Effect of thermal annealing on the upgraded metallurgical grade（UMG）-Si was investigated under different conditions.The dislocation,grain boundaries and preferred growth orientation of Si ingot were characterized by...Effect of thermal annealing on the upgraded metallurgical grade（UMG）-Si was investigated under different conditions.The dislocation,grain boundaries and preferred growth orientation of Si ingot were characterized by optical microscopy,electron back scattering diffraction（EBSD） and X-ray diffractometry（XRD）,respectively.The arrange order of dislocation density of Si ingot is from the lowest in the middle to the lower in the bottom and low in the top before and after annealing.And it decreases gradually with increase of the annealing temperature.The number of small angle grain boundaries declines gradually until disappears whereas the proportion of coincidence site lattice（CSL） grain boundaries increases firstly and then decreases.The twin boundary Σ3 reaches the highest proportion of 28% after annealing at 1 200 ℃ for 3 h.Furthermore,the crystal grains in different positions gain the best preferred growth orientation,which can promote the following machining of Si ingot and the conversion efficiency of solar cells.展开更多
High temperature annealing was performed on upgraded metallurgical grade multicrystalline silicon (UMG multi-Si) wafers with a purity of 99.999%. The samples were mechanically polished and chemically etched, and then ...High temperature annealing was performed on upgraded metallurgical grade multicrystalline silicon (UMG multi-Si) wafers with a purity of 99.999%. The samples were mechanically polished and chemically etched, and then the microstructures were observed by a scanning electron microscope (SEM). The minority carrier lifetime and resistivity of the samples were measured using microwave photoconductance decay and four-point probe techniques, respectively. The results show that the electrical properties of the samples decrease rather than increase as the annealing temperature increases, while the number of dislocations in bulk Si reduced or even disappeared after annealing for 6 hours at 1100–1400°C. It is considered that the structural microdefects induced by the high concentration of metal impurities (including interstitial or substitutional impurities and nanoscale precipitates) determine the minority carrier recombination activity and thus the electrical properties of UMG multi-Si wafers rather than dislocations in bulk Si.展开更多
基金Project(SKL2009-8)supported by the State Key Laboratory of Silicon Materials,Zhejiang University,ChinaProject(NCET-07-0387)supported by the New Century Excellent Researcher Award Program from Ministry of Education of China
文摘Effect of thermal annealing on the upgraded metallurgical grade（UMG）-Si was investigated under different conditions.The dislocation,grain boundaries and preferred growth orientation of Si ingot were characterized by optical microscopy,electron back scattering diffraction（EBSD） and X-ray diffractometry（XRD）,respectively.The arrange order of dislocation density of Si ingot is from the lowest in the middle to the lower in the bottom and low in the top before and after annealing.And it decreases gradually with increase of the annealing temperature.The number of small angle grain boundaries declines gradually until disappears whereas the proportion of coincidence site lattice（CSL） grain boundaries increases firstly and then decreases.The twin boundary Σ3 reaches the highest proportion of 28% after annealing at 1 200 ℃ for 3 h.Furthermore,the crystal grains in different positions gain the best preferred growth orientation,which can promote the following machining of Si ingot and the conversion efficiency of solar cells.
基金supported by the National Natural Science Foundation of China (50802118)
文摘High temperature annealing was performed on upgraded metallurgical grade multicrystalline silicon (UMG multi-Si) wafers with a purity of 99.999%. The samples were mechanically polished and chemically etched, and then the microstructures were observed by a scanning electron microscope (SEM). The minority carrier lifetime and resistivity of the samples were measured using microwave photoconductance decay and four-point probe techniques, respectively. The results show that the electrical properties of the samples decrease rather than increase as the annealing temperature increases, while the number of dislocations in bulk Si reduced or even disappeared after annealing for 6 hours at 1100–1400°C. It is considered that the structural microdefects induced by the high concentration of metal impurities (including interstitial or substitutional impurities and nanoscale precipitates) determine the minority carrier recombination activity and thus the electrical properties of UMG multi-Si wafers rather than dislocations in bulk Si.
