Influence of layer orientation and interlayer bonding force on the mechanical behavior of shale under Brazilian test conditions

The mechanical behavior of inherently anisotropic shale rocks under Brazilian test conditions are investigated in this study based on experimental studies and numerical simulations. The effects of the weak lamination planes and interlayer bonding force of these layers on the failure strength and fracture patterns are studied systematically. Numerical simulations using particle flow code in two dimensions based on the discrete element method showed a good agreement with the experimental results in the failure strength and fracture patterns. The shale revealed strong anisotropic behavior with the failure strength perpendicular to the lamination plane greater than failure strength parallel to lamination plane. The failure strength of the different interlayer bonding force against the layer orientations changed significantly. Four types of fracture patterns were observed: curved fracture, broken-linear fracture, layeractivated fracture, and central-linear fracture. The observed fracture patterns are either or a combination of tensile and/or shear fractures. Increase in interlayer bonding strength decreased the quantity of micro cracks and this directly led to reduction in the anisotropic behavior. Overall the layer orientation and interlayer bonding force of the shale thus play a very important role in the anisotropic behavior of the shale.

THE APPLICATION OF ARTIFICIAL NEURAL NETWORKS TO INVESTIGATION ON THE THICKNESS OF INTERMETALLIC LAYER UNDER SOLID-LIQUID PRESSURE BONDING OF STEEL AND ALUMINIUM

Artificial neural networks (ANN), being a sophisticated type of information processing system by imitating the neural system of human brain, can be used to investigate the effects of concentration of flux solution, temperature of liquid aluminium, temperture of tools and pressure on thickness of the intermetallic layer at the interface between steel and aluminium under solid-liquid pressure bonding of steel and aluminium perfectly. The optimum thickness has been determined according to the value of the optimum shearing strength.

TEM STUDY OF BONDING LAYERS IN DISSIMILAR ALLOY EXPLOSIVE BONDING JOINTS

The bonding layers in dissimilar alloy explosive bonding joints,γ/α stainless steels, copper/carbon steel and brass/γ-stainless steel have been studied by means of TEM tech- nique.The results show that the bonding is obtained by diffusion and local melting at the con- tact surface.The structure of bonding layer not only responds to the compositions of the bond- ing alloys,but also the difference between their thermal conductivities,melting points and recrystallization temperatures,Because of the small molten region and fast cooling rate,the structure of molten region could be amorphous or microcrystals,and both stable and metastable phases exsist.

Diffusion bonding of copper alloy to stainless steel with Ni and Cu interlayer

CuAlBe alloy is an attractive shape memory alloy with many important usages in industrial field, in order to spread its range of application it is desirable to be able to join CuAlBe soundly with other metallic materials, for example stainless steel; however the weldability between CuAlBe alloy and stainless steel has never been studied, therefore an experimental investigation of different transition metals was carried out in the diffusion bonding joints of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti). The microstructure and phase composition of the joint were analyzed by SEM, EPMA and X ray diffraction. The following conclusions have been drawn: 1) The joint strength with Ni interlayer is higher than that with Cu interlayer when the welding parameters are the same; 2) When Ni interlayer is thinner, Al will interact with Ni and Fe, and the intermetallic compounds such as Fe 3Al are formed in the interface, which decreases the strength of the joints; 3) When the bonding temperature is higher, because the diffusion of Cu in Ni is faster than Ni in Cu, a Kirkendall effect occurs, which also decreases the strength of the joints.

A Novel Method for Evaluating Fatigue Properties of Bonding Layers Used in Bridge Deck Pavement

A new method was used to evaluate the fatigue properties of the bonding layer used in the bridge deck pavement. The shear fatigue test of three bonding layers was conducted on a dynamic shear rheometer（DSR）. The fatigue formulas were gained for these layers. The experimental results indicate that, at the same torque level or at the same frequency, neoprene latex asphalt bonding layer exhibits excellent fatigue performance when compared to other two bonding layers.

