Currently most light emitting diode （LED） components are made with individual chip packaging technology. The main manufacturing processes follow conventional chip-based IC packaging. In the past several years, there...Currently most light emitting diode （LED） components are made with individual chip packaging technology. The main manufacturing processes follow conventional chip-based IC packaging. In the past several years, there has been an uprising trend in the IC industry to migrate from chip-based packaging to wafer level packaging （WLP）. Therefore, there is a need for LEDs to catch up. This paper introduces advanced LED WLP technologies. The contents cover key enabling processes such as preparation of silicon sub-mount wafer, implementation of interconnection, deposition of phosphor, wafer level encapsulation, and their integration. The emphasis is placed on how to achieve high throughput, low cost manufacturing through WLE展开更多
This paper provides an analytical approach to determine the optimum pitch by utilizing a thermal resistance network, under the assumption of constant luminous efficiency. This work allows an LED array design which is ...This paper provides an analytical approach to determine the optimum pitch by utilizing a thermal resistance network, under the assumption of constant luminous efficiency. This work allows an LED array design which is mounted on a printed circuit board （PCB） attached with a heat sink subject to the natural convection cooling. Being validated by finite element （FE） models, the current approach can be shown as an effective method for the determination of optimal component spacing in an LED array assembly for SSL.展开更多
文摘Currently most light emitting diode （LED） components are made with individual chip packaging technology. The main manufacturing processes follow conventional chip-based IC packaging. In the past several years, there has been an uprising trend in the IC industry to migrate from chip-based packaging to wafer level packaging （WLP）. Therefore, there is a need for LEDs to catch up. This paper introduces advanced LED WLP technologies. The contents cover key enabling processes such as preparation of silicon sub-mount wafer, implementation of interconnection, deposition of phosphor, wafer level encapsulation, and their integration. The emphasis is placed on how to achieve high throughput, low cost manufacturing through WLE
文摘This paper provides an analytical approach to determine the optimum pitch by utilizing a thermal resistance network, under the assumption of constant luminous efficiency. This work allows an LED array design which is mounted on a printed circuit board （PCB） attached with a heat sink subject to the natural convection cooling. Being validated by finite element （FE） models, the current approach can be shown as an effective method for the determination of optimal component spacing in an LED array assembly for SSL.
