Impact of multiplexed reading scheme on nanocrossbar memristor memory's scalability

Nanocrossbar is a potential memory architecture to integrate memristor to achieve large scale and high density mem- ory. However, based on the currently widely-adopted parallel reading scheme, scalability of the nanocrossbar memory is limited, since the overhead of the reading circuits is in proportion with the size of the nanocrossbar component. In this paper, a multiplexed reading scheme is adopted as the foundation of the discussion. Through HSPICE simulation, we reanalyze scalability of the nanocrossbar memristor memory by investigating the impact of various circuit parameters on the output voltage swing as the memory scales to larger size. We find that multiplexed reading maintains sufficient noise margin in large size nanocrossbar memristor memory. In order to improve the scalability of the memory, memristors with nonlinear I-V characteristics and high LRS （low resistive state） resistance should be adopted.

Fin Field Effect Transistor with Active 4-Bit Arithmetic Operations in 22 nm Technology

A design of a high-speed multi-core processor with compact size is a trending approach in the Integrated Circuits(ICs)fabrication industries.Because whenever device size comes down into narrow,designers facing many power den-sity issues should be reduced by scaling threshold voltage and supply voltage.Initially,Complementary Metal Oxide Semiconductor(CMOS)technology sup-ports power saving up to 32 nm gate length,but further scaling causes short severe channel effects such as threshold voltage swing,mobility degradation,and more leakage power(less than 32)at gate length.Hence,it directly affects the arithmetic logic unit(ALU),which suffers a significant power density of the scaled multi-core architecture.Therefore,it losses reliability features to get overheating and increased temperature.This paper presents a novel power mini-mization technique for active 4-bit ALU operations using Fin Field Effect Tran-sistor(FinFET)at 22 nm technology.Based on this,a diode is directly connected to the load transistor,and it is active only at the saturation region as a function.Thereby,the access transistor can cutoff of the leakage current,and sleep transis-tors control theflow of leakage current corresponding to each instant ALU opera-tion.The combination of transistors(access and sleep)reduces the leakage current from micro to nano-ampere.Further,the power minimization is achieved by con-necting the number of transistors(6T and 10T)of the FinFET structure to ALU with 22 nm technology.For simulation concerns,a Tanner(T-Spice)with 22 nm technology implements the proposed design,which reduces threshold vol-tage swing,supply power,leakage current,gate length delay,etc.As a result,it is quite suitable for the ALU architecture of a high-speed multi-core processor.

Evaluation of the differential capacitance for ferroelectric materials using either charge-based or energy-based expressions

Differential capacitance is derived based upon energy,charge or current considerations,and determined when it may go negative or positive.These alternative views of differential capacitances are analyzed,and the relationships between them are shown.Because of recent interest in obtaining negative capacitance for reducing the subthreshold voltage swing in field effect type of devices,using ferroelectric materials characterized by permittivity,these concepts are now of paramount interest to the research community.For completeness,differential capacitance is related to the static capacitance,and conditions when the differential capacitance may go negative in relation to the static capacitance are shown.