We consider the inverse problem of finding guiding pattern shapes that result in desired self-assembly morphologies of block copolymer melts.Specifically,we model polymer selfassembly using the self-consistent field t...We consider the inverse problem of finding guiding pattern shapes that result in desired self-assembly morphologies of block copolymer melts.Specifically,we model polymer selfassembly using the self-consistent field theory and derive,in a non-parametric setting,the sensitivity of the dissimilarity between the desired and the actual morphologies to arbitrary perturbations in the guiding pattern shape.The sensitivity is then used for the optimization of the confining pattern shapes such that the dissimilarity between the desired and the actual morphologies is minimized.The efficiency and robustness of the proposed gradient-based algorithm are demonstrated in a number of examples related to templating vertical interconnect accesses(VIA).展开更多
Conductive fillers made from metal nanoparticles offer many advan-tages for the fabrication of a variety of electronic devices,but when they have a porous structure,their poor conductivity limits their adoption in man...Conductive fillers made from metal nanoparticles offer many advan-tages for the fabrication of a variety of electronic devices,but when they have a porous structure,their poor conductivity limits their adoption in many applications.In this study,an Ag-coated Cu micro-nanoparticle paste is used to achieve compact filling of blind vias on flexible copper clad polyimide laminates through a multistep filling and sintering tech-nique.The filled blind vias achieve a resistivity as low as 6.2μΩ·cm,which is comparable that of electroplated blind vias.Higher sintering pressure and temperature promote the filling performance,while the conductivity deteriorates at a via depth/diameter ratio greater than 1:1.Finite element simulations reveal a stress inhomogeneity in vias with large depth/diameter ratios,which is the key to understanding the evolution of the conductive properties of a paste-filled via.This study provides an effective method for high-performance microvia filling as well as insights into the mechanism that influences its performance.展开更多
文摘We consider the inverse problem of finding guiding pattern shapes that result in desired self-assembly morphologies of block copolymer melts.Specifically,we model polymer selfassembly using the self-consistent field theory and derive,in a non-parametric setting,the sensitivity of the dissimilarity between the desired and the actual morphologies to arbitrary perturbations in the guiding pattern shape.The sensitivity is then used for the optimization of the confining pattern shapes such that the dissimilarity between the desired and the actual morphologies is minimized.The efficiency and robustness of the proposed gradient-based algorithm are demonstrated in a number of examples related to templating vertical interconnect accesses(VIA).
基金This work was supported by the National Key R&D Program of China(2018YFE0204601),the National Natural Science Foundation of China[61874155,62174039]Key-area Research and Development Program of Guangdong Province[2021B0101290001,2020B0101290001]+1 种基金Open Project of the State Key Laboratory of Advanced Materials and Electronic Components[FHR-JS-202011005]Guangdong Basic and Applied Basic Research[2021A1515011642,2021A1515110656,2022A1515010141].
文摘Conductive fillers made from metal nanoparticles offer many advan-tages for the fabrication of a variety of electronic devices,but when they have a porous structure,their poor conductivity limits their adoption in many applications.In this study,an Ag-coated Cu micro-nanoparticle paste is used to achieve compact filling of blind vias on flexible copper clad polyimide laminates through a multistep filling and sintering tech-nique.The filled blind vias achieve a resistivity as low as 6.2μΩ·cm,which is comparable that of electroplated blind vias.Higher sintering pressure and temperature promote the filling performance,while the conductivity deteriorates at a via depth/diameter ratio greater than 1:1.Finite element simulations reveal a stress inhomogeneity in vias with large depth/diameter ratios,which is the key to understanding the evolution of the conductive properties of a paste-filled via.This study provides an effective method for high-performance microvia filling as well as insights into the mechanism that influences its performance.
