We report a numerical simulation of continuous terahertz beam induced transient thermal effects on static water. The terahertz wave used in this paper has a Gaussian beam profile. Based on the transient heat conductio...We report a numerical simulation of continuous terahertz beam induced transient thermal effects on static water. The terahertz wave used in this paper has a Gaussian beam profile. Based on the transient heat conduction equation, the finite element method （FEM） is utilized to calculate the temperature distribution. The simulation results show the dynamic process of temperature change in water during terahertz irradiation. After about 300 s, the temperature reaches a steady state with a water layer thickness of 5 mm and a beam radius of 0.25 mm. The highest temperature increase is 7 K/mW approximately. This work motivates further study on the interaction between terahertz wave and bio-tissue, which has a high water content.展开更多
The sensitivity of the interferometric fiber optic gyro in the presence of time varying thermal gradients plays a key role in its performance. It is well known that this sensitivity is due to the difference of index c...The sensitivity of the interferometric fiber optic gyro in the presence of time varying thermal gradients plays a key role in its performance. It is well known that this sensitivity is due to the difference of index changes between the points symmetrical with respect to the middle of the coil. In order to reduce this sensitivity, different winding patterns, such as quadrupolar winding, were introduced to keep the thermal environment of the symmetrical points. In this paper, a numerical model of the transient temperature distribution in the gyro was established. The temperature gradient of the coil was solved in conjugation with the nature convection heat transfer in the aperture between the coil and the case. Effects of the winding pattern and the design of its case were investigated to optimize the design of the interferometric fiber optic gyro.展开更多
Miniaturization of electronic package leads to high heat density and heat accumulation in electronics device, resulting in short life time and premature failure of the device. Junction temperature and thermal resistan...Miniaturization of electronic package leads to high heat density and heat accumulation in electronics device, resulting in short life time and premature failure of the device. Junction temperature and thermal resistance are the critical parameters that determine the thermal management and reliability in electronics cooling. Metal oxide field effect transistor（MOSFET）is an important semiconductor device for light emitting diode-integrated circuit（LED IC） driver application, and thermal management in MOSFET is a major challenge. In this study, investigations on thermal performance of MOSFET are performed for evaluating the junction temperature and thermal resistance. Suitable modifications in FR4 substrates are proposed by introducing thermal vias and copper layer coating to improve the thermal performance of MOSFET. Experiments are conducted using thermal transient tester（T3ster） at 2.0 A input current and ambient temperature varying from25℃ to 75℃. The thermal parameters are measured for three proposed designs： FR4 with circular thermal vias, FR4 with single strip of copper layer and embedded vias, and FR4 with I-shaped copper layer, and compared with that of plain FR4 substrate. From the experimental results, FR4I-shaped shows promising results by 33.71% reduction in junction temperature and 54.19% reduction in thermal resistance. For elevated temperature, the relative increases in junction temperature and thermal resistance are lower for FR4I-shaped than those for other substrates considered. The introduction of thermal vias and copper layer plays a significant role in thermal performance.展开更多
PVC/CdS nanocomposites have been prepared by solution casting method taking 2, 4, 6 and 8 wt% of CdS nanoparticles. PVC/CdS nanocomposites were characterized through TEM measurement. The measurement of effective therm...PVC/CdS nanocomposites have been prepared by solution casting method taking 2, 4, 6 and 8 wt% of CdS nanoparticles. PVC/CdS nanocomposites were characterized through TEM measurement. The measurement of effective thermal conductivity of PVC/CdS nanocomposites has also been done using transient plane source (TPS) method. The effects of concentration of CdS nanoparticles and temperature on the effective thermal conductivity of polymer PVC/CdS nanocomposites have been studied. The variation of effective thermal conductivity with the concentration of filler particles and temperature has also been discussed in terms of dispersion of filler particles into polymer matrix and phonon scattering mechanism, respectively.展开更多
This paper investigated the fire resistance of CSBs with various parameters under high temperature rise due to fire using finite element software ABAQUS. The mechanical parameters of CSBs are analyzed, including load-...This paper investigated the fire resistance of CSBs with various parameters under high temperature rise due to fire using finite element software ABAQUS. The mechanical parameters of CSBs are analyzed, including load-bearing capacity and the temperature distribution during the heating process. Through structural analysis simulation of the entire heating process, the structural response of the CSBs is divided into five stages: elastic stage, elastic-plastic stage, self-balancing stage, catenary stage and ultimate destruction stage. The results indicate that the opening diameter-to-height ratio, opening spacing-to-height ratio and load ratio significantly affect the structural responses of CSBs in fire, followed by opening shape as secondary effects. In all the numerical analyzes, CSBs are analyzed with a uniformly distributed load and having simply supported boundary conditions.展开更多
基金supported by the National Basic Research Program of China (Grant Nos. 2007CB310403 and 2007CB310407)the National Natural Science Foundation of China (Grant No. 60801017)
文摘We report a numerical simulation of continuous terahertz beam induced transient thermal effects on static water. The terahertz wave used in this paper has a Gaussian beam profile. Based on the transient heat conduction equation, the finite element method （FEM） is utilized to calculate the temperature distribution. The simulation results show the dynamic process of temperature change in water during terahertz irradiation. After about 300 s, the temperature reaches a steady state with a water layer thickness of 5 mm and a beam radius of 0.25 mm. The highest temperature increase is 7 K/mW approximately. This work motivates further study on the interaction between terahertz wave and bio-tissue, which has a high water content.
