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Wafer bin map inspection based on DenseNet 被引量:1
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作者 YU Nai-gong XU Qiao +1 位作者 WANG Hong-lu LIN Jia 《Journal of Central South University》 SCIE EI CAS CSCD 2021年第8期2436-2450,共15页
Wafer bin map(WBM)inspection is a critical approach for evaluating the semiconductor manufacturing process.An excellent inspection algorithm can improve the production efficiency and yield.This paper proposes a WBM de... Wafer bin map(WBM)inspection is a critical approach for evaluating the semiconductor manufacturing process.An excellent inspection algorithm can improve the production efficiency and yield.This paper proposes a WBM defect pattern inspection strategy based on the DenseNet deep learning model,the structure and training loss function are improved according to the characteristics of the WBM.In addition,a constrained mean filtering algorithm is proposed to filter the noise grains.In model prediction,an entropy-based Monte Carlo dropout algorithm is employed to quantify the uncertainty of the model decision.The experimental results show that the recognition ability of the improved DenseNet is better than that of traditional algorithms in terms of typical WBM defect patterns.Analyzing the model uncertainty can not only effectively reduce the miss or false detection rate but also help to identify new patterns. 展开更多
关键词 wafer defect inspection convolutional neural network DenseNet model uncertainty
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