Ag-MoS2复合材料电磨损表面膜结构和形成机理研究(英文)

采用粉末冶金方法制备了Ag-MoS2复合材料。初压压力300MPa,在H2保护气氛下烧结并保温1h,经500MPa压力的复压过程制得复合材料,用XRD对烧结后的材料进行了物相分析。对材料进行电磨损实验,并对磨损后的材料表面进行XPS分析。结果表明,复合材料在烧结过程中Ag基体和MoS2并未发生化学反应,而在磨损过程中,由于电流和化学作用,材料表面产生了MoO3,MoO2,同时由粘着作用从对磨环转移到电刷表面的铜与大气分子发生化学反应产生了Cu2O,CuOandCu2S。表面膜的存在降低了材料的摩擦系数,影响着材料的电磨损性能。

Influence of twist extrusion process on consolidation of pure aluminum powder in tubes by equal channel angular pressing and torsion

In comparison with the conventional equal channel angular pressing（ECAP） process,a comprehensive study of influence of twist extrusion（TE） process on consolidating pure aluminum powder in tubes（PITs） by equal channel angular pressing and torsion（ECAPT） was conducted via three-dimensional（3D） finite element simulation,experimental investigation and theoretical analysis.Simulation results revealed that during the consolidation of aluminum powder particles by ECAPT,TE process played a significant role of back pressure.Due to the torsional shear and high hydrostatic pressure exerted by twist channel,both the magnitude and homogeneity of the effective strain were increased markedly.After one pass of ECAPT process using a square channel with an inner angle of 90° and a twist slope angle of 36.5° at 200℃,commercial pure aluminum powder particles were successfully consolidated to nearly full density.Simulation and experimental results showed good agreement.In the microstructure observations,grains were greatly refined.At the same time,porosities were effectively eliminated by shrinking in size and breaking into small ones.Microhardness test indicated that strain distribution of ECAPT-processed billet was more homogeneous with respect to the ECAP-processed one.All these improvements may be attributed to the extreme intense shear strain induced during ECAPT and the increase in self-diffusion coefficient of aluminum due to the back pressure exerted by TE process.

Effect of porosity and interface structures on thermal and mechanical properties of SiC_p/6061Al composites with high volume fraction of SiC

50 vol.% SiCp/Al composites with high thermal and mechanical properties were successfully produced by spark plasma sintering technique. The influences of sintering temperature on the thermal conductivity, coefficient of thermal expansion and bending strength of the SiCp/Al composites were carefully investigated. The results show that the SiCp/Al composites sintered at 520℃ exhibits a thermal conductivity of 189 W/(m·K), a coefficient of thermal expansion (50.200℃) of 10.03×10^-6 K^-1 and a bending strength of 649 MPa. The high thermal and mechanical properties can be ascribed to the nearly full density and the well interfacial bonding between the alloy matrix and the SiC particles. This work provides a promising pathway for producing materials to meet the needs of high performance electronic packaging.

Dynamic tensile behavior of PM Ti-47Al-2Nb-2Cr-0.2W intermetallics at elevated temperatures

Split Hopkinson Tension Bar(SHTB) experiments were conducted to explore the dynamic mechanical behavior and deformation mechanism of powder metallurgical(PM) Ti-47 Al-2 Nb-2 Cr-0.2 W(at.%)intermetallics with near lamellar(NL) and duplex(DP)microstructures. Results show that,under dynamic loading,the high temperature strength of the PM TiAl intermetallics is higher than that under quasi-static loading, and the ductile to brittle transition temperature(DBTT) increases with the increase of strain rate. Formation of twinning and stacking faults is the main deformation mechanism during dynamic loading. The work hardening rates of the PM TiAl intermetallics are nearly insensitive to strain rate and temperature at high strain rates(800-1600 s-1)and high temperatures(650-850 ℃). Zerilli-Armstrong model is successfully used to describe the dynamic flowing behavior of the PM TiAl intermetallics. In general, the PM TiAl intermetallics are found to have promising impact properties, suitable for high-temperature and high-impact applications.

