Irradiation-induced void evolution in iron：A phase-field approach with atomistic derived parameters

A series of material parameters are derived from atomistic simulations and implemented into a phase field（PF） model to simulate void evolution in body-centered cubic（bcc） iron subjected to different irradiation doses at different temperatures.The simulation results show good agreement with experimental observations — the porosity as a function of temperature varies in a bell-shaped manner and the void density monotonically decreases with increasing temperatures; both porosity and void density increase with increasing irradiation dose at the same temperature. Analysis reveals that the evolution of void number and size is determined by the interplay among the production, diffusion and recombination of vacancy and interstitial.

A photogrammetric approach for quantifying the evolution of rock joint void geometry under varying contact states

Accurate measurement of the evolution of rock joint void geometry is essential for comprehending the distribution characteristics of asperities responsible for shear and seepage behaviors.However,existing techniques often require specialized equipment and skilled operators,posing practical challenges.In this study,a cost-effective photogrammetric approach is proposed.Particularly,local coordinate systems are established to facilitate the alignment and precise quantification of the relative position between two halves of a rock joint.Push/pull tests are conducted on rock joints with varying roughness levels to induce different contact states.A high-precision laser scanner serves as a benchmark for evaluating the photogrammetry method.Despite certain deviations exist,the measured evolution of void geometry is generally consistent with the qualitative findings of previous studies.The photogrammetric measurements yield comparable accuracy to laser scanning,with maximum errors of 13.2%for aperture and 14.4%for void volume.Most joint matching coefficient(JMC)measurement errors are below 20%.Larger measurement errors occur primarily in highly mismatched rock joints with JMC values below 0.2,but even in cases where measurement errors exceed 80%,the maximum JMC error is only 0.0434.Thus,the proposed photogrammetric approach holds promise for widespread application in void geometry measurements in rock joints.

A theoretical analysis of the electromigration-induced void morphological evolution under high current density

In this work, analysis of electromigration-induced void morphological evolution in solder interconnects is performed based on mass diffusion theory. The analysis is conducted for three typical experimentally observed void shapes: circular, ellipse, and cardioid. Void morphological evolution is governed by the competition between the electric field and surface capillary force. In the developed model, both the electric field and capillary force on the void's surface are solved analytically. Based on the mass conversation principle, the normal velocity on the void surface during diffusion is obtained. The void morphological evolution behavior is investigated, and a physical model is developed to predict void collapse to a crack or to split into sub-voids under electric current. It is noted that when the electric current is being applied from the horizontal direction, a circular void may either move stably along the electric current direction or collapse to a finger shape, depending on the relative magnitude of the electric current and surface capillary force. However, the elliptical-shaped void will elongate along the electric current direction and finally collapse to the finger shape. On the other hand, the cardioid-shaped void could bifurcate into two sub-voids when the electric current reaches a critical value. The theoretical predictions agree well with the experimental observations.