High-Performance Organic Field-Effect Transistors Based on Two-Dimensional Vat Orange 3 Crystals

The exploration and research of low-cost,environmentally friendly,and sustainable organic semiconductor materials are of immense significance in various fields,including electronics,optoelectronics,and energy conversion.Unfortunately,these semiconductors have almost poor charge transport properties,which range from∼10^(−4) cm^(2)·V^(−1)·s^(−1) to∼10^(−2) cm^(2)·V^(−1)·s^(−1).Vat orange 3,as one of these organic semiconductors,has great potential due to its highly conjugated structure.We obtain high-quality multilayered Vat orange 3 crystals with two-dimensional(2D)growth on h-BN surfaces with thickness of 10–100 nm using physical vapor transport.Raman’s results confirm the stability of the chemical structure of Vat orange 3 during growth.Furthermore,by leveraging the structural advantages of 2D materials,an organic field-effect transistor with a 2D vdW vertical heterostructure is further realized with h-BN encapsulation and multilayered graphene contact electrodes,resulting in an excellent transistor performance with On/Off ratio of 104 and high field-effect mobility of 0.14 cm^(2)·V^(−1)·s^(−1).Our results show the great potential of Vat orange 3 with 2D structures in future nano-electronic applications.Furthermore,we showcase an approach that integrates organic semiconductors with 2D materials,aiming to offer new insights into the study of organic semiconductors.

Effect of external magnetic field on the instability of THz plasma waves in nanoscale graphene field-effect transistors

The instability of plasma waves in the channel of field-effect transistors will cause the electromagnetic waves with THz frequency.Based on a self-consistent quantum hydrodynamic model,the instability of THz plasmas waves in the channel of graphene field-effect transistors has been investigated with external magnetic field and quantum effects.We analyzed the influence of weak magnetic fields,quantum effects,device size,and temperature on the instability of plasma waves under asymmetric boundary conditions numerically.The results show that the magnetic fields,quantum effects,and the thickness of the dielectric layer between the gate and the channel can increase the radiation frequency.Additionally,we observed that increase in temperature leads to a decrease in both oscillation frequency and instability increment.The numerical results and accompanying images obtained from our simulations provide support for the above conclusions.

Atomic layer deposition for nanoscale oxide semiconductor thin film transistors:review and outlook

Since the first report of amorphous In–Ga–Zn–O based thin film transistors,interest in oxide semiconductors has grown.They offer high mobility,low off-current,low process temperature,and wide flexibility for compositions and processes.Unfortunately,depositing oxide semiconductors using conventional processes like physical vapor deposition leads to problematic issues,especially for high-resolution displays and highly integrated memory devices.Conventional approaches have limited process flexibility and poor conformality on structured surfaces.Atomic layer deposition(ALD)is an advanced technique which can provide conformal,thickness-controlled,and high-quality thin film deposition.Accordingly,studies on ALD based oxide semiconductors have dramatically increased recently.Even so,the relationships between the film properties of ALD-oxide semiconductors and the main variables associated with deposition are still poorly understood,as are many issues related to applications.In this review,to introduce ALD-oxide semiconductors,we provide:(a)a brief summary of the history and importance of ALD-based oxide semiconductors in industry,(b)a discussion of the benefits of ALD for oxide semiconductor deposition(in-situ composition control in vertical distribution/vertical structure engineering/chemical reaction and film properties/insulator and interface engineering),and(c)an explanation of the challenging issues of scaling oxide semiconductors and ALD for industrial applications.This review provides valuable perspectives for researchers who have interest in semiconductor materials and electronic device applications,and the reasons ALD is important to applications of oxide semiconductors.

Stretchable organic electrochemical transistors with micro-/nano-structures

Organic electrochemical transistors(OECTs)have attracted attention due to their unique function of converting ionic and biological signals into electronic signals,high transconductance,low energy consumption(below 1 V),stable operation in aqueous media,good biocompatibility[1,2].However,most OECTs are usually built on brittle and stiff substrates,and inappropriate to be adhered to or contacted with delicate human skin,thus impeding their use in wearable electronics.It is desirable to exploit stretchable OECTs to reduce the mechanical mismatch with soft tissues.