文摘The sensitivity of the interferometric fiber optic gyro in the presence of time varying thermal gradients plays a key role in its performance. It is well known that this sensitivity is due to the difference of index changes between the points symmetrical with respect to the middle of the coil. In order to reduce this sensitivity, different winding patterns, such as quadrupolar winding, were introduced to keep the thermal environment of the symmetrical points. In this paper, a numerical model of the transient temperature distribution in the gyro was established. The temperature gradient of the coil was solved in conjugation with the nature convection heat transfer in the aperture between the coil and the case. Effects of the winding pattern and the design of its case were investigated to optimize the design of the interferometric fiber optic gyro.
基金Project supported by the Collaborative Research in Engineering,Science&Technology(Grant No.P28C2-13)
文摘Miniaturization of electronic package leads to high heat density and heat accumulation in electronics device, resulting in short life time and premature failure of the device. Junction temperature and thermal resistance are the critical parameters that determine the thermal management and reliability in electronics cooling. Metal oxide field effect transistor（MOSFET）is an important semiconductor device for light emitting diode-integrated circuit（LED IC） driver application, and thermal management in MOSFET is a major challenge. In this study, investigations on thermal performance of MOSFET are performed for evaluating the junction temperature and thermal resistance. Suitable modifications in FR4 substrates are proposed by introducing thermal vias and copper layer coating to improve the thermal performance of MOSFET. Experiments are conducted using thermal transient tester（T3ster） at 2.0 A input current and ambient temperature varying from25℃ to 75℃. The thermal parameters are measured for three proposed designs： FR4 with circular thermal vias, FR4 with single strip of copper layer and embedded vias, and FR4 with I-shaped copper layer, and compared with that of plain FR4 substrate. From the experimental results, FR4I-shaped shows promising results by 33.71% reduction in junction temperature and 54.19% reduction in thermal resistance. For elevated temperature, the relative increases in junction temperature and thermal resistance are lower for FR4I-shaped than those for other substrates considered. The introduction of thermal vias and copper layer plays a significant role in thermal performance.
文摘PVC/CdS nanocomposites have been prepared by solution casting method taking 2, 4, 6 and 8 wt% of CdS nanoparticles. PVC/CdS nanocomposites were characterized through TEM measurement. The measurement of effective thermal conductivity of PVC/CdS nanocomposites has also been done using transient plane source (TPS) method. The effects of concentration of CdS nanoparticles and temperature on the effective thermal conductivity of polymer PVC/CdS nanocomposites have been studied. The variation of effective thermal conductivity with the concentration of filler particles and temperature has also been discussed in terms of dispersion of filler particles into polymer matrix and phonon scattering mechanism, respectively.
文摘This paper investigated the fire resistance of CSBs with various parameters under high temperature rise due to fire using finite element software ABAQUS. The mechanical parameters of CSBs are analyzed, including load-bearing capacity and the temperature distribution during the heating process. Through structural analysis simulation of the entire heating process, the structural response of the CSBs is divided into five stages: elastic stage, elastic-plastic stage, self-balancing stage, catenary stage and ultimate destruction stage. The results indicate that the opening diameter-to-height ratio, opening spacing-to-height ratio and load ratio significantly affect the structural responses of CSBs in fire, followed by opening shape as secondary effects. In all the numerical analyzes, CSBs are analyzed with a uniformly distributed load and having simply supported boundary conditions.