Reactive Diffusion Bonding of SiCp/Al Composites by Insert Powder Layers with Eutectic Composition

Mixed Al-Si and Al-Cu powders were investigated as insert layers to reactive diffusion bond SiCp/6063 metal matrix composite （MMC）. The results show that SiCp/6063 MMC joints bonded by the insert layers of the mixed Al-Si and Al-Cu powders have a dense joining layer of high quality. The mass transfer between the bonded materials and insert layers during bonding leads to the hypoeutectic microstructure of the joining layers bonded by both the mixed Al-Si and Al-Cu powders with eutectic composition. At fixed bonding time （temperature）, the shear strength of the joints by both insert layers of the mixed Al-Si and Al-Cu powders increases with increasing the bonding temperature （time）, but get maxima at bonding temperature 600℃ （time 90 min）.

Reactive diffusion bonding of SiCp/Al composites by insert layers of mixed Al-Si and Al-Si-SiC powders

Mixed Al-Si and Al-Si-SiC powders were employed as insert layers to reactive diffusion bond SiCp/6063 MMC （metal matrix composites）. The results show that SiCp/6063 MMC joints bonded by the insert layer of the mixed Al-Si powder have a dense joining layer with a typical hypoeutectic microstructtn＇e. Using the mixed Al-Si-SiC powder as the insert layer, SiCp/6063 MMC can be reactive diffusion bonded by a composite joint. Because of the SiC segregation, however, there are a number of porous zones in the joining layer, which results in the bad shear strength of the joints reactive diffusion bonded by the insert layer of the mixed A1-Si- SiC powder, even lower than that of the joints reactive diffusion bonded by the insert layer of the mixed Al-Si powder. Ti and Mg added in the insert layers obviously improve the strength of the joints reactive diffusion bonded by the insert layer of the mixed Al- Si-SiC powder, especially, Mg has a more obvious effect.

Thickness of compound layer in steel-aluminum solid to liquid bonding

The bonding of solid steel plate to liquid aluminum was studied using rapidsolidification. The surface of solid steel plate was defatted, descaled, immersed (in K_2ZrF_6 fluxaqueous solution) and stoved. In order to determine the thickness of Fe-Al compound layer at theinterface of steel-aluminum solid to liquid bonding under rapid solidification, the interface ofbonding plate was investigated by SEM (Scanning Electron Microscope) experiment. The relationshipbetween bonding parameters (such as preheat temperature of steel plate, temperature of aluminumliquid and bonding time) and thickness of Fe-Al compound layer at the interface was established byartificial neural networks (ANN) perfectly. The maximum of relative error between the output and thedesired output of the ANN is only 5.4%. From the bonding parameters for the largest interfacialshear strength of bonding plate (226℃ for preheat temperature of steel plate, 723℃ for temperatureof aluminum liquid and 15.8 s for bonding time), the reasonable thickness of Fe-Al compound layer10.8 μm was got.

BASE-INDUCED RELEASE OF MOLECULES FROM HYDROGEN BONDING DIRECTED LAYER-BY-LAYER FILM

On the basis of hydrogen bonding directed layer-by-layer (LbL) assembly we have fabricated two multilayersystems, poly(acrylic acid) bearng spironaphthoxazine (PAA-SO)/poly(4-vinylpyridine) and carboxyl-terminated polyetherdendrimer (dendrimer-COOH)/poly(4-vinylpyridine). UV-Vis spectroscopy indicates that either PAA-SO or dendrimer-COOH can be released from the corresponding multilayer assemblies upon immerssion in a basic aqueous solution.Furthermore, the rate of molecule release can be controlled either by changing the pH value or by adjusting the layerstructure.

Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material

Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding property.Microstructures of Cu/Al interfaces were observed by OM,SEM and EDX Analyser in order to investigate the bonding properties of the material.According to the microstructure a series of diffusion layers were observed at the interface and the thicknesses of diffusion layers have increased with aging time as a result of the diffusion bonding.The interfaces were composed of 3-ply diffusion layers and their compositions were changed with aging time at 400 °C.These compositional compounds were revealed to be η2,(θ+η2),(α+θ) intermetallic phases.It is evident from V-notch impact tests that the growth of the brittle diffusion layers with the increasing aging time directly influenced delamination distance between the Cu sleeve and the Al core.It is suggested that the proper holding time at 400 °C for aging as post heat treatment of a drawn Cu/Al bar clad material would be within 1 h.

