Phosphor plays an important role in LED packages by converting the wavelength of light and achieving specific color. The property and degradation of phosphor are strongly affected by the temperature. Some structural f...Phosphor plays an important role in LED packages by converting the wavelength of light and achieving specific color. The property and degradation of phosphor are strongly affected by the temperature. Some structural factors have been investigated in this paper and their effects are evaluated. Remote phosphor is an effective approach to improve the performance and reliability of LED modules and products. It is a trade-off that the final product design depends on both the thermal performance and the cost.展开更多
Chip on flexible substrate （COF） is a new packaging technology for light emitting diodes （LED）. This paper investigated the effect of Cu-pillar in the polyimide （PI） layer on the thermal properties of COF LED pa...Chip on flexible substrate （COF） is a new packaging technology for light emitting diodes （LED）. This paper investigated the effect of Cu-pillar in the polyimide （PI） layer on the thermal properties of COF LED pack- ages by finite element analysis. The thermal distribution and thermal resistance were studied in both COF LED packages with and without Cu-pillar. The PI layer showed the highest thermal resistance in the typical package and led to a high chip temperature. With the addition of Cu-pillars, however, the thermal resistance of the PI layer sig- nificantly decreased due to the improvement of vertical thermal dissipation under LED chips. Based on the results of simulation and calculation, the relationship between the amount of Cu-pillar and thermal resistance of the COF package has been built. For the packages studied in this research, an 8 × 8 Cu-pillars array was adequate to improve the thermal performance of COF packages.展开更多
基金the companies and organizations of China Solid-state Lighting Association(CSA) that support research activities at the State Key Laboratory of Solid-State Lighting
文摘Phosphor plays an important role in LED packages by converting the wavelength of light and achieving specific color. The property and degradation of phosphor are strongly affected by the temperature. Some structural factors have been investigated in this paper and their effects are evaluated. Remote phosphor is an effective approach to improve the performance and reliability of LED modules and products. It is a trade-off that the final product design depends on both the thermal performance and the cost.
基金Project supported by the Research and Scientific Foundation of Heilongjiang Education Department(No.12541112)
文摘Chip on flexible substrate （COF） is a new packaging technology for light emitting diodes （LED）. This paper investigated the effect of Cu-pillar in the polyimide （PI） layer on the thermal properties of COF LED pack- ages by finite element analysis. The thermal distribution and thermal resistance were studied in both COF LED packages with and without Cu-pillar. The PI layer showed the highest thermal resistance in the typical package and led to a high chip temperature. With the addition of Cu-pillars, however, the thermal resistance of the PI layer sig- nificantly decreased due to the improvement of vertical thermal dissipation under LED chips. Based on the results of simulation and calculation, the relationship between the amount of Cu-pillar and thermal resistance of the COF package has been built. For the packages studied in this research, an 8 × 8 Cu-pillars array was adequate to improve the thermal performance of COF packages.
