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Trench型N-Channel MOSFET低剂量率效应研究
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作者 徐海铭 唐新宇 +4 位作者 徐政 廖远宝 张庆东 谢儒彬 洪根深 《微电子学与计算机》 2024年第5期134-139,共6页
基于抗辐射100V Trench型N-Channel MOSFET开展了不同剂量率的总剂量辐射实验并进行了分析,创新性提出了器件随低剂量率累积以及不同偏置状态下的变化趋势和机理,给出了器件实验前后的转移曲线和直流参数,进行了二维数值仿真比较,证明... 基于抗辐射100V Trench型N-Channel MOSFET开展了不同剂量率的总剂量辐射实验并进行了分析,创新性提出了器件随低剂量率累积以及不同偏置状态下的变化趋势和机理,给出了器件实验前后的转移曲线和直流参数,进行了二维数值仿真比较,证明了实验和仿真的一致性。研究表明:随高剂量率的剂量增加,器件阈值电压(V_(TH))发生了明显负向漂移现象,导通电阻(R_(DSON))出现5%左右的降低,击穿电压(BV_(DS))保持基本不变;低剂量率下总剂量效应与高剂量率有明显不同,阈值电压漂移量减小,同时出现正向漂移现象;此时导通电阻(R_(DSON))和击穿电压(BV_(DS))较高剂量率变化量进一步下降。研究认为,低剂量率下器件界面缺陷电荷增加变多,使得阈值电压的漂移方向发生改变,同时低剂量率实验周期是高剂量率的500倍,退火效应也较高剂量率的明显,导致器件参数辐射前后差异性减小。 展开更多
关键词 槽型场效应管 总剂量电离效应 阈值漂移 低剂量率
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Blast injury risks to humans within a military trench
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作者 Idan E.Edri 《Defence Technology(防务技术)》 SCIE EI CAS CSCD 2024年第10期91-104,共14页
In land warfare,trenches serve as vital defensive fortifications,offering protection to soldiers while engaging in combat.However,despite their protective function,soldiers often sustain injuries within these trenches... In land warfare,trenches serve as vital defensive fortifications,offering protection to soldiers while engaging in combat.However,despite their protective function,soldiers often sustain injuries within these trenches.The lack of corresponding blast data alongside empirical injury reports presents a significant knowledge gap,particularly concerning the blast pressures propagating within trench spaces following nearby explosions.This absence hinders the correlation between blast parameters,trench geometry,and reported injury cases,limiting our understanding of blast-related risks within trenches.This paper addresses the critical aspect of blast propagation within trench systems,essential for evaluating potential blast injury risks to individuals within these structures.Through advanced computational fluid dynamics(CFD)simulations,the study comprehensively investigates blast injury risks resulting from explosions near military trenches.Employing a sophisticated computational model,the research analyzes the dynamic blast effects within trenches,considering both geometrical parameters and blast characteristics influenced by explosive weight and scaled distance.The numerical simulations yield valuable insights into the impact of these parameters on blast injury risks,particularly focusing on eardrum rupture,lung injury,and traumatic brain injury levels within the trench.The findings elucidate distinct patterns of high-risk zones,highlighting unique characteristics of internal explosions due to confinement and venting dynamics along the trench.This study underscores the significance of detailed numerical modeling in assessing blast injury risks and provides a novel knowledge base for understanding risks associated with explosives detonating near military trenches.The insights gained contribute to enhancing safety measures in both military and civilian contexts exposed to blast events near trench structures. 展开更多
关键词 trench BLAST Injury risk Eardrum rupture Lung injury Traumatic brain injury
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Physical insights into trapping effects on vertical GaN-on-Si trench MOSFETs from TCAD
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作者 NicolòZagni Manuel Fregolent +9 位作者 Andrea Del Fiol Davide Favero Francesco Bergamin Giovanni Verzellesi Carlo De Santi Gaudenzio Meneghesso Enrico Zanoni Christian Huber Matteo Meneghini Paolo Pavan 《Journal of Semiconductors》 EI CAS CSCD 2024年第3期45-52,共8页
