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P-BN/n-Si Heterojunction Prepared by Beryllium ion Implantation 被引量:3
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作者 何斌 陈光华 +2 位作者 李志中 邓金祥 张文军 《Chinese Physics Letters》 SCIE CAS CSCD 2008年第1期219-222,共4页
A boron nitride (BN)/silicon p-n heterojunction is fabricated by implanting beryllium (Be) ions into the BN films deposited by rf sputtering on n-type Si (111) substrates. The FTIR observations indicate that the... A boron nitride (BN)/silicon p-n heterojunction is fabricated by implanting beryllium (Be) ions into the BN films deposited by rf sputtering on n-type Si (111) substrates. The FTIR observations indicate that the films deposited have a mixed phase composition of 8p^2 - and sp^3 -hybridized BN. Considering the thickness of the BN layer, the ion implantation is conducted at an ion energy of 100keV with the dose of 5×10^15 cm^-2. After annealing at a high temperature, the surface resistance of the BN film decreases significantly by 6 orders down to 1.2×10^5Ω. Space-charge-limited current characteristic, which indicates the existence of shallow traps in the film, is observed. Current-voltage measurements across the BN film and the Si substrate reveal a clear rectification feature, demonstrating the achievement of p-type doping of BN films by Be ion implantation. 展开更多
关键词 CUBIC BORON-NITRIDE CHEMICAL-VAPOR-DEPOSITION HIGH-PRESSURE THIN-FILMS ELECTRICAL-PROPERTIES GROWTH TEMPERATURE MECHANISM JUNCTION EPITAXY
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