The polarization switching plays a crucial role in controlling the final products in the catalytic pro-cess.The effect of polarization orientation on nitrogen reduction was investigated by anchoring transition metal a...The polarization switching plays a crucial role in controlling the final products in the catalytic pro-cess.The effect of polarization orientation on nitrogen reduction was investigated by anchoring transition metal atoms to form active centers on ferroelectric material In_(2)Se_(3).During the polariza-tion switching process,the difference in surface electrostatic potential leads to a redistribution of electronic states.This affects the interaction strength between the adsorbed small molecules and the catalyst substrate,thereby altering the reaction barrier.In addition,the surface states must be considered to prevent the adsorption of other small molecules(such as *O,*OH,and *H).Further-more,the V@↓-In_(2)Se_(3) possesses excellent catalytic properties,high electrochemical and thermody-namic stability,which facilitates the catalytic process.Machine learning also helps us further ex-plore the underlying mechanisms.The systematic investigation provides novel insights into the design and application of two-dimensional switchable ferroelectric catalysts for various chemical processes.展开更多
Interfacial reaction, tensile strength and creep resistance of Sn-58Bi-x Zn(x=0, 0.7, mass fraction, %) solder samples during liquid-state aging were investigated. The coarsening of Bi and the growth of Cu-Sn intermet...Interfacial reaction, tensile strength and creep resistance of Sn-58Bi-x Zn(x=0, 0.7, mass fraction, %) solder samples during liquid-state aging were investigated. The coarsening of Bi and the growth of Cu-Sn intermetallic compounds(IMCs) in Sn-58Bi-0.7Zn solder sample were both effectively suppressed. With the addition of 0.7% Zn, ultimate tensile strengths(UTSs) of the Sn-58 Bi solder slabs were respectively increased by 6.05% and 5.50% after reflow soldering and liquid-state aging, and those of the Cu/Sn-58Bi/Cu solder joints were also increased by 21.51% and 29.27%, respectively. The increase in strengthening effect of Cu/Sn-58Bi-x Zn/Cu solder joints could be attributed to the fracture surface which was changed from the Cu/IMC interface to the IMC/solder interface due to the finer Bi grain. Nanoindentation results revealed that the creep behavior of Sn-58Bi-0.7Zn solder was significantly improved compared with that of the eutectic Sn-58 Bi solder after reflow soldering and liquid-state aging.展开更多
文摘The polarization switching plays a crucial role in controlling the final products in the catalytic pro-cess.The effect of polarization orientation on nitrogen reduction was investigated by anchoring transition metal atoms to form active centers on ferroelectric material In_(2)Se_(3).During the polariza-tion switching process,the difference in surface electrostatic potential leads to a redistribution of electronic states.This affects the interaction strength between the adsorbed small molecules and the catalyst substrate,thereby altering the reaction barrier.In addition,the surface states must be considered to prevent the adsorption of other small molecules(such as *O,*OH,and *H).Further-more,the V@↓-In_(2)Se_(3) possesses excellent catalytic properties,high electrochemical and thermody-namic stability,which facilitates the catalytic process.Machine learning also helps us further ex-plore the underlying mechanisms.The systematic investigation provides novel insights into the design and application of two-dimensional switchable ferroelectric catalysts for various chemical processes.
基金Project(51074112)supported by the National Natural Science Foundation of China
文摘Interfacial reaction, tensile strength and creep resistance of Sn-58Bi-x Zn(x=0, 0.7, mass fraction, %) solder samples during liquid-state aging were investigated. The coarsening of Bi and the growth of Cu-Sn intermetallic compounds(IMCs) in Sn-58Bi-0.7Zn solder sample were both effectively suppressed. With the addition of 0.7% Zn, ultimate tensile strengths(UTSs) of the Sn-58 Bi solder slabs were respectively increased by 6.05% and 5.50% after reflow soldering and liquid-state aging, and those of the Cu/Sn-58Bi/Cu solder joints were also increased by 21.51% and 29.27%, respectively. The increase in strengthening effect of Cu/Sn-58Bi-x Zn/Cu solder joints could be attributed to the fracture surface which was changed from the Cu/IMC interface to the IMC/solder interface due to the finer Bi grain. Nanoindentation results revealed that the creep behavior of Sn-58Bi-0.7Zn solder was significantly improved compared with that of the eutectic Sn-58 Bi solder after reflow soldering and liquid-state aging.