Vertical GaN power MOSFET is a novel technology that offers great potential for power switching applications.Being still in an early development phase,vertical GaN devices are yet to be fully optimized and require car... Vertical GaN power MOSFET is a novel technology that offers great potential for power switching applications.Being still in an early development phase,vertical GaN devices are yet to be fully optimized and require careful studies to foster their development.In this work,we report on the physical insights into device performance improvements obtained during the development of vertical GaN-on-Si trench MOSFETs(TMOS’s)provided by TCAD simulations,enhancing the dependability of the adopted process optimization approaches.Specifically,two different TMOS devices are compared in terms of transfer-curve hysteresis(H)and subthreshold slope(SS),showing a≈75%H reduction along with a≈30%SS decrease.Simulations allow attributing the achieved improvements to a decrease in the border and interface traps,respectively.A sensitivity analysis is also carried out,allowing to quantify the additional trap density reduction required to minimize both figures of merit. 展开更多
关键词 vertical GaN trench MOSFET SiO_(2) interface traps border traps HYSTERESIS BTI
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The Origins of the Arc-Shaped Langshan Uplift and Linhe Trench
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作者 Yi Ding Yunxia Wu Zheng Hou 《Open Journal of Geology》 CAS 2024年第1期117-125,共9页
In the northern part of the Ordos Basin, there is a 325 km long arc-shaped Langshan uplift and a 15 km-deep Linhe Trench in front of Langshan, which are rare geological phenomena for which origins no one has explained... In the northern part of the Ordos Basin, there is a 325 km long arc-shaped Langshan uplift and a 15 km-deep Linhe Trench in front of Langshan, which are rare geological phenomena for which origins no one has explained. This article comprehensively analyzes the research achievements over the past 40 years of geology, geomorphology, seismic exploration, paleogeography, and oil and gas exploration in the Ordos Basin and Langshan. It recognizes that the northern part of the Ordos Basin experienced a meteorite impact in the Late Cretaceous period. The impact pushed the block northwest ward, subducting after colliding with igneous rocks in the north. This sudden event formed a clear arc-shaped mountain zone in the north and a wedge-shaped trench in front of the mountain. The chaotic layers, prolonged and continuous faults, and numerous thrust layers in the Langshan, a negative anomaly area in the center of the northern Ordos, abnormal orientation of crystalline basement structures in the north of Ordos, Moho uplift, and distribution of meteorite fragments in the northwest of Langshan, all of these geological phenomena support the occurrence of the meteorite impact event, forming the arc-shaped Langshan and the Trench. 展开更多
关键词 Meteorite Craters Linhe ORDOS Arc-Shaped Langshan trench
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一种抗辐射Trench型N 30 V MOSFET器件设计
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作者 廖远宝 谢雅晴 《电子与封装》 2024年第5期72-78,共7页
由于Trench结构在降低元胞单元尺寸、提升沟道密度和消除JFET区电阻等方面的优势,Trench型MOSFET已广泛应用于低压产品领域。在研究抗辐射机理和抗辐射加固技术的基础上,设计了一款新型抗辐射Trench型N30VMOSFET器件。实验结果显示,产... 由于Trench结构在降低元胞单元尺寸、提升沟道密度和消除JFET区电阻等方面的优势,Trench型MOSFET已广泛应用于低压产品领域。在研究抗辐射机理和抗辐射加固技术的基础上,设计了一款新型抗辐射Trench型N30VMOSFET器件。实验结果显示,产品击穿电压典型值达42V,特征导通电阻为51mΩ·mm^(2)。在^(60)Co γ射线100krad(Si)条件下,器件阈值电压漂移仅为-0.3V,漏源漏电流从34nA仅上升到60nA。采用能量为2006MeV、硅中射程为116μm、线性能量传输(LET)值为75.4MeV·cm^(2)/mg的^(118)Ta离子垂直入射该器件,未发生单粒子事件。 展开更多
关键词 总剂量 单粒子烧毁 单粒子栅穿 MOSFET trench
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Trench MOSFET的研究与进展 被引量:12
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作者 苏延芬 刘英坤 《半导体技术》 CAS CSCD 北大核心 2007年第4期277-280,292,共5页
研究总结了功率MOSFET器件与BJT器件相比的发展优势。介绍了作为VDMOSFET进一步发展的新型器件Trench MOSFET研究提出的背景及意义,并从其基本结构出发阐述了Trench MOSFET与VDMOS相比的电学性能特点。最后对其发展现状,关键技术和结构... 研究总结了功率MOSFET器件与BJT器件相比的发展优势。介绍了作为VDMOSFET进一步发展的新型器件Trench MOSFET研究提出的背景及意义,并从其基本结构出发阐述了Trench MOSFET与VDMOS相比的电学性能特点。最后对其发展现状,关键技术和结构参数及其发展趋势进行了概括、总结和展望。 展开更多
关键词 trench金属氧化物场效应晶体管 比导通电阻 击穿电压 元胞面积 箱型掺杂
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射频功率Trench MOSFET研制 被引量:1
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作者 苏延芬 刘英坤 +3 位作者 邓建国 胡顺欣 冯彬 董四华 《微纳电子技术》 CAS 2008年第7期380-382,386,共4页
