Application of Lanthanum in High Strength and High Conductivity Copper Alloys

China is quite poor in argent resource. Roughly 80% of this industrial argent is imported every year. In order to improve the situation, we took advantage of rare earth (RE) mineral resource and successfully developed the non-argent Lanthanum-tellurium-copper alloy as a substitute for industry argent-copper. In our research, we were able to successfully apply rare earth lanthanum to copper alloy. The defects as porosity, inclusion, etc. originating from nonvacuum melting processing were controlled. Fine grain was obtained. Meanwhile, the comprehensive properties of the copper alloy, such as strength, conductivity and thermal conductivity were improved. The research results in increasing conductivity and thermal conductivity by 5% and 15%, respectively, while the tensile strength is increased by 6% higher than Ag-Cu alloy. The anti-electric corrosion property is good, and there is no argent-cadmium steam population originating from the electric arc effect. The addition of lanthanum further reduces the content of oxygen and hydrogen. The optimum quantity of the addition of RE lanthanum in the copper alloy is 0.010% - 0.020% .

Fabrication and thermal conductivity of copper matrix composites reinforced by tungsten-coated carbon nanotubes

Carbon nanotubes （CNTs） were coated by tungsten using metal organic chemical vapor deposition. Magnetic stirring was employed to disperse the W-coated CNTs （W-CNTs） in a Cu matrix, and then, the mixed powders were consolidated by spark plasma sintering. The W-CNTs obtained a uniform dispersion within the Cu matrix when the W-CNT content was less than 5.0vo1%, but high content of W-CNTs （10vol%） resulted in the presence of clusters. The W-CNT/Cu composites containing low content of W-CNTs （〈5.0vol%） exhibited a higher thermal conductivity than the sintered pure Cu, while the CNT/Cu composites exhibited no increase in thermal conductivity after the incorporation of uncoated CNTs. The W-CNT content was found to play a crucial role in determining the thermal conductivity of the W-CNT/Cu composites. The thermal conductivity of the W-CNT/Cu composites increased first and then decreased with the W-CNT content increasing. When the W-CNT content was 2.5vo1%, the W-CNT/Cu composite obtained the maximum value of thermal conductivity. The thermal resistance of the （W-CNT）-Cu interface was predicted in terms of Maxwell-Gamett effective medium approximation, and its calculated value was about 3.0× 10-9 m2.K.W-l.

Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method

The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied. The composites were prepared through pressure infiltration of liquid copper into diamond preforms with a mixture of 40 and 100 pm-size diamonds. The permeability of the preforms with different coarse-to-fine volume ratios of diamonds was investigated. The thermal conductivity of the diamond/copper composites with bimodal size distribution was compared to the theoretical value derived from an analytical model developed by Chu. It is predicted that the diamond/copper composites could reach a higher thermal conductivity and their surface roughness could be improved by applying bimodal diamond particle sizes.

Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering

Nickel-coated graphite flakes/copper（GN/Cu） composites were fabricated by spark plasma sintering with the surface of graphite flakes（GFs） being modified by Ni–P electroless plating. The effects of the phase transition of the amorphous Ni–P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity（TC） of the GN/Cu composites were systematically investigated. The introduction of Ni–P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650℃ and slightly increased the TC of the X–Y basal plane of the GF/Cu composites with 20 vol%–30 vol% graphite flakes. However, when the graphite flake content was greater than 30 vol%, the TC of the GF/Cu composites decreased with the introduction of Ni–P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.

Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique

Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature （HPHT） sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding strength and thermo-physical properties of the composites were achieved using an atomized copper alloy with minor additions of Co, Cr, 13, and Ti. The thermal conductivity （TC） oh- mined exhibited as high as 688 W.m-1.K-1, but also as low as 325 W.m-1.K-l. A large variation in TC can be rationalized by the discrepancy of diamond-matrix interfacial bonding. It was found from fractography that preferential bonding between diamond and the Cu-alloy matrix occurred only on the diamond {100} faces. EDS analysis and Raman spectra suggested that selective interfacial bonding may be attributed to amorphous carbon increasing the wettability between diamond and the Cu-alloy matrix. Amorphous carbon was found to significantly affect the TC of the composite by interface modification.

Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration

Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters （temperature, pressure, and time）. The improvement in interfacial bonding strength and the maximum thermM conductivity of 750 W/（m.K） were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.

Finite Difference Approximation for Solving Transient Heat Conduction Equation of Copper

In this paper, a numerical technique is proposed to obtain the solution for transient heat conduction equation of Copper. The copper element is characterized by many characteristics;the most important of which is its high ability to conduct heat and electrical conductivity, in addition to being a flexible and malleable metal that is easy to form without being broken, making it one of the basic minerals that humans have benefited from for thousands of years, it is one of the first minerals. That has been discovered and extracted, and still plays a major role in the development of societies. The obtained solutions are compared with the available exact solutions and the obtained solutions using the finite difference method. The results indicate that the finite difference method is a highly effective method for obtaining approximate solutions for the thermal conductivity equation for copper. It is also clear from the numerical results from copper in the high conductivity of heat and electricity.

Thermodynamic Calculation Method for Formation of Rare Earth Inclusions in Conductive Copper

The thermodynamic calculation method for the formation of rare-earth inclusions in conductive copper was discussed. After the formation sequence was calculated, the thermodynamic condition for the inter-change between RE inclusions was further calculated. As an example, thermodynamic law of the formation for all kinds of cerium inclusions was discussed in conductive copper alloyed by cerium. The theoretical results are shown to be in good agreement with the experimental results.

Evolution of copper nanowires through coalescing of copper nanoparticles induced by aliphatic amines and their electrical conductivities in polyester films

Copper nanowires were synthesized by the wet chemical reduction method using copper sulfate as the copper precursor,aliphatic amines(methylamine,ethanediamine,1,2-propanediamine)as the inducing reagents,and hydrazine hydrate as the reductant through the aging and reduction processes.The high-resolution transmission electron microscopy(HRTEM)images reveal that the copper nanowires were synthesized by coalescing extremely small-sized copper nanoparticles with the particle sizes of1–6 nm in copper complex micelles.A longer aging time period favored the coalescing of the copper nanoparticles to form thinner copper nanowires in the following reduction process.The coalescing extent of copper nanoparticles in copper nanowires was highly enhanced by ethanediamine and 1,2-propanediamine as compared with that by methylamine.The copper nanowire-filled polyester films had higher electrical conductivity than the copper nanoparticle-filled ones.

Conductive Polyacrylonitrile Fiber Prepared by Copper Plating with L-Ascorbic Acid as Reducing Agent

Conductive polyacrylonitrile fibers were prepared by electroless copper plating under weak alkaline conditions,with L-ascorbic acid as reducing agent.The influences of CuSO_(4)·5H_(2)O,L-ascorbic acid,2,2′-bipyridine and K_(4)Fe(CN)_(6) concentration on the conductivity and mass gain percentage of the fibers were studied.The morphological structure of the fibers was characterized by scanning electron microscopy(SEM),and the mechanical properties of the fibers were analyzed through the mechanical property test.The results showed that the optimal reaction conditions were as follows:26 g/L CuSO_(4)·5H_(2)O,26 g/L L-ascorbic acid,12 mg/L 2,2′-bipyridine,7 mg/L K 4Fe(CN)6,and 38℃.The volume resistivity of the conductive PAN fibers prepared by the process was only 3.84×10^(-3)Ω·cm.

Effect of Curing Procedure on the Properties of Copper-Powder-Filled Conductive Adhesives

By means of testing the shear strength with single lap joint, measuring electrical resistivity for cured products and the curing strain with strain gauges, the effect of cure parameters on the properties of HT1012 conductive adhesive filled with copper powder was investigated, and the residual stress in the conductive adhesives was also estimated. The experimental results show that the properties such as shear strength of the adhesives, electrical resistivity of products as well as the residual stress of cured HT 1012 copperfitted conductive adhesive were evidently affected by curing temperature and time. The diagrams of scanning electron microscopy （SEM） and Fourier transform infrared （FT-IR） were also used to determine the properties. The higher mechanical property was achieved under the condition of curing the adhesive 3 h at 60 ℃ as the density of the hydrogen links or linkages existed in the adhesive was relatively higher and the lower electrical resistivity occurred at 80 ℃.