P-type cold-source field-effect transistors with TcX_(2) and ReX_(2)(X=S,Se)cold source electrodes:A computational study

Cold-source field-effect transistors(CS-FETs)have been developed to overcome the major challenge of power dissipation in modern integrated circuits.Cold metals suitable for n-type CS-FETs have been proposed as the ideal electrode to filter the high-energy electrons and break the thermal limit on subthreshold swing(SS).In this work,regarding the p-type CS-FETs,we propose TcX_(2) and ReX_(2)(X=S,Se)as the injection source to realize the sub-thermal switching for holes.First-principles calculations unveils the cold-metal characteristics of monolayer TcX_(2) and ReX_(2),possessing a sub-gap below the Fermi level and a decreasing DOS with energy.Quantum device simulations demonstrate that TcX_(2) and ReX_(2) can enable the cold source effects in WSe_(2) p-type FETs,achieving steep SS of 29-38 mV/dec and high on/off ratios of(2.3-5.6)×10^(7).Moreover,multilayer Re S2retains the cold metal characteristic,thus ensuring similar CS-FET performances to that of the monolayer source.This work underlines the significance of cold metals for the design of p-type CS-FETs.

Homojunction structure amorphous oxide thin film transistors with ultra-high mobility

Amorphous oxide semiconductors(AOS)have unique advantages in transparent and flexible thin film transistors(TFTs)applications,compared to low-temperature polycrystalline-Si(LTPS).However,intrinsic AOS TFTs are difficult to obtain field-effect mobility(μFE)higher than LTPS(100 cm^(2)/(V·s)).Here,we design ZnAlSnO(ZATO)homojunction structure TFTs to obtainμFE=113.8 cm^(2)/(V·s).The device demonstrates optimized comprehensive electrical properties with an off-current of about1.5×10^(-11)A,a threshold voltage of–1.71 V,and a subthreshold swing of 0.372 V/dec.There are two kinds of gradient coupled in the homojunction active layer,which are micro-crystallization and carrier suppressor concentration gradient distribution so that the device can reduce off-current and shift the threshold voltage positively while maintaining high field-effect mobility.Our research in the homojunction active layer points to a promising direction for obtaining excellent-performance AOS TFTs.

A non-quasi-static model for nanowire gate-all-around tunneling field-effect transistors

Nanowires with gate-all-around(GAA) structures are widely considered as the most promising candidate for 3-nm technology with the best ability of suppressing the short channel effects,and tunneling field effect transistors(TFETs)based on GAA structures also present improved performance.In this paper,a non-quasi-static(NQS) device model is developed for nanowire GAA TFETs.The model can predict the transient current and capacitance varying with operation frequency,which is beyond the ability of the quasi-static(QS) model published before.Excellent agreements between the model results and numerical simulations are obtained.Moreover,the NQS model is derived from the published QS model including the current-voltage(I-V) and capacitance-voltage(C-V) characteristics.Therefore,the NQS model is compatible with the QS model for giving comprehensive understanding of GAA TFETs and would be helpful for further study of TFET circuits based on nanowire GAA structure.

Temperature dependence of single-event transients in SiGe heterojunction bipolar transistors for cryogenic applications

We experimentally demonstrate that the dominant mechanism of single-event transients in silicon-germanium heterojunction bipolar transistors(SiGe HBTs)can change with decreasing temperature from+20℃to-180℃.This is accomplished by using a new well-designed cryogenic experimental system suitable for a pulsed-laser platform.Firstly,when the temperature drops from+20℃to-140℃,the increased carrier mobility drives a slight increase in transient amplitude.However,as the temperature decreases further below-140℃,the carrier freeze-out brings about an inflection point,which means the transient amplitude will decrease at cryogenic temperatures.To better understand this result,we analytically calculate the ionization rates of various dopants at different temperatures based on Altermatt's new incomplete ionization model.The parasitic resistivities with temperature on the charge-collection pathway are extracted by a two-dimensional(2D)TCAD process simulation.In addition,we investigate the impact of temperature on the novel electron-injection process from emitter to base under different bias conditions.The increase of the emitter-base junction's barrier height at low temperatures could suppress this electron-injection phenomenon.We have also optimized the built-in voltage equations of a high current compact model(HICUM)by introducing the impact of incomplete ionization.The present results and methods could provide a new reference for effective evaluation of single-event effects in bipolar transistors and circuits at cryogenic temperatures,and could provide a new evidence of the potential of SiGe technology in applications in extreme cryogenic environments.

