3D reconstruction and defect pattern recognition of bonding wire based on stereo vision

Non-destructive detection of wire bonding defects in integrated circuits(IC)is critical for ensuring product quality after packaging.Image-processing-based methods do not provide a detailed evaluation of the three-dimensional defects of the bonding wire.Therefore,a method of 3D reconstruction and pattern recognition of wire defects based on stereo vision,which can achieve non-destructive detection of bonding wire defects is proposed.The contour features of bonding wires and other electronic components in the depth image is analysed to complete the 3D reconstruction of the bonding wires.Especially to filter the noisy point cloud and obtain an accurate point cloud of the bonding wire surface,a point cloud segmentation method based on spatial surface feature detection(SFD)was proposed.SFD can extract more distinct features from the bonding wire surface during the point cloud segmentation process.Furthermore,in the defect detection process,a directional discretisation descriptor with multiple local normal vectors is designed for defect pattern recognition of bonding wires.The descriptor combines local and global features of wire and can describe the spatial variation trends and structural features of wires.The experimental results show that the method can complete the 3D reconstruction and defect pattern recognition of bonding wires,and the average accuracy of defect recognition is 96.47%,which meets the production requirements of bonding wire defect detection.

基于密集连接网络的晶圆图检测

晶圆图(WBM)检测是评估半导体生产工艺的关键手段,有效的检测方法能够提升生产效率与产品良率。本文提出了一种基于密集连接网络的晶圆图缺陷模式检测方法,并根据晶圆图特点对模型结构和损失函数进行了改进。此外,提出了一种受限均值滤波算法滤除噪声晶粒。在模型预测时,采用基于熵的蒙特卡洛Dropout算法来量化模型决策的不确定性。实验结果表明,对于典型的晶圆缺陷模式,改进模型的识别能力优于传统算法。通过分析模型不确定性,不仅可以有效地降低漏检率和误检率,还有助于发现新模式。