Influence of holding time on microstructure and shear strength of Mg alloy/steel joint diffusion bonded with Zn-5Al interlayer

The diffusion bonding of AZ31B Mg alloy and Q235 steel was investigated with a Zn-5Al alloy as interlayer and under different holding time ranging from 3 to 1 200 s. The microstructure and phase compositions of bonded joints were characterized by scanning electron microscopy( SEM),energy dispersive spectrometer( EDS) and X-ray diffraction( XRD)methods. The shear strength of Mg alloy/steel joints was measured by tensile tester. It was found that the microstructure of bonded joints evolved dramatically along with the prolongation of holding time. Under the holding time of 3 s,the main part of joint was composed of MgZn_2 phase and dispersed Al-rich solid solution particles. When increased the holding time more than 60 s,the excessive solution of AZ31B into the interfacial reaction area led to the formation of coarse phase and eutectic microstructure,and also the complex Fe-Al and Mg-Al-Zn IMCs at transition layer closed to Q235 steel side. According to the tensile testing characterizations,the joints obtained under holding time of 3 s exhibited the best shear strength of 84 MPa,and the fracture occurred at the intermediary part of joint where the flexible Al-rich solid solution particles could help to impede the microcrack propagations. With prolonging the holding time to 600 s,the shear strength of joints was deteriorated enormously and the fracture position was shifted to the transition layer part closed to Q235 steel.

Evolution mechanism of the interfacial reaction layers in the joints of diffusion bonded Mo and Al foils

Mo foil （10 -20 μm in thickness） and Al foil （20 -60 μLm in thickness） were vacuum diffusion bonded at 600 - 640 ~C under 20 MPa for 54 min - 6 h. The joints were examined by scanning electron microscopy （SEM） and energy dispersive spectroscopy （EDS） to study the evolution mechanism of the reaction layers. The results show that Al atoms diffuse into Mo grain boundaries and form reaction products as Mo3Al8, MoAl4 , MoAl5 and MoAl12. The surface oxide film is eroded by the growths of the reaction products that plow into the lamellar texture of Mo grain boundaries. Mo3Al8 layer grows by ＂taking root＂ downwards and transforms into MoAl4 and MoAl5 phases upwards by absorbing Al atoms. MoAl12 layer grows up from MoAl5 layer in the same way. When the supplement of Al atoms ceases, MoAl12 transforms reversely into MoAl5 and MoAl5 into MoAl4 via the loss of Al atoms. However, MoAl4 continues to precipitate from Mo3Als layer. At last, there are MoAl4 and Mo3Al8 remained on the joint interface.

Study on process and mechanism of superplastic diffusion bonding of dissimilar steels

The probability, main effect factors and diffusion theory of structural superplastic diffusion bonding of W6Mo5Cr4V2/45 steel have been observed and analyzed by means of tensile test at the room temperature, scanning electron microscope and microhardness test. Results show that after fine graining treatment and short time superplastic pressing formation under the conditions of superplastic temperature and strain rate, W6Mo5Cr4V2/45 specimens can achieve solid state diffusion bonding and the property of welded area is the same as the other parts in the specimen. The diffusion path of carbon element is intergranular and of dislocation.

A New Model of Interfacial Physical Contact in Diffusion Bonding

Through eliminating voids not affecting the primary bonding process, and incorporating interlayer and flexible base material, the interface geometry character and brief mathematics process were put forth. Through analyzing contact process of diffusion bonding, contact area model was settled. It can interpret the phenomenon of different interface areas taking on different strengths. In the course of physical contact, shear stresses serve an important function for the plastic deformation and the cohesion of interface voids.

Comparison in interfacial phenomena in electric-field assisted anodic bonding of Kovar-glass and Kovar/Al film-glass

Anodic bonding of Kovar-glass and Kovar/Al film-glass were performed at temperatures of 513 K to 663 K under the static electric voltage of 500 V, in order to compare the interfacial phenomena in electric-field assisted anodic bonding of Kovar-glass and Al-glass . SEM and EPMA were used to observe and analyzed the interfacial region. The growth rate of the alkali ions depletion layers in Kovar/Al-glass joint was slower than that in Kovar-glass joint. But the activation energies for the growth of depletion layers are about the same for both kinds of joint.