Novel GaN-based double-channel p-heterostructure field-effect transistors with a p-GaN insertion layer

GaN-based p-channel heterostructure field-effect transistors(p-HFETs)face significant constraints on on-state currents compared with n-channel high electron mobility transistors.In this work,we propose a novel double heterostructure which introduces an additional p-GaN insertion layer into traditional p-HFETs.The impact of the device structure on the hole densities and valence band energies of both the upper and lower channels is analyzed by using Silvaco TACD simulations,including the thickness of the upper AlGaN layer and the doping impurities and concentration in the GaN buffer layer,as well as the thickness and Mg-doping concentration in the p-GaN insertion layer.With the help of the p-GaN insertion layer,the C-doping concentration in the GaN buffer layer can be reduced,while the density of the two-dimensional hole gas in the lower channel is enhanced at the same time.This work suggests that a double heterostructure with a p-GaN insertion layer is a better approach to improve p-HFETs compared with those devices with C-doped buffer layer alone.

Single-electron transport in H_(2)O@C_(60) single-molecule transistors

Single-molecule transistors(SMTs) based on fullerenes and their derivatives have been recognized as a long-sought platform for studying the single-electron transport properties.H_(2)O@C_(60) is a combination of fullerene and H_(2)O,a typical light molecule.Here we use the 'molecular surgery' technique to synthesize the H_(2)O@C_(60) molecule and then construct the H_(2)O@C_(60) SMTs,together with the C_(60) SMTs.Evidences for single-electron transport have been obtained in our measurements,including explicit Coulomb blockade and Coulomb oscillations.We then calculate the detailed parameters of the H_(2)O@C_(60) and C_(60) SMTs using a capacitance model derived from the Coulomb diamond feature,which gives a capacitance ratio of 1:5.05:8.52 for the H_(2)O@C_(60) SMT and 1:29.5:74.8 for the C_(60) SMT.Moreover,the gate efficiency factor a turns out to be 0.0686 in the H_(2)O@C_(60) SMT,about ten times larger than that in the C_(60) SMT.We propose that the enhanced gate efficiency in H_(2)O@C_(60) SMT may be induced by the closer attachment of molecular orbital electron clouds to the gate substrate due to polarization effects of H_(2)O.

Ambipolar performance improvement of the C-shaped pocket TFET with dual metal gate and gate–drain underlap

Dual-metal gate and gate–drain underlap designs are introduced to reduce the ambipolar current of the device based on the C-shaped pocket TFET(CSP-TFET).The effects of gate work function and gate–drain underlap length on the DC characteristics and analog/RF performance of CSP-TFET devices,such as the on-state current(I_(on)),ambipolar current(I_(amb)),transconductance(g_(m)),cut-off frequency(f_(T))and gain–bandwidth product(GBP),are analyzed and compared in this work.Also,a combination of both the dual-metal gate and gate–drain underlap designs has been proposed for the C-shaped pocket dual metal underlap TFET(CSP-DMUN-TFET),which contains a C-shaped pocket area that significantly increases the on-state current of the device;this combination design substantially reduces the ambipolar current.The results show that the CSP-DMUN-TFET demonstrates an excellent performance,including high I_(on)(9.03×10^(-4)A/μm),high I_(on)/I_(off)(~10^(11)),low SS_(avg)(~13 mV/dec),and low I_(amb)(2.15×10^(-17)A/μm).The CSP-DMUN-TFET has the capability to fully suppress ambipolar currents while maintaining high on-state currents,making it a potential replacement in the next generation of semiconductor devices.