在国内首次研制出了一种采用条状元胞结构、特殊的栅槽刻蚀条件、特殊的栅介质生长前处理工艺及多晶硅栅的射频功率Trench MOSFET器件。该器件漏源击穿电压大于62V、漏极电流大于3.0A、跨导大于0.8S、阂值电压2~3V、导通电阻比同样... 在国内首次研制出了一种采用条状元胞结构、特殊的栅槽刻蚀条件、特殊的栅介质生长前处理工艺及多晶硅栅的射频功率Trench MOSFET器件。该器件漏源击穿电压大于62V、漏极电流大于3.0A、跨导大于0.8S、阂值电压2~3V、导通电阻比同样条件的VDMOS降低了19%~43%,在175MHz、VDS=12VTN出功率Po为7W、漏极效率ηD为44%、功率增益GP为10dB。 展开更多
关键词 trench MOSFET 导通电阻 沟道密度 垂直沟道结构 饱和压降
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基于载流子抽取模型的Trench Gate/Field-stop IGBT驱动器有源箝位功能分析 被引量:1
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作者 陈玉香 罗皓泽 +1 位作者 李武华 何湘宁 《电源学报》 CSCD 2016年第6期136-142,共7页
针对Trench gate/Field-stop IGBT结构特有的关断过程中集电极电流下降率不可控问题,引入了载流子抽取模型来模拟器件关断过程中的集电极电流下降阶段器件内部载流子的动态行为特性,并以此为基础分析了驱动器为适应Trench gate/Field-St... 针对Trench gate/Field-stop IGBT结构特有的关断过程中集电极电流下降率不可控问题,引入了载流子抽取模型来模拟器件关断过程中的集电极电流下降阶段器件内部载流子的动态行为特性,并以此为基础分析了驱动器为适应Trench gate/Field-Stop IGBT结构这种关断特性而引入的有源箝位功能的作用机理,验证了载流子抽取模型在器件级与电路级交互作用分析中的实用性,为后续实现器件与电路的最佳匹配奠定了基础。 展开更多
关键词 trench gate/Field-Stop IGBT 集电极电流下降率 不可控性 载流子抽取模型 有源箝位功能
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Electrodeposition of Gold to Conformally Fill High-Aspect-Ratio Nanometric Silicon Grating Trenches: A Comparison of Pulsed and Direct Current Protocols 被引量:2
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作者 Sami Znati Nicholas Chedid +3 位作者 Houxun Miao Lei Chen Eric E. Bennett Han Wen 《Journal of Surface Engineered Materials and Advanced Technology》 2015年第4期207-213,共7页
Filling high-aspect-ratio trenches with gold is a frequent requirement in the fabrication of X-ray optics as well as micro-electronic components and other fabrication processes. Conformal electrodeposition of gold in ... Filling high-aspect-ratio trenches with gold is a frequent requirement in the fabrication of X-ray optics as well as micro-electronic components and other fabrication processes. Conformal electrodeposition of gold in sub-micron-width silicon trenches with an aspect ratio greater than 35 over a grating area of several square centimeters is challenging and has not been described in the literature previously. A comparison of pulsed plating and constant current plating led to a gold electroplating protocol that reliably filled trenches for such structures. 展开更多
关键词 PULSED ELECTROPLATING Gold ELECTROPLATING High Aspect Ratio trenchES Gold Electrodepostion Di-rect Current Electrodeposition PULSED vs. Direct Current ELECTROPLATING Atomic LAYER Deposition Platinum Seed LAYER Silicon trench Gratings trench FILLING Grating FILLING ALD Adhesive LAYER
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Fabrication of Ultra Deep Electrical Isolation Trenches with High Aspect Ratio Using DRIE and Dielectric Refill
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作者 朱泳 闫桂珍 +4 位作者 王成伟 杨振川 范杰 周健 王阳元 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2005年第1期16-21,共6页
A novel technique to fabricate ultra deep high aspect ratio electrical isolation trenches with DRIE and dielectric refill is presented.The relationship between trench profile and DRIE parameters is discussed.By optimi... A novel technique to fabricate ultra deep high aspect ratio electrical isolation trenches with DRIE and dielectric refill is presented.The relationship between trench profile and DRIE parameters is discussed.By optimizing DRIE parameters and RIE etching the trenches’ opening,the ideal trench profile is obtained to ensure that the trenches are fully refilled without voids.The electrical isolation trenches are 5μm wide and 92μm deep with 0.5μm thick oxide layers on the sidewall as isolation material.The measured I-V result shows that the trench structure has good electrical isolation performance:the average resistance in the range of 0~100V is more than 10 11Ω and no breakdown appears under 100V.This isolation trench structure has been used in fabrication of the bulk integrated micromachined gyroscope,which shows high performance. 展开更多
关键词 deep reactive ion etching electrical isolation trenches bulk microstructures monolithic integration