Interfacial Microstructure of Al-Sn-Pb Alloy/Steel During Liquid-Solid Bonding Rolling

Studies were conducted on the interfacial microstructure of a steel/liquid aluminium and its evolution during the bonding rolling process. The effects of wetting time and deformation on the diffusion layer and on the bonding strength were examined. By means of electron microscopy and electron probe analysis, it was found that the diffusion layer is mainly composed of FeAI3. For a steel temperature of 250℃ and an aluminium temperature of 850 ~C, the diffusion layer was formed within 3 s, and the shear strength of the samples increased after 8 to 14 s. Although the interface was not damaged, it was deformed notably. For an aluminium temperature of 750℃ and a wetting time of 11 to 17 s, the shear strength of the interface remained high, but the interface was obviously broken during rolling, leading to reduced bonding strength.

Interfacial phenomena in electric field-assisted anodic bonding of Kovar/Al film-glass

Anodic bonding of glass to Kovar alloy coated with Al film (Glass Al film/Kovar) was performed in the temperature range of 513 ～ 713?K under the static electric voltage of 500?V in order to investigate the interfacial phenomena of Al glass joint. The results reveal that Na and K ions within the glass are displaced by the applied field from the anode side surface of the glass to form depletion layers of them. The K ion depletion layer is narrow and followed by a K pile up layer, and both the two layers are formed within the Na depletion layer. The width of the Na and K depletion layers is increased with increasing bonding temperature and time. The activation energies for the growth of both depletion layers were close to that for Na diffusion in the glass. TEM observations reveal that Al film coated at the surface of Kovar alloy is oxidized to amorphous Al 2O 3 containing a few of Fe, Ni and Co by oxygen ions from the glass drifted by high electric field during bonding. The amount of Fe ions diffusing into the glass adjacent to the anode is significantly low due to the presence of Al film between Kovar alloy and the glass. As a result, the amorphous reaction layer of Fe Si O in the glass near the interface is avoided which is formed in Kovar glass joints.

Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints

In many circumstances,dissimilar metals have to be bonded together and the resulting joint interfaces must typically sustain mechanical and/or electrical forces without failure,which is not possible by fusion welding processes.The melting points of magnesium(Mg)and copper(Cu)have a significant difference(nearly 400℃)and this may lead to a large difference in the microstructure and joint performance of Mg-Cu joints.However,diffusion bonding can be used to join these alloys without much difficulty.This work analyses the effect of parameters on diffusion layer thickness,hardness and strength of magnesium-copper dissimilar joints.The experiments were conducted using three-factor,five-level,central composite rotatable design matrix.Empirical relationships were developed to predict diffusion layer thickness,hardness and strength using response surface methodology.It is found that bonding temperature has predominant effect on bond characteristics.Joints fabricated at a bonding temperature of 450℃, bonding pressure of 12 MPa and bonding time of 30 min exhibited maximum shear strength and bonding strength of 66 and 81 MPa, respectively.

Characteristic of Bond Zone between Powder Surfacing Layer and Base Metal

The characteristic of the bond zone between Ni-based alloy light beam surfacing layer(SL)and base metal(BM)was investigated by scanning electron microscope,energy dispersive spectrometer and X-ray diffraction.The results show that the bond zone,which consists ofγ-Ni orγ-(Fe,Ni)planar crystal band close to SL andα-Fe bright band close to heat affected zone(HAZ),is actually the transition zone of composition and microstructure between SL and HAZ,and the metallurgical bond interface lies between theα-Fe bright band and HAZ.With the increase of light beam heat input from 2kJ/mm to 4kJ/mm,the width of the bond zone increases from 4μm to 15μm,and the morphology of bond interface changes from zigzag to straight.The formation of bond interface indicates the formation of reliable metallurgical bond between SL and BM.

Dynamic study in partial transient liquid phase bonding of Si_3N_4

Dynamics in partial transient liquid phase bonding (PTLP bonding) of Si_3N_4 ceramic with Ti/Cu/Ti multi-interlayer was systematically studied through micro-analysis of joint interfaces. The results show that growth of reaction layer and isothermal solidification procession do at the same time. Growth of reaction layer and moving of isothermal solidification interface obey the parabolic law governed by the diffusion of participating elements during the PTLP bonding. Coordination of the above two dynamics process is done through time and temperature. When reaction layer thickness is suitable and isothermal solidification process is finished, the high bonding strength at room temperature and high temperature are obtained.