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MEMS-based thermoelectric infrared sensors: A review 被引量:12
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作者 Dehui XU Yuelin WANG +1 位作者 Bin XIONG Tie LI 《Frontiers of Mechanical Engineering》 SCIE CSCD 2017年第4期557-566,共10页
In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents ... In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation micro- structures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings. 展开更多
关键词 thermoelectric infrared sensor CMOS-MEMS THERMOPILE MICROMACHINING wafer-level package
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