been experimentally studied previously and as such, this study can be accepted as an assessment into feasibility of using SolidWorks? model to study the temperature field of the laser welding processes of metals and non-metals. The results of the SolidWorks? transient thermal model show that there is a concentration of high temperatures at the point of contact. It also shows that temperature decreases as we move in (between laser and the top face) to the thickness of the part. Additionally the maximum temperature occurs at the last point of the welding;this may be due to the accumulation of the temperature before arriving at the end. These findings are comparable to the previous simulated and experimental results on temperature field during laser welding of PMMA/SS 304 materials. However, SolidWorks? is shown to present a challenge in modeling a moving source of laser power.

Numerical Simulation of Transient Thermal Stress Field for Laser Metal Deposition Shaping

To decrease thermal stress during laser metal deposition shaping(LMDS)process,it is of great importance to learn the transient thermal stress distribution regularities.Based on the“element life and death”technique of finite element analy- sis(FEA),a three-dimensional multi-track and multi-layer numerical simulation model for LMDS is developed with ANSYS parametric design language(APDL)for the first time,in which long-edge parallel reciprocating scanning paths is introduced. Through the model,detailed simulations of thermal stress during whole metal cladding process are conducted,the generation and distribution regularities of thermal stress are also discussed in detail.Using the same process parameters,the simulation results show good agreement with the features of samples which fabricated by LMDS.

Experimental study of transient thermal elastic hydrodynamic lubrication of tilted thrust bearing under sudden load changes

An experimental study is performed to investigate the temperature response and distribution in a sector tilted pad thrust bearing during the transient periods such as the load on the bearing changed abruptly.Lots of thermocouples are placed on different position such as the pad surface,leading and trailing edge as well as the pad block,and then these thermocouples are used to measure the temperature variation during the transient period.The load on one pad and the displacement of the runner are measured with different sensors.The effects of a sudden load change on temperature at different position of the pads are analyzed according to the experimental data.The influence of different initial conditions and the different load increment on temperature variation at the pad surface and pad body are obtained,and temperature responses at leading edge and trailing edge under different conditions are tested.This experimental study shows a significant effect of load increment and initial condition on the temperature distribution of bearing pad interface under sudden load change conditions,and the measurement of real oil film temperature is difficult due to the large thermal inertia of pad surface.

Characteristics of the transient thermal load and deformation of the evacuated receiver in solar parabolic trough collector

As a core element in solar parabolic trough collector, the evaluated receiver often runs under severe thermal conditions. Worse still, the transient thermal load is more likely to cause structural deformation and damage. This work develops an efficient transient multi-level multi-dimensional(M2) analysis method to address photo-thermal-elastic problems, thereby estimating transient thermal load and deformation for the receiver:(i) one-dimensional(1-D) thermo-hydraulic model is adopted to determine the transient thermo-hydraulic state,(ii) 3-D finite volume method(FVM) model for the receiver tube is established to obtain the real-time temperature distribution,(iii) 3-D finite element method(FEM) model is employed to make thermoelastic analysis. Based on this M2 method, the typical transient cases are conducted in cold-start, disturbed-operation and regulatedprocess. Three indicators(average temperature of the wall(ATW), radial temperature difference(RTD), circumferential temperature difference(CTD)) are defined for overall analysis of the receiver thermal load. It is found that in the transient process,receivers face response delay and endure significant thermal load fluctuation. The response time for a single HCE(heat collecting element) under lower mass flow rate(1.5 kg s-1) could sustain 280 s. During the cold-start stage(DNI=200 W m-2 to 800 W m-2), the maximum value of CTD in receiver is as high as 11.67℃, corresponding to a maximum deflection of 1.05 cm.When the mass flow rate decreases sharply by 80%, the CTD reaches 33.04℃, causing a 2.06-cm deflection. It should be pointed out that in the cold-start stage and the lower mass flow rate operation for solar parabolic trough collector, alleviating the transient thermal load and deformation is of importance for safely and efficiently running evaluated receiver.