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Trench MOS Controlled Thyristor
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作者 张鹤鸣 戴显英 +1 位作者 张义门 林大松 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2001年第5期554-557,共4页
A new structure of power MOS-gated thyristor named Trench MOS Controlled Thyristor (TMCT) is presented.The MOSFETs used to turn on and turn off the thrysitor are formed with UMOS technology.No parasitic transistors ex... A new structure of power MOS-gated thyristor named Trench MOS Controlled Thyristor (TMCT) is presented.The MOSFETs used to turn on and turn off the thrysitor are formed with UMOS technology.No parasitic transistors exist in this structure,so the problems created by the parasitic transistors can be eliminated.So,the TMCT is expected to be of better performance.The experimental results of the multicellular 600V TMCT with the active area of 02mm2 show that the on-state drop is 125V at 300A/cm2,and the maximum controllable current reaches 296A/cm2 at the gate voltage of -20V and with an inductive load. 展开更多
关键词 trench MOS THYRISTOR parasitic transistors
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A Novel Polysilicon and Oxide Sandwich Deep Trench with Field Limiting Ring for RF Power Transistors
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作者 齐臣杰 傅军 +1 位作者 王军军 刘理天 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2004年第11期1398-1402,共5页
A vertical sandwich deep trench with a field limiting ring is proposed to improve the breakdown voltage of power devices and high voltage devices.Simulation result shows that nearly 100% breakdown voltage of the plane... A vertical sandwich deep trench with a field limiting ring is proposed to improve the breakdown voltage of power devices and high voltage devices.Simulation result shows that nearly 100% breakdown voltage of the plane junction can be realized. 展开更多
关键词 deep trench field limiting ring breakdown voltage
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Study on Hydrodynamic Characteristics of Pipelines in Open Trenches
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作者 张日向 邢至庄 郭建江 《China Ocean Engineering》 SCIE EI 1999年第4期419-428,共10页
Based on hydrodynamic model tests, the relationship between relative hydrodynamic coefficient and cycle coefficient K-c is obtained by introducing the relative trench shape coefficient a(r); there isa good relation fo... Based on hydrodynamic model tests, the relationship between relative hydrodynamic coefficient and cycle coefficient K-c is obtained by introducing the relative trench shape coefficient a(r); there isa good relation for the shallow trench. According to a(r) of the designed trench shape and pre-chosen K-c, the reduction coefficient and sheltering effect can be decided by the result provided in this paper. 展开更多
关键词 trench PIPELINE hydrodynamic characteristics relative trench shape coefficient cycle coefficient
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600V的TrenchStop^TM IGBT
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《电子产品世界》 2005年第01A期i003-i003,共1页
新的600VTrenchStop^TM 1GBT在提高能量使用效率上创造了一个里程碑。它将英飞凌公司杰出的trench技术fieldstop技术完美结合。在不增加开关能量损失的情况下,将饱和电压显著地减少到标准NPT1GBTs所提供的饱和电平以下。
关键词 trenchStop^TM IGBT 英飞凌公司 trench技术 fieldstop技术 性能特征
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部分埋氧的超结Trench VDMOS的设计与研究 被引量:2
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作者 问磊 范文天 徐申 《电子器件》 CAS 北大核心 2019年第3期541-544,共4页
在原有的超结Trench VDMOS技术的基础上引入部分埋氧层,设计了一种新型的部分埋氧的抗辐照超结沟槽功率器件。在Sentaurus TCAD软件环境下,使用SDE和Sdevice仿真模拟,通过调节部分埋氧层的长度,埋氧深度以及厚度等参数,对其耐压,导通电... 在原有的超结Trench VDMOS技术的基础上引入部分埋氧层,设计了一种新型的部分埋氧的抗辐照超结沟槽功率器件。在Sentaurus TCAD软件环境下,使用SDE和Sdevice仿真模拟,通过调节部分埋氧层的长度,埋氧深度以及厚度等参数,对其耐压,导通电阻,动态特性以及抗辐照能力进行仿真和分析。当埋氧层深度为0.8 μm,埋氧层长度0.4 μm,其耐压相对于传统的超结Trench VDMOS提高了10%, Vgate=4.5V时Rdson为7.74E4 Ω·μm,器件抗辐照能力大大提高。 展开更多
关键词 trench VDMOS 超结 抗辐照 SOI Sentaurus
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Analysis and design of open trench barriers in screening steady-state surface vibrations 被引量:11