Process optimization,microstructures and mechanical/thermal properties of Cu/Invar bi-metal matrix composites fabricated by spark plasma sintering

An orthogonal experiment scheme was designed to investigate the effects of the Cu content,compaction pressure,and sintering temperature on the microstructures and mechanical and thermal properties of(30−50)wt.%Cu/Invar bi-metal matrix composites fabricated via spark plasma sintering(SPS).The results indicated that as the Cu content increased from 30 to 50 wt.%,a continuous Cu network gradually appeared,and the density,thermal conductivity(TC)and coefficient of thermal expansion of the composites noticeably increased,but the tensile strength decreased.The increase in the sintering temperature promoted the Cu/Invar interface diffusion,leading to a reduction in the TC but an enhancement in the tensile strength of the composites.The compaction pressure comprehensively affected the thermal properties of the composites.The 50wt.%Cu/Invar composite sintered at 700℃ and 60 MPa had the highest TC(90.7 W/(m·K)),which was significantly higher than the TCs obtained for most of the previously reported Cu/Invar composites.

Nanosized copper powders prepared by gel-casting method and their application in lubricating oil

Nanosized copper powders were prepared by a gel-casting method using copper nitrate, acrylamide（AM） and N, N′-methylenebisacrylamide（MBAM） as the main raw materials. The as-prepared copper powders were characterized by X-ray diffractometry and scanning electron microscopy, and then added into a 48# industrial white oil. Dispersion and wear properties of the compounded lubricating oil were tested. The results show that the copper powders prepared are of high purity, fine dispersibility with mean particle size of about 60 nm and with a narrow particle size distribution. The nanosized copper powders can be well dispersed in the lubricating oil. The addition of the copper powders obviously improves the anti-wear properties of the lubricating oil owing to their good self-repairing performance. Compared with 48# industrial white lubricating oil, the friction coefficient of GCr15 steel with the compounded oil containing 0.6% copper powders reduces by 0.07 and nearly no wear chippings are found in the scratches of the friction counter parts.

Fabrication of PdSe2/GaAs Heterojunction for Sensitive Near-Infrared Photovoltaic Detector and Image Sensor Application

In this study,we have developed a high-sensitivity,near-infrared photodetector based on PdSe2/GaAs heterojunction,which was made by transferring a multilayered PdSe2 film onto a planar GaAs.The as-fabricated PdSe2/GaAs heterojunction device exhibited obvious photovoltaic behavior to 808 nm illumination,indicating that the near-infrared photodetector can be used as a self-driven device without external power supply.Further device analysis showed that the hybrid heterojunction exhibited a high on/off ratio of 1.16×10^5 measured at 808 nm under zero bias voltage.The responsivity and specific detectivity of photodetector were estimated to be 171.34 mA/W and 2.36×10^11 Jones,respectively.Moreover,the device showed excellent stability and reliable repeatability.After 2 months,the photoelectric characteristics of the near-infrared photodetector hardly degrade in air,attributable to the good stability of the PdSe2.Finally,the PdSe2/GaAs-based heterojunction device can also function as a near-infrared light sensor.

Microstructure and properties of high-fraction graphite nanoflakes/6061Al matrix composites fabricated via spark plasma sintering

30-50 wt.%graphite nanoflakes(GNFs)/6061Al matrix composites were fabricated via spark plasma sintering(SPS)at 610℃.The effects of the sintering pressure and GNF content on the microstructure and properties of the composites were investigated.The results indicated that interfacial reactions were inhibited during SPS because no Al4C3 was detected.Moreover,the agglomeration of the GNFs increased,and the distribution orientation of the GNFs decreased with increasing the GNF content.The relative density,bending strength,and coefficient of thermal expansion(CTE)of the composites decreased,while the thermal conductivity(TC)in the X−Y direction increased.As the sintering pressure increased,the GNFs deagglomerated and were distributed preferentially in the X−Y direction,which increased the relative density,bending strength and TC,and decreased the CTE of the composites.The 50wt.%GNFs/6061Al matrix composite sintered at 610℃ under 55 MPa demonstrated the best performance,i.e.,bending strength of 72 MPa,TC and CTE(RT−100℃)of 254 W/(m·K)and 8.5×10^(−6)K^(−1)in the X−Y direction,and 55 W/(m·K)and 9.7×10^(−6)K^(−1)in the Z direction,respectively.

