SiCp/2014Al composites were bonded with the vacuum diffusion welding technique using Ni as the interlayer metal. Ni and Al were interdiffused and there were intermetallic compounds formed in the inter transition layer...SiCp/2014Al composites were bonded with the vacuum diffusion welding technique using Ni as the interlayer metal. Ni and Al were interdiffused and there were intermetallic compounds formed in the inter transition layer, which was composed of Ni3Al//NiAl//NiAl3. The relation between the diffusion distance and the element concentration was calculated according to Fick＇s second law. The relations of the diffusion concentration and the diffusion welding technique parameters were calculated.展开更多
用固态扩散方法实现了CoCrFeMnNi高熵合金与铜在温度750~850℃下的良好连接,利用扫描电镜(Scanning electron microscope,SEM)、能谱(Energy disperse spectroscopy,EDS)分析、显微硬度测试及拉伸试验研究扩散反应温度对其界面反应行为...用固态扩散方法实现了CoCrFeMnNi高熵合金与铜在温度750~850℃下的良好连接,利用扫描电镜(Scanning electron microscope,SEM)、能谱(Energy disperse spectroscopy,EDS)分析、显微硬度测试及拉伸试验研究扩散反应温度对其界面反应行为和接头力学性能的影响,结合菲克扩散第二定律计算和分析Cu原子在高熵合金中的扩散系数。结果表明:Cu在高熵合金一侧的扩散速率大于高熵合金组元在Cu侧的扩散,随温度增加,高熵合金组元向Cu侧扩散时其在扩散区内原子浓度分布降低的程度按Mn>Cr>Fe>Co>Ni的顺序依次减小。理论计算表明,Cu在高熵合金中的平均扩散系数明显小于铜在不锈钢中的平均扩散系数。经扩散反应后,Cu/高熵合金界面附近均可形成FCC型固溶体组织的反应层,无金属间化合物产生。所有扩散连接接头拉伸后其断裂均发生在远离界面的铜侧,随扩散焊温度升高,其抗拉强度和应变有所降低,其中750℃时铜的抗拉强度与应变分别达到最大值224MPa和33%。展开更多
文摘SiCp/2014Al composites were bonded with the vacuum diffusion welding technique using Ni as the interlayer metal. Ni and Al were interdiffused and there were intermetallic compounds formed in the inter transition layer, which was composed of Ni3Al//NiAl//NiAl3. The relation between the diffusion distance and the element concentration was calculated according to Fick＇s second law. The relations of the diffusion concentration and the diffusion welding technique parameters were calculated.
文摘用固态扩散方法实现了CoCrFeMnNi高熵合金与铜在温度750~850℃下的良好连接,利用扫描电镜(Scanning electron microscope,SEM)、能谱(Energy disperse spectroscopy,EDS)分析、显微硬度测试及拉伸试验研究扩散反应温度对其界面反应行为和接头力学性能的影响,结合菲克扩散第二定律计算和分析Cu原子在高熵合金中的扩散系数。结果表明:Cu在高熵合金一侧的扩散速率大于高熵合金组元在Cu侧的扩散,随温度增加,高熵合金组元向Cu侧扩散时其在扩散区内原子浓度分布降低的程度按Mn>Cr>Fe>Co>Ni的顺序依次减小。理论计算表明,Cu在高熵合金中的平均扩散系数明显小于铜在不锈钢中的平均扩散系数。经扩散反应后,Cu/高熵合金界面附近均可形成FCC型固溶体组织的反应层,无金属间化合物产生。所有扩散连接接头拉伸后其断裂均发生在远离界面的铜侧,随扩散焊温度升高,其抗拉强度和应变有所降低,其中750℃时铜的抗拉强度与应变分别达到最大值224MPa和33%。
