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Improving the quality factor of an RF spiral inductor with non-uniform metal width and non-uniform coil spacing
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作者 沈珮 张万荣 +2 位作者 黄璐 金冬月 谢红云 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2011年第6期64-68,共5页
An improved inductor layout with non-uniform metal width and non-uniform spacing is proposed to increase the quality factor(Q factor).For this inductor layout,from outer coil to inner coil,the metal width is reduced... An improved inductor layout with non-uniform metal width and non-uniform spacing is proposed to increase the quality factor(Q factor).For this inductor layout,from outer coil to inner coil,the metal width is reduced by an arithmetic-progression step,while the metal spacing is increased by a geometric-progression step. An improved layout with variable width and changed spacing is of benefit to the Q factor of RF spiral inductor improvement(approximately 42.86%),mainly due to the suppression of eddy-current loss by weakening the current crowding effect in the center of the spiral inductor.In order to increase the Q factor further,for the novel inductor, a patterned ground shield is used with optimized layout together.The results indicate that,in the range of 0.5 to 16 GHz,the Q factor of the novel inductor is at an optimum,which improves by 67%more than conventional inductors with uniform geometry dimensions(equal width and equal spacing),is enhanced by nearly 23%more than a PGS inductor with uniform geometry dimensions,and improves by almost 20%more than an inductor with an improved layout. 展开更多
关键词 inductor layout optimization variable metal width and spacing integrated RF inductor silicon substrate
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