Simulation of continuous terahertz wave transient state thermal effects on static water

We report a numerical simulation of continuous terahertz beam induced transient thermal effects on static water. The terahertz wave used in this paper has a Gaussian beam profile. Based on the transient heat conduction equation, the finite element method （FEM） is utilized to calculate the temperature distribution. The simulation results show the dynamic process of temperature change in water during terahertz irradiation. After about 300 s, the temperature reaches a steady state with a water layer thickness of 5 mm and a beam radius of 0.25 mm. The highest temperature increase is 7 K/mW approximately. This work motivates further study on the interaction between terahertz wave and bio-tissue, which has a high water content.

Thermal characterization of GaN heteroepitaxies using ultraviolet transient thermoreflectance

Thermal transport properties of GaN heteroepitaxial structures are of critical importance for the thermal management of high-power GaN electronic and optoelectronic devices. Ultraviolet(UV) lasers are employed to directly heat and sense the GaN epilayers in the transient thermoreflectance(TTR) measurement, obtaining important thermal transport properties in different GaN heterostructures, which include a diamond thin film heat spreader grown on GaN. The UV TTR technique enables rapid and non-contact thermal characterization for GaN wafers.

DOUBLE METHOD OF CHARACTERISTICS TO ANALYZE HYDRAULIC-THERMAL TRANSIENTS OF PIPELINE FLOW

The hydraulic and thermal transients in pipeline flow were studied. The method of characteristics for hydraulic transient analysis of batch transport of pipeline flow had been improved. The thermal transient equation, in which the term with v 3 was involved, had been inferred, while the corresponding method of characteristics was constructed. The double method of characteristics, which can be used to study the coherent hydraulic-thermal transients of batch transport of pipeline flow, was developed.

Heat transfer enhancement in MOSFET mounted on different FR4 substrates by thermal transient measurement

Miniaturization of electronic package leads to high heat density and heat accumulation in electronics device, resulting in short life time and premature failure of the device. Junction temperature and thermal resistance are the critical parameters that determine the thermal management and reliability in electronics cooling. Metal oxide field effect transistor（MOSFET）is an important semiconductor device for light emitting diode-integrated circuit（LED IC） driver application, and thermal management in MOSFET is a major challenge. In this study, investigations on thermal performance of MOSFET are performed for evaluating the junction temperature and thermal resistance. Suitable modifications in FR4 substrates are proposed by introducing thermal vias and copper layer coating to improve the thermal performance of MOSFET. Experiments are conducted using thermal transient tester（T3ster） at 2.0 A input current and ambient temperature varying from25℃ to 75℃. The thermal parameters are measured for three proposed designs： FR4 with circular thermal vias, FR4 with single strip of copper layer and embedded vias, and FR4 with I-shaped copper layer, and compared with that of plain FR4 substrate. From the experimental results, FR4I-shaped shows promising results by 33.71% reduction in junction temperature and 54.19% reduction in thermal resistance. For elevated temperature, the relative increases in junction temperature and thermal resistance are lower for FR4I-shaped than those for other substrates considered. The introduction of thermal vias and copper layer plays a significant role in thermal performance.

NUMERICAL MODEL OF THERMAL TRANSIENT EFFECT IN FIBER OPTIC GYRO

The sensitivity of the interferometric fiber optic gyro in the presence of time varying thermal gradients plays a key role in its performance. It is well known that this sensitivity is due to the difference of index changes between the points symmetrical with respect to the middle of the coil. In order to reduce this sensitivity, different winding patterns, such as quadrupolar winding, were introduced to keep the thermal environment of the symmetrical points. In this paper, a numerical model of the transient temperature distribution in the gyro was established. The temperature gradient of the coil was solved in conjugation with the nature convection heat transfer in the aperture between the coil and the case. Effects of the winding pattern and the design of its case were investigated to optimize the design of the interferometric fiber optic gyro.

