The influence of silicon slice flatness on bonding technology and the relation between a foreign particle and resulting bubble are quantitatively presented by the elastic theory. It is demonstrated experimentally by X...The influence of silicon slice flatness on bonding technology and the relation between a foreign particle and resulting bubble are quantitatively presented by the elastic theory. It is demonstrated experimentally by X-ray double crystal diffractometry and infrared imager.展开更多
In this paper, two types of high loft nonwoven fabrics have been constructed in the laboratory apparatus made by ourselves with different binders (polyamide and polyethylene powder) and varying binder contents (10%, 2...In this paper, two types of high loft nonwoven fabrics have been constructed in the laboratory apparatus made by ourselves with different binders (polyamide and polyethylene powder) and varying binder contents (10%, 20%, 30% and 40%). The tensile and compression properties of these nonwoven fabrics were tested. It was found that one can reduce powder binder content to increase loft and softness of nonwoven fabrics, but it has to sacrifice its tensile strength. Adhesion force between binder and single fibre was also explored. The experiments showed that the adhesion force at the interface between binder and fibre depends on the fibre variety, the fibre surface morphology, heating temperature and heating time etc..展开更多
A single mode hybrid Ⅲ-Ⅴ/silicon on-chip laser based on the flip-chip bonding technology for on-chip optical interconnection is demonstrated. A single mode Fabry-Perot laser structure with micro-structures on an InP...A single mode hybrid Ⅲ-Ⅴ/silicon on-chip laser based on the flip-chip bonding technology for on-chip optical interconnection is demonstrated. A single mode Fabry-Perot laser structure with micro-structures on an InP ridge waveguide is designed and fabricated on an InP/AIGaInAs multiple quantum well epitaxial layer structure wafer by using i-line lithography. Then, a silicon waveguide platform including a laser mounting stage is designed and fabricated on a silicon-on-insulator substrate. The single mode laser is flip-chip bonded on the laser mounting stage. The lasing light is butt-coupling to the silicon waveguide. The laser power output from a silicon waveguide is 1.3roW, and the threshold is 37mA at room temperature and continuous wave operation.展开更多
Ultra-thin hot-rolled strip is the developing result of the modern plate and strip rolling technology and can be used to replace cold-rolled products for energy saving and emission reduction.This work reviews recent p...Ultra-thin hot-rolled strip is the developing result of the modern plate and strip rolling technology and can be used to replace cold-rolled products for energy saving and emission reduction.This work reviews recent progress and breakthroughs in this field by focusing on three recent technologies,namely the conventional strip with hot coil box and endless rolling,thin slab continuous casting and rolling/semi endless rolling,and endless compact rolling.In summary,ensuring high-quality production is an important bottleneck for ultra-thin strip and ferritic hot rolling by endless compact rolling.This production technology has strong feasibility and broad prospects for future development.展开更多
目的在离体牙牙本质上涂布粘接剂后分别予以声波技术充填Sonicfill树脂及分层充填P60树脂,评估应用两种复合树脂与牙本质的剪切粘接强度。方法选择因牙周病拔除的磨牙40颗,制成40个牙本质试件,随机分为2组。A组为Sonicfill树脂组,B组为...目的在离体牙牙本质上涂布粘接剂后分别予以声波技术充填Sonicfill树脂及分层充填P60树脂,评估应用两种复合树脂与牙本质的剪切粘接强度。方法选择因牙周病拔除的磨牙40颗,制成40个牙本质试件,随机分为2组。A组为Sonicfill树脂组,B组为P60树脂组。每组涂布粘接剂后,A组采用声波技术充填树脂,B组采用分层技术充填树脂。经过循环温度为5℃及55℃的冷热循环疲劳试验,每个循环为3 min,共循环500次后,测试2组的剪切粘接强度(Shear Bond Strength,SBS)。结果A组的SBS为(10.32±1.13)MPa,B组的SBS为(8.43±0.98)MPa,两者差别有统计学意义(P<0.05)。结论运用声波技术的Sonicfill树脂充填体相比采用分层充填的P60树脂拥有更高的剪切粘接强度。因此,在修复过程中使用声波充填技术不亚于传统分层充填树脂,且临床操作时间更短。展开更多
文摘The influence of silicon slice flatness on bonding technology and the relation between a foreign particle and resulting bubble are quantitatively presented by the elastic theory. It is demonstrated experimentally by X-ray double crystal diffractometry and infrared imager.
文摘In this paper, two types of high loft nonwoven fabrics have been constructed in the laboratory apparatus made by ourselves with different binders (polyamide and polyethylene powder) and varying binder contents (10%, 20%, 30% and 40%). The tensile and compression properties of these nonwoven fabrics were tested. It was found that one can reduce powder binder content to increase loft and softness of nonwoven fabrics, but it has to sacrifice its tensile strength. Adhesion force between binder and single fibre was also explored. The experiments showed that the adhesion force at the interface between binder and fibre depends on the fibre variety, the fibre surface morphology, heating temperature and heating time etc..
基金Supported by the National Basic Research Program of China under Grant No 2012CB933501the National Natural Science Foundation of China under Grant Nos 61307033,61274070,61137003 and 61321063
文摘A single mode hybrid Ⅲ-Ⅴ/silicon on-chip laser based on the flip-chip bonding technology for on-chip optical interconnection is demonstrated. A single mode Fabry-Perot laser structure with micro-structures on an InP ridge waveguide is designed and fabricated on an InP/AIGaInAs multiple quantum well epitaxial layer structure wafer by using i-line lithography. Then, a silicon waveguide platform including a laser mounting stage is designed and fabricated on a silicon-on-insulator substrate. The single mode laser is flip-chip bonded on the laser mounting stage. The lasing light is butt-coupling to the silicon waveguide. The laser power output from a silicon waveguide is 1.3roW, and the threshold is 37mA at room temperature and continuous wave operation.
文摘Ultra-thin hot-rolled strip is the developing result of the modern plate and strip rolling technology and can be used to replace cold-rolled products for energy saving and emission reduction.This work reviews recent progress and breakthroughs in this field by focusing on three recent technologies,namely the conventional strip with hot coil box and endless rolling,thin slab continuous casting and rolling/semi endless rolling,and endless compact rolling.In summary,ensuring high-quality production is an important bottleneck for ultra-thin strip and ferritic hot rolling by endless compact rolling.This production technology has strong feasibility and broad prospects for future development.
文摘目的在离体牙牙本质上涂布粘接剂后分别予以声波技术充填Sonicfill树脂及分层充填P60树脂,评估应用两种复合树脂与牙本质的剪切粘接强度。方法选择因牙周病拔除的磨牙40颗,制成40个牙本质试件,随机分为2组。A组为Sonicfill树脂组,B组为P60树脂组。每组涂布粘接剂后,A组采用声波技术充填树脂,B组采用分层技术充填树脂。经过循环温度为5℃及55℃的冷热循环疲劳试验,每个循环为3 min,共循环500次后,测试2组的剪切粘接强度(Shear Bond Strength,SBS)。结果A组的SBS为(10.32±1.13)MPa,B组的SBS为(8.43±0.98)MPa,两者差别有统计学意义(P<0.05)。结论运用声波技术的Sonicfill树脂充填体相比采用分层充填的P60树脂拥有更高的剪切粘接强度。因此,在修复过程中使用声波充填技术不亚于传统分层充填树脂,且临床操作时间更短。