Microstructures and properties of Cu/Ag(Invar) composites fabricated by powder metallurgy

The Ag(Invar)composite powder prepared by ball milling was used to fabricate the Cu/Ag(Invar)composites.Microstructures and properties of the composites were studied after sintering and thermo-mechanical treatment.The results indicatethat during ball milling,micro-forging weld and work-hardening fracture result in that the average particle size of the Ag(Invar)powder increases rapidly at first,and then decreases sharply,finally tends to be constant.Compared with the Cu/Invar ones,thesinterability of the composites is greatly improved,resulting in that the pores in them are smaller in amount and size.After thethermo-mechanical treatment,the Cu/Ag(Invar)composites are nearly fully dense with the optimum phase composition and elementdistribution.More importantly,Cu and the Invar alloy in the composites distribute continuously in a three-dimensional(3D)networkstructure.Cu/Invar interface diffusion is effectively inhibited by the Ag barrier layer,leading to a great improvement of themechanical and thermal properties of the Cu/Ag(Invar)composites.

Formation and growth of Cu-Al IMCs and their effect on electrical property of electroplated Cu/Al laminar composites

Cu/Al laminar composite was prepared by dipping Zn layer and then electroplating Cu thick layer on pure Al sheet.During annealing the Cu/Al composites at temperature from 473 to 673 K, the Cu/Al interfacial diffusion and reaction and itskinetics and also the electrical resistivity of the composites were studied. The results show that no Cu?Al IMC layer is observable asthe composites are annealed at 473 K for time till 360 h, indicating that the Zn intermediate layer can effectively suppress the Cu/Alinterfacial diffusion. However, as the composites are annealed at 573 K and above, Zn atoms in the Zn layer dissolve into the Culayer. Tri-layered reaction product of CuAl2/CuAl/Cu9Al4 then forms from the Al side to the Cu side. The IMC layer follows thediffusion-controlled growth kinetics. Electrical resistivity of the Cu/Al composites increases with the increase of the annealingtemperature and time.

Preparation of Li4TisO12 Microspheres with a Pure Cr2O3 Coating Layer and its Effect for Lithium Storage

The pure Cr2O3 coated Li4Ti5O12 microspheres were prepared by a facile and cheap solution- based method with basic chromium（III） nitrate solution （pH=ll.9）. And their Li-storage properties were investigated as anode materials for lithium rechargeable batteries. The pure Cr2O3 works as an adhesive interface to strengthen the connections between Li4Ti5O12 par- ticles, providing more electric conduction channels, and reduce the inter-particle resistance. Moreover, Li2Cr2O3, formed by the lithiation of Cr2O3, can further stabilize LiTTi5O12 with high electric conductivity on the surface of particles. While in the acid chromium solution （pH=3.2） modification, besides Cr2O3, Li2CrO4 and TiO2 phases were also found in the final product. Li2CrO4 is toxic and the presence of TiO2 is not welcome to im- prove the electrochemical performance of Li4Ti5O12 microspheres. The reversible capacity of 1% Cr2O3-coated sample with the basic chromium solution modification was 180 mAh/g at 0.1 C, and 134 mAh/g at 10 C. Moreover, it was even as high as 127 mAh/g at 5 C after 600 cycles. At -20 ℃, its reversible specific capacity was still as high as 118 mAh/g.

Densification and grain growth kinetics of boron carbide powder during ultrahigh temperature spark plasma sintering

Dense B;C material was fabricated using spark plasma sintering(SPS), and the densification mechanisms and grain growth kinetics were revealed. The density, hardness, transverse flexure strength and toughness of samples were investigated and the model predictions were confirmed by SEM and TEM experimental observations. Results show that SPSed B;C exhibits two sintering periods: a densification period(1800-2000 °C) and a grain growth period(2100-2200 °C). Based on steady-state creep model, densification proceeds by grain boundary sliding and then dislocation-climb-controlled mechanism. Grain growth mechanism is controlled by grain boundary diffusion at 2100 °C,and then governed by volume or liquid-phase diffusion at 2200 °C.