Copper Ions Removal from Wastewater by Electrocoagulation Using Cement-based Cathode Plates

The present work uses PEO solution to well disperse carbon fiber and identifies percolation thresholds of carbon fiber and carbon black which are used as conductive fillers.The resultant cathode plates have an average compressive strength of 27.3 MPa and flexural strength of 29.09 MPa,which demonstrate excellent mechanical properties.The Cu^(2+)removal efficiency was measured at different current densities in EC process with cement-based cathode plate,while the voltage changes were recorded.The results showed that the cement-based cathode plate operated stably and achieved 99.7%removal of 1 L of simulated wastewater with a Cu^(2+)concentration of 200 ppm at a current density of 8 m A/cm^(2)for 1 h.Characterization of floc and tested cathode plates,SEM and EDS analyses,and repeatability testing of the tested plates demonstrate the reusability of the plates,proving that cement-based plates can effectively replace metal cathode plates,reduce the cost of EC and improve the applicability of EC devices.

导热绝缘高密度聚乙烯复合材料的制备与性能

文中采用片层状绝缘导热六方氮化硼(h-BN)和高导热导电铜粉(Cu)复配填充来提升高密度聚乙烯(HDPE)的导热性能。控制导热填料总体积分数为30%,通过改变h-BN和Cu在HDPE中的复配比例,实现复合材料中导热网络通路的构建。扫描电镜结果表明,h-BN进入Cu粉无法占据的HDPE基体,起到桥梁作用。h-BN通过连接其周围的Cu粒子,促进了HDPE内部导热网络的形成与构筑。Hot Disk测试结果表明,随着h-BN/Cu比值增加,HDPE复合材料导热系数增大。当V(h-BN):V(Cu)≤1时,大片径h-BN_(30)/Cu体系的热导率高于小片径h-BN_(05)/Cu改性体系;与之相反,当V(h-BN):V(Cu)>1时,相对于大片径h-BN_(30),小片径h-BN_(05)对复合体系热导率的贡献更明显。通过调控h-BN与Cu的含量,实现了在抑制导电网络形成的前提下大幅改善复合材料的导热性能。其研究工作为导热绝缘复合材料的设计制备提供参考。

大吨位高强高导铜材料的连续化绿色生产

系统研究了高强高导铜材料的强化机理和制造技术,提出了“增强强化相”(提高弥散强化相强度)、“超饱和固溶”(提高基体中弥散强化相浓度)、“柔性包裹铜晶界”(提高材料高温强度等新型强化机制)的创新思路,为同时具有高强度和高导电、高导热的铜基材料成份和显微组织设计提供了理论基础,并在材料学科权威期刊发表相关论文20余篇。发展出高强高导铜的大吨位、连续化、绿色制造技术,实现了全真空大吨位铬锆铜材料的规模生产,具有工艺简单、流程短,所制备的材料结构全致密、显微组织无偏析、性能均匀一致等优点。高强高导铜材料生产项目技术评估价为1500万元,采用混合实施模式(支付西安交通大学300万元现金,发明人技术入股1200万元),与陕煤集团合作成立了发明人技术入股、骨干团队现金参股的混合所有制企业。建成了一期千吨量级生产线,产品在多个国家龙头企业获得规模应用,并即将建设万吨量级生产线,对于国家高铁、芯片、发动机等多个领域关键材料的升级换代具有重要意义。