Fluorination-mitigated high-current degradation of amorphous InGaZnO thin-film transistors

As growing applications demand higher driving currents of oxide semiconductor thin-film transistors(TFTs),severe instabilities and even hard breakdown under high-current stress(HCS)become critical challenges.In this work,the triggering voltage of HCS-induced self-heating(SH)degradation is defined in the output characteristics of amorphous indium-galliumzinc oxide(a-IGZO)TFTs,and used to quantitatively evaluate the thermal generation process of channel donor defects.The fluorinated a-IGZO(a-IGZO:F)was adopted to effectively retard the triggering of the self-heating(SH)effect,and was supposed to originate from the less population of initial deep-state defects and a slower rate of thermal defect transition in a-IGZO:F.The proposed scheme noticeably enhances the high-current applications of oxide TFTs.

W-doped In_(2)O_(3) nanofiber optoelectronic neuromorphic transistors with synergistic synaptic plasticity

Neuromorphic devices that mimic the information processing function of biological synapses and neurons have attracted considerable attention due to their potential applications in brain-like perception and computing. In this paper,neuromorphic transistors with W-doped In_(2)O_(3)nanofibers as the channel layers are fabricated and optoelectronic synergistic synaptic plasticity is also investigated. Such nanofiber transistors can be used to emulate some biological synaptic functions, including excitatory postsynaptic current(EPSC), long-term potentiation(LTP), and depression(LTD). Moreover, the synaptic plasticity of the nanofiber transistor can be synergistically modulated by light pulse and electrical pulse.At last, pulsed light learning and pulsed electrical forgetting behaviors were emulated in 5×5 nanofiber device array.Our results provide new insights into the development of nanofiber optoelectronic neuromorphic devices with synergistic synaptic plasticity.

Effect of spin on the instability of THz plasma waves in field-effect transistors under non-ideal boundary conditions

Terahertz(THz) radiation can be generated due to the instability of THz plasma waves in field-effect transistors(FETs). In this work, we discuss the instability of THz plasma waves in the channel of FETs with spin and quantum effects under non-ideal boundary conditions. We obtain a linear dispersion relation by using the hydrodynamic equation, Maxwell equation and spin equation. The influence of source capacitance, drain capacitance, spin effects, quantum effects and channel width on the instability of THz plasma waves under the non-ideal boundary conditions is investigated in great detail. The results of numerical simulation show that the THz plasma wave is unstable when the drain capacitance is smaller than the source capacitance;the oscillation frequency with asymmetric boundary conditions is smaller than that under non-ideal boundary conditions;the instability gain of THz plasma waves becomes lower under non-ideal boundary conditions. This finding provides a new idea for finding efficient THz radiation sources and opens up a new mechanism for the development of THz technology.

Advances in mobility enhancement of ITZO thin-film transistors:a review

Indium-tin-zinc oxide(ITZO)thin-film transistor(TFT)technology holds promise for achieving high mobility and offers significant opportunities for commercialization.This paper provides a review of progress made in improving the mobility of ITZO TFTs.This paper begins by describing the development and current status of metal-oxide TFTs,and then goes on to explain the advantages of selecting ITZO as the TFT channel layer.The evaluation criteria for TFTs are subsequently introduced,and the reasons and significance of enhancing mobility are clarified.This paper then explores the development of high-mobility ITZO TFTs from five perspectives:active layer optimization,gate dielectric optimization,electrode optimization,interface optimization,and device structure optimization.Finally,a summary and outlook of the research field are presented.

基极触发的雪崩晶体管导通机理

为研究基极触发的雪崩晶体管导通机理,建立了雪崩晶体管(n+⁃p⁃n⁃n+掺杂结构)的准三维器件模型和实验测试电路。研究了雪崩晶体管的温度分布特征,导通结束后器件最高温度约为417 K,位于电流通道内n⁃n+边界处。当集电极电压为300 V、基极触发电压为2.4 V时,仿真和实验获得的脉冲上升时间分别为2.4 ns、2.5 ns,半高宽(FWHM)分别为6.2 ns、5.8 ns,仿真和实验结果基本一致。研究结果表明:高触发脉冲电压幅值会加速晶体管内部电场的重建过程,从而缩短延迟时间,提高晶体管响应速度;负载阻抗会影响器件导通通道尺寸,负载阻抗减小时,电流密度提升,器件通过缩窄通道来提高通道内电流密度,宏观导通电阻降低。

