There is less research on vertical sculptured grinding technology. Especially in high vertical surface grinding process with the cup abrasive wheel, the thermal damage is prone to happen and undermine the grinding sur...There is less research on vertical sculptured grinding technology. Especially in high vertical surface grinding process with the cup abrasive wheel, the thermal damage is prone to happen and undermine the grinding surface integrity. This problem limits to improve the grinding efficiency and the grinding ratio greatly. Through the analysis of vertical surface grinding process and features in depth, this paper revealed the inherent mechanism of higher grinding temperature in the process of vertical sculptured grinding using the cup wheel. Based on the previous research achievements, the grinding experiments on TC4 (Ti-6A1-4V) and GH4169 are carried out utilizing the self-inhaling internal cooling wheel. The experimental results show that the self-inhaling internal cooling wheel can efficiently reduce the grinding surface temperature. Moreover, the inherent mechanism of reducing the grinding temperature using the internal cooling method is revealed. Meanwhile, under the same grinding conditions, the grinding ratio during the experiments on GH4169 using self-inhaling internal cooling method is about 3 times as high as using conventional external cooling method. And the grinding forces can be reduced by about 20%. This research revealed the inherent mechanism of higher grinding temperature in the process of vertical sculptured grinding using the cup wheel, which provides theoretical basis for the design and application of self-inhaling internal cooling wheel. At the same time, an efficient and non-invasive surface grinding method of TC4 and GH4169 is presented.展开更多
To meet the increasing demand on the quality and co st of precision components for the semiconductor industries, extensive studies on high efficiency and precision machining of ceramic materials have been conducted ov...To meet the increasing demand on the quality and co st of precision components for the semiconductor industries, extensive studies on high efficiency and precision machining of ceramic materials have been conducted over the past several years. It is found that the effects of grinding pressure and rotational speed of spindle in the machining for the ceramic materials are v ery significant on the quality of the grinding process. In order to achieve stab le grinding conditions for improved performance, a new grinding control scheme i n which the grinding pressure is maintained constant throughout the grinding pro cess was carried out in the present study. The surface quality of ground ceramics depends on the mechanism of material remo val in the vertical grinding process. For grinding of Si 3N 4 and glass under the condition of constant pressure, increasing pressure enhances material remova l rate, and at the same time causes more machining-induced microcracks on the g round surfaces. Along with the analysis of tangential forces, specific grinding energy, and the micro observations on ground surfaces, it can be found that low pressure and high wheel speed should be selected to high efficiently remove cera mics in ductile mode in the vertical grinding. From the theoretically analytical and measured grinding temperatures in the vert ical grinding of ceramics, it is found that the analytical temperature profile w ithε= 55% has the same trend with the measured one. The measured temperature is higher that the analytical one at the beginning stage of grinding process, whic h might be contributed to the unstable grinding condition of this stage. The gri nding temperatures in the vertical grinding of ceramics under a constant are not high enough for glassy phase formation, and may not reduce surface fracture as expected. However, the temperature in dry grinding may cause thermal damage to t he resin bond diamond wheel, thereby resulting in low quality workpiece surface.展开更多
基金supported by National Natural Science Foundation of China(Grant No.51105024)
文摘There is less research on vertical sculptured grinding technology. Especially in high vertical surface grinding process with the cup abrasive wheel, the thermal damage is prone to happen and undermine the grinding surface integrity. This problem limits to improve the grinding efficiency and the grinding ratio greatly. Through the analysis of vertical surface grinding process and features in depth, this paper revealed the inherent mechanism of higher grinding temperature in the process of vertical sculptured grinding using the cup wheel. Based on the previous research achievements, the grinding experiments on TC4 (Ti-6A1-4V) and GH4169 are carried out utilizing the self-inhaling internal cooling wheel. The experimental results show that the self-inhaling internal cooling wheel can efficiently reduce the grinding surface temperature. Moreover, the inherent mechanism of reducing the grinding temperature using the internal cooling method is revealed. Meanwhile, under the same grinding conditions, the grinding ratio during the experiments on GH4169 using self-inhaling internal cooling method is about 3 times as high as using conventional external cooling method. And the grinding forces can be reduced by about 20%. This research revealed the inherent mechanism of higher grinding temperature in the process of vertical sculptured grinding using the cup wheel, which provides theoretical basis for the design and application of self-inhaling internal cooling wheel. At the same time, an efficient and non-invasive surface grinding method of TC4 and GH4169 is presented.
文摘To meet the increasing demand on the quality and co st of precision components for the semiconductor industries, extensive studies on high efficiency and precision machining of ceramic materials have been conducted over the past several years. It is found that the effects of grinding pressure and rotational speed of spindle in the machining for the ceramic materials are v ery significant on the quality of the grinding process. In order to achieve stab le grinding conditions for improved performance, a new grinding control scheme i n which the grinding pressure is maintained constant throughout the grinding pro cess was carried out in the present study. The surface quality of ground ceramics depends on the mechanism of material remo val in the vertical grinding process. For grinding of Si 3N 4 and glass under the condition of constant pressure, increasing pressure enhances material remova l rate, and at the same time causes more machining-induced microcracks on the g round surfaces. Along with the analysis of tangential forces, specific grinding energy, and the micro observations on ground surfaces, it can be found that low pressure and high wheel speed should be selected to high efficiently remove cera mics in ductile mode in the vertical grinding. From the theoretically analytical and measured grinding temperatures in the vert ical grinding of ceramics, it is found that the analytical temperature profile w ithε= 55% has the same trend with the measured one. The measured temperature is higher that the analytical one at the beginning stage of grinding process, whic h might be contributed to the unstable grinding condition of this stage. The gri nding temperatures in the vertical grinding of ceramics under a constant are not high enough for glassy phase formation, and may not reduce surface fracture as expected. However, the temperature in dry grinding may cause thermal damage to t he resin bond diamond wheel, thereby resulting in low quality workpiece surface.