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作者 Ankurjyoti Saikia Utpal Kumar Das 《Earthquake Engineering and Engineering Vibration》 SCIE EI CSCD 2014年第3期545-554,共10页
The problem of vibration isolation by rectangular open trenches in a plane strain context is numerically studied using a finite element code, PLAXIS. The soil media is assumed to be linear elastic, isotropic, and homo... The problem of vibration isolation by rectangular open trenches in a plane strain context is numerically studied using a finite element code, PLAXIS. The soil media is assumed to be linear elastic, isotropic, and homogeneous subjected to a vertical harmonic load producing steady-state vibration. The present model is validated by comparing it with previously published works. The key geometrical features of a trench, i.e., its depth, width, and distance from the source of excitation, are normalized with respect to the Rayleigh wavelength. The attenuation of vertical and horizontal components of vibration is studied for various trench dimensions against trench locations varied from an active to a passive case. Results are depicted in non-dimensional forms and conclusions are drawn regarding the effects of geometrical parameters in attenuating vertical and horizontal vibration components. The screening efficiency is primarily governed by the normalized depth of the barrier. The effect of width has little significance except in some specific cases. Simplified regression models are developed to estimate average amplitude reduction factors. The models applicable to vertical vibration cases are found to be in excellent agreement with previously published results. 展开更多
关键词 finite element open trench vibration isolation wave barrier non-dimensional
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A New Soil Infiltration Technology for Decentralized Sewage Treatment:Two-Stage Anaerobic Tank and Soil Trench System 被引量:14
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作者 YE Chun HU Zhan-Bo +2 位作者 KONG Hai-Nan WANG Xin-Ze HE Sheng-Bing 《Pedosphere》 SCIE CAS CSCD 2008年第3期401-408,共8页
The low removal efficiency of total nitrogen (TN) is one of the main disadvantages of traditional single stage subsurface infiltration system, which combines an anaerobic tank and a soil filter field. In this study,... The low removal efficiency of total nitrogen (TN) is one of the main disadvantages of traditional single stage subsurface infiltration system, which combines an anaerobic tank and a soil filter field. In this study, a full-scale, two-stage anaerobic tank and soil trench system was designed and operated to evaluate the feasibility and performances in treating sewage from a school campus for over a one-year monitoring period. The raw sewage was prepared and fed into the first anaerobic tank and second tank by 60% and 40%, respectively. This novel process could decrease chemical oxygen demand with the dichromate method by 89%-96%, suspended solids by 91%-97%, and total phosphorus by 91%-97%. The denitrification was satisfactory in the second stage soil trench, so the removals of TN as well as ammonia nitrogen (NH4^+-N) reached 68%-75% and 96% 99%, respectively. It appeared that the removal efficiency of TN in this two-stage anaerobic tank and soil trench system was more effective than that in the single stage soil infiltration system. The effluent met the discharge standard for the sewage treatment plant (GB18918-2002) of China. 展开更多
关键词 decentralized treatment nitrogen removal soil trench system subsurface infiltration
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An oxide filled extended trench gate super junction MOSFET structure 被引量:6
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作者 王彩琳 孙军 《Chinese Physics B》 SCIE EI CAS CSCD 2009年第3期1231-1236,共6页