重离子辐射对AlGaN/GaN高电子迁移率晶体管低频噪声特性的影响

采用^(181)Ta^(32+)重离子辐射AlGaN/GaN高电子迁移率晶体管,获得器件在重离子辐射前后的电学特性和低频噪声特性.重离子辐射导致器件的阈值电压正向漂移、最大饱和电流减小等电学参数的退化.微光显微测试发现辐射后器件热点数量明显增加,引入更多缺陷.随着辐射注量的增加,电流噪声功率谱密度逐渐增大,在注量为1×10^(10)ions/cm^(2)重离子辐射后,缺陷密度增大到3.19×10^(18)cm^(-3)·eV^(-1),不同栅压下的Hooge参数增大.通过漏极电流噪声归一化功率谱密度随偏置电压的变化分析,发现重离子辐射产生的缺陷会导致寄生串联电阻增大.

肖特基结多数载流子积累新型绝缘栅双极晶体管

绝缘栅双极晶体管(insulated gate bipolar transistor,IGBT)是现代功率半导体器件的核心,因其良好的电学特性得到了广泛的应用.本文提出了一种具有肖特基结接触的栅半导体层新型多数载流子积累模式IGBT,并对其进行特性研究和仿真分析.当新型IGBT处于导通状态,栅极施加正向偏压,由于肖特基势垒二极管极低的正向导通压降,使得栅半导体层的电压几乎等于栅极电压,从而能够在漂移区中积累大量的多数载流子电子.除了现有的电子外,这些积累的电子增大了漂移区的电导率,从而显著降低了正向导通压降.因此,打破了传统IGBT正向导通压降受漂移区掺杂浓度的限制.轻掺杂的漂移区可以使新型IGBT具有较高的击穿电压,同时减小了关断过程中器件内部耗尽层电容,因此整体米勒电容减小,提升了关断速度,减小了关断时间和关断损耗.分析结果表明,600 V级别的击穿电压时,新型IGBT的正向导通压降,关断损耗和关断时间相比常规IGBT分别降低了46.2%,52.5%,30%,打破了IGBT中正向导通压降和关断损耗之间的矛盾.此外,新型IGBT具有更高的抗闩锁能力和更大的正偏安全工作区.新型结构的提出满足了未来IGBT器件性能的发展要求,对于功率半导体器件领域具有重大指导意义.

一种抑制栅极正负向串扰的GaN HEMT无源驱动电路

GaN器件由于其更快的开关速度,比硅器件更容易发生严重的开关振荡,也更容易受到栅源电压振荡的影响。为了抑制GaN基半桥结构中的串扰,提出了一种抑制GaN高电子迁移率晶体管(HEMT)栅极正负向串扰的无源钳位驱动电路来抑制栅源电压振荡。采用基本无源元件建立自举驱动回路,并增加三极管以构成从驱动电路到GaN HEMT的低阻抗米勒电流路径,抑制正负向串扰。在LTspice软件下进行电路模拟仿真,并搭建实验平台进行实测验证,结果表明栅源电压的最大正向串扰可降至1.2 V,最大负向串扰可降至1.6 V,漏源电流的正向和负向串扰均降至2 A以下,证明该电路对栅源电压以及漏源电流的振荡均有良好的抑制效果。

红外探测器中一种电容式反馈跨阻放大器的设计

放大器电路对提高红外成像技术中红外探测器的读出精度,是至关重要的。针对电容式反馈跨阻放大器的设计进行了研究,提出了一种在反馈回路中用晶体管代替反馈电阻的新的拓扑结构。对于所提出的拓扑结构,提出并分析了与系统稳定性相关的诸如截止频率和衰减比等的总体频率响应和设计参数,从而获得高直流输入动态范围。此外,还讨论了在直流反馈回路中加入额外的电容以确保系统的稳定性。分析、仿真和实验结果的良好一致性验证了所提出的CF-TIA方案的有效性,而且所提出的电路设计在正常或低直流输入下的整体噪声性能方面相比于传统的CF-TIA方案更具优势。尽管本文中的电路采用分立元件实现,但提出的频率响应模型和稳定性分析适用于所有CF-TIA应用和CMOS芯片设计。