Simple method of calculating the transient thermal performance of composite material and its applicable condition

Degree of mixing of composite material is defined and the condition of using the effective thermal diffusivity for calculating the transient thermal performance of composite material is studied. The analytical result shows that for a prescribed precision of temperature, there is a condition under which the transient temperature distribution in composite material can be calculated by using the effective thermal diffusivity. As illustration, for the composite material whose temperatures of both ends are constant, the condition is presented and the factors affecting the relative error of calculated temperature of composite materials by using effective thermal diffusivity are discussed.

Transient thermo-mechanical analysis for bimorph soft robot based on thermally responsive liquid crystal elastomers

Thermally responsive liquid crystal elastomers (LCEs) hold great promise in applications of soft robots and actuators because of the induced size and shape change with temperature. Experiments have successfully demonstrated that the LCE based bimorphs can be effective soft robots once integrated with soft sensors and thermal actuators. Here, we present an analytical transient thermo-mechanical model for a bimorph structure based soft robot, which consists of a strip of LCE and a thermal inert polymer actuated by an ultra-thin stretchable open-mesh shaped heater to mimic the unique locomotion behaviors of an inchworm. The coupled mechanical and thermal analysis based on the thermo-mechanical theory is carried out to underpin the transient bending behavior, and a systematic understanding is therefore achieved. The key analytical results reveal that the thickness and the modulus ratio of the LCE and the inert polymer layer dominate the transient bending deformation. The analytical results will not only render fundamental understanding of the actuation of bimorph structures, but also facilitate the rational design of soft robotics.

Transient Natural Convection in an Annulus with Thermal Radiation

The interaction of transient fully developed natural convection flow with thermal radiation inside a vertical annulus is analyzed both analytically and numerically. The Rosseland approximation is used to describe the radiative heat flux in the energy equation. The mathematical model capturing the present physical situation is highly non-linear due to the presence of radiation effect. The solution of transient model is obtained by implicit finite difference method. To check accuracy of the numerical solution, steady state solution for energy and momentum equations are derived analytically using perturbation series method. Skin-friction and Nusselt number at the outer surface of inner cylinder as well as inner surface of the outer cylinder are obtained. Selected sets of graphical results illustrating the effects of various controlling parameters involved in the problem on flow formation are discussed.

Measurements of electron-phonon coupling factor and interfacial thermal resistance of metallic nano-films using a transient thermoreflectance technique

Using a transient thermoreflectance （TTR） technique, several Au films with different thicknesses on glass and SiC substrates are measured for thermal characterization of metMlic nano-films, including the electron phonon coupling factor G, interfazial thermal resistance R, and thermal conductivity Ks of the substrate. The rear heating-front detecting （RF） method is used to ensure the femtosecond temporal resolution. An intense laser beam is focused on the rear surface to heat the film, and another weak laser beam is focused on the very spot of the front surface to detect the change in the electron temperature. By varying the optical path delay between the two beams, a complete electron temperature profile can be scanned. Different from the normally used single-layer model, the double-layer model involving interfaciM thermal resistance is studied here. The electron temperature cooling profile can be affected by the electron energy transfer into the substrate or the electron-phonon interactions in the metallic films. For multiple-target optimization, the genetic algorithm （GA） is used to obtain both G and R. The experimental result gives a deep understanding of the mechanism of ultra-fast heat transfer in metals.

Combined Effects of Thermal Diffusion and Diffusion-Thermo Effects on Transient MHD Natural Convection and Mass Transfer Flow in a Vertical Channel with Thermal Radiation

We study the nonlinear coupled evolution equations which model the transient MHD natural convection and mass transfer flow of viscous, incompressible and electrically conducting fluid between two infinite vertical plates in the presence of the transversal magnetic field, thermal radiation, thermal diffusion and diffusion-thermo effects. Both analytical and numerical methods are used for this study.