This paper proposes an oxide filled extended trench gate super junction (SJ) MOSFET structure to meet the need of higher frequency power switches application. Compared with the conventional trench gate SJ MOSFET, ne... This paper proposes an oxide filled extended trench gate super junction (SJ) MOSFET structure to meet the need of higher frequency power switches application. Compared with the conventional trench gate SJ MOSFET, new structure has the smaller input and output capacitances, and the remarkable improvements in the breakdown voltage, on-resistance and switching speed. Furthermore, the SJ in the new structure can be realized by the existing trench etching and shallow angle implantation, which offers more freedom to SJ MOSFET device design and fabrication. 展开更多
关键词 power MOSFET super junction trench gate shallow angle implantation
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Microbial diversity in the sediments of the southern Mariana Trench 被引量:3
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作者 LI Yingjie CAO Wenrui +1 位作者 WANG Yan MA Qingjun 《Journal of Oceanology and Limnology》 SCIE CAS CSCD 2019年第3期1024-1029,共6页
Microbial diversity in the abyssal sediments beneath the seafloor of 30,94,and 151cm near the southern end of the Mariana Trench was analyzed in the Illumina HiSeq 2500 platform.Results show that the microbial populat... Microbial diversity in the abyssal sediments beneath the seafloor of 30,94,and 151cm near the southern end of the Mariana Trench was analyzed in the Illumina HiSeq 2500 platform.Results show that the microbial populations were dominated by bacteria but merely no archaea were identifi ed at the three depths.In the bacterial community,Proteobacteria and Firmicutes dominated the total taxon tags,followed by Bacteroidetes,Actinobacteria,Planctomycetes,Cyanobacteria,and Chloroflexi,which together account for over 99%of the total population.Similar to that in the seawater in the trench,the operational taxonomic units(OTUs)belonging to Gammaproteobacteria from the sediment samples showed high abundance.However,common bacterial OTUs in the water of the trench including Nitrospirae and Marinimicrobia were hardly found in the sediments from the southern Mariana Trench or the hadal region.Therefore,this study documented for the first time the compositions of microbial diversity in the trench sediments,revealed the difference in microbial diversity in water and sediment of the trench and will enrich the knowledge on the microbial diversity in the abyssal areas. 展开更多
关键词 MARIANA trench MICROBIAL diversity HIGH-THROUGHPUT SEQUENCING technology
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A novel 4H-SiC trench MOSFET with double shielding structures and ultralow gate-drain charge 被引量:3
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作者 Xiaorong Luo Tian Liao +3 位作者 Jie Wei Jian Fang Fei Yang Bo Zhang 《Journal of Semiconductors》 EI CAS CSCD 2019年第5期71-76,共6页
A new ultralow gate–drain charge(Q_(GD)) 4 H-SiC trench MOSFET is presented and its mechanism is investigated by simulation. The novel MOSFET features double shielding structures(DS-MOS): one is the grounded split ga... A new ultralow gate–drain charge(Q_(GD)) 4 H-SiC trench MOSFET is presented and its mechanism is investigated by simulation. The novel MOSFET features double shielding structures(DS-MOS): one is the grounded split gate(SG), the other is the P+shielding region(PSR). Both the SG and the PSR reduce the coupling effect between the gate and the drain, and transform the most part of the gate–drain capacitance(C_(GD)) into the gate–source capacitance(C_(GS)) and drain–source capacitance(C_(DS)) in series.Thus the C_(GD) is reduced and the proposed DS-MOS obtains ultralow Q_(GD). Compared with the double-trench MOSFET(DT-MOS)and the conventional trench MOSFET(CT-MOS), the proposed DS-MOS decreases the Q_(GD) by 85% and 81%, respectively.Moreover, the figure of merit(FOM), defined as the product of specific on-resistance(R_(on, sp)) and Q_(GD)(R_(on, sp)Q_(GD)), is reduced by 84% and 81%, respectively. 展开更多
关键词 SiC trench MOSFET reverse transfer capacitance gate-drain CHARGE figure of merit
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