As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans ...As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans in unison with pumped fluid loops in order to meet temperature and performance requirements. This research paper presents results of applying Computational Fluid Dynamics (CFD) commercial industry STAR-CCM+ software for heat transfer and fluid flow simulation of a novel heat exchanger/cold plate fabricated from k-core high thermal conductivity material in order to realize thermal control system hardware design for very much applications to very large power density (~1 kW/m2) electronics packaging scenarios. Trade studies involving different heat exchanger/cold plate materials, as well as vari- ous fault scenarios within a mock-up of a typical electronics system, are used to illustrate the upper bounds placed on the convective heat transfer coefficient. Agreement between our present findings and previous research in the field of electronics cooling is presented herein.展开更多
文摘As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans in unison with pumped fluid loops in order to meet temperature and performance requirements. This research paper presents results of applying Computational Fluid Dynamics (CFD) commercial industry STAR-CCM+ software for heat transfer and fluid flow simulation of a novel heat exchanger/cold plate fabricated from k-core high thermal conductivity material in order to realize thermal control system hardware design for very much applications to very large power density (~1 kW/m2) electronics packaging scenarios. Trade studies involving different heat exchanger/cold plate materials, as well as vari- ous fault scenarios within a mock-up of a typical electronics system, are used to illustrate the upper bounds placed on the convective heat transfer coefficient. Agreement between our present findings and previous research in the field of electronics cooling is presented herein.