制备工艺参量对超大颗粒石墨/铜基复合材料基本性能的影响

添加超大石墨颗粒来提高铜的润滑性能具有制备操作简便、工艺成本低等优点。文章在研制超大粒度石墨颗粒作为功能相的铜基复合材料基础上,探讨制备工艺参量对该复合材料热导率、压缩强度和摩擦系数等基本性能的影响。研究发现,该复合制品的热导率明显大于采用等质量的较小粒度石墨原料的复合制品;石墨含量越多,颗粒越小,铜/石墨复合样品的热导率就越低。结果表明,该复合制品的规定非比例压缩强度和抗压强度均明显高于采用较小石墨颗粒的复合制品,其力学性能主要与石墨颗粒大小和添加量有关。在本工作的粒度范围(120~1500μm)和含量范围(5%~15%)内,石墨颗粒越大,含量越少,其复合制品的力学强度就越好。研究还表明:该复合制品的摩擦系数与采用等质量的较小粒度石墨原料的复合制品基本相当;对于摩擦性能,本工作中的石墨含量以10%为佳,粒度以32目即约为720μm为佳。

真空蒸镀钨改性金刚石/铜硼复合材料导热性能

采用真空蒸镀法在平板金刚石衬底表面镀覆钨镀层,构建多层平板结构以研究热处理温度对金刚石表面钨界面层形貌结构、物相成分及其与金刚石基体间界面结合情况的影响,并为金刚石颗粒表面金属化改性提供实验指导。在此基础上,以相同真空蒸镀和热处理工艺制备的钨改性金刚石颗粒作为增强体,以铜硼合金作为基体,采用气体压力浸渗法制备相应的金刚石/铜硼复合材料,探究金刚石颗粒的热处理温度对复合材料导热性能的影响。结果表明:随着热处理温度的升高,复合材料热导率呈现先上升后下降的趋势,当热处理温度为1000℃时,复合材料界面结合明显改善,同时金刚石表面钨镀层依旧连续完整,此时,复合材料的热导率最高可达629 W/(m∙K)。

超级柔韧性和优异电磁屏蔽性能的PVA-co-PE纳米纤维覆铜膜

本工作通过紫外辐射诱导和化学还原反应相结合成功制备了具有多级结构的聚乙烯醇-聚乙烯(PVA-co-PE)纳米纤维覆铜膜,PVA-co-PE纳米纤维覆铜膜具有超级柔韧性能和电磁屏蔽性能,且具有多次循环压缩后性能不减的稳定性。首先通过紫外辐照引入一定量的活化羟基,然后通过静电配位和铜粒子的化学还原作用,在纳米纤维膜上实现无钯镀铜。采用傅里叶红外光谱仪(AIR-FTIR)、能量色散型X射线荧光分析仪(EDX-7000)、扫描电子显微镜(SEM)等对样品进行结构性能分析。结果表明,成功实现PVA-co-PE纳米纤维覆铜膜的制备,SEM图表明,铜颗粒均匀分布于纳米纤维膜表面,并且薄膜由亲水转变为不易浸润。通过四探针仪器和矢量网络分析仪表征了薄膜材料的导电性和电磁屏蔽性能。结果表明,覆铜膜达到导体水平,吸波值达到47.3 dB。经过多次循环压缩后覆铜膜材料电磁屏蔽性能几乎不减,说明制得的纳米纤维覆铜膜具有优异的柔韧性和吸波稳定性,其在柔性智能可穿戴元器件领域具有广阔的应用空间。

金刚石粒径对金刚石/Cu-B合金复合材料热物理性能的影响

采用Cu-B合金为基体,选用粒径分别为110、230、550μm的金刚石颗粒作为增强体,利用气压熔渗工艺在1100℃、10 MPa气体压力下制备金刚石/Cu-B合金复合材料,研究金刚石颗粒粒径对复合材料组织结构、界面相分布及热物理性能的影响。结果表明,随着金刚石粒径的增大,复合材料热导率上升,热膨胀系数减小,复合材料界面处硼碳化合物含量增加,界面结合情况得到改善。由金刚石颗粒粒径为550μm时,复合材料热导率最高,可达680.3 W/(m·K),热膨胀系数最小,为4.905×10^(−6)K^(−1),符合高效热管理器件对金刚石/金属基复合材料的热物理性能要求,在电子产品散热器件方面具有良好的应用前景。