钛合金等温锻造工艺优化研究

将有限元模拟技术和神经网络理论相结合,建立了钛合金等温锻造工艺设计的优化系统,实现了CAD-CAE-优化-CAD的循环,在循环过程中,CAE对CAD产生了数据反馈。将FEM模拟结果作为初始数据导入优化系统,作为ANN的训练参数,利用训练好的神经网络对设计做出预测,循环系统不断运行直至得到良好的结果。利用该优化系统能获得像顶级专家主持一样的优良效果,使得设计过程在时间和效果上都得到提高。

基于零件特征基因编码的零件设计算法研究

在分析归纳CAD零件设计理论基础上,结合零件多特征基因编码知识,利用自由度分析法及矢量运算法则,提出一种借鉴生物基因思想的零件融合设计建模方法。同时利用数据结构和图形拓扑学的知识建立零件多特征遗传树,在此基础上,采用超节点存储算法对复杂的空间几何特征进行子节点压缩存储;并建立了零件融合设计的层次数学模型和融合数学模型;通过在CATIA5 r8平台上以实例验证该设计方法是可行的。

高斯回归过程学习方法在TC4流变应力预测中的应用

为研究TC4钛合金的力学性能,借助Gleeble-1500D热模拟机,在等温、等速率条件下,对Ti-6Al-4V合金进行压缩。为进一步分析实验结果,将非线性建模方法高斯回归过程(GP)应用于TC4流变应力的预测,并提出相应的模型。实例研究表明,借助MATLAB语言编制程序,预测流变应力的高斯回归过程学习方法是科学、可行的,其绝对误差为0.91MPa,相对误差为4.84%,与ANN模型相比,预测精度更高,而且简单实用,为TC4热变形工艺的制定提供参考依据。

面向QFD的制造质量控制信息

在分析对制造质量控制信息要求的基础上,研究了与质量功能展开(QFD)集成的制造质量信息,提出了用工序的困难程度Rdif、重要程度Rimp和熟练程度Rpro3个指标表示制造质量控制水平与能力的方法,给出了Rdif、Rimp和Rpro的计算模型。

刀具磨损对于单点金刚石切削单晶硅的影响

单点金刚石切削(SPDT)是加工单晶硅最常用的方法,刀具磨损是影响加工表面或工件表面质量的重要因素,但是其中的磨损机制尚不清楚。为了研究刀具磨损对于切削机制的影响,本研究建立了单点金刚石切削单晶硅的分子动力学(MD)仿真模型。仿真结果表明随着刀具磨损程度的增加,切削力、表面损伤层厚度、位错分布面积、剪切变形和相变程度均增加。当使用已经磨损的刀具切削单晶硅时,挤压起主要作用,当使用未磨损刀具时,剪切变形起主要作用,工件表面损伤层主要是由硅的非晶相组成,使用磨损的刀具时产生的轴向力F t约是未磨损刀具的四倍。模拟结果同时表明使用未磨损金刚石刀具时会导致工件发生塑性变形,当刀具发生磨损后切削过程中会伴随有脆性断裂。

零件多特征基因编码技术研究

在分析零件CAD特征建模的基础上,针对零件设计和材料选择及加工参数结合松散的现状,参照生物信息学,提出了一种综合考虑材料性能参数、加工参数和几何结构的多特征零件信息模型,又基于该模型建立了多特征零件基因编码理论及其数学模型。利用该理论和算法建立了常见几何特征模型的基因编码和简单零件的基因编码,并通过CATIA5R8验证了多特征零件设计算法。

基于内时大变形弹塑性本构模型的回弹和二次屈服分析

采用了一个由简单机构建立的材料热力学一致性弹塑性大变形本构模型,该模型满足热力学基本的不可逆约束条件,并考虑到了储存在残余微应力场中的能量,用相应的算法,编制了一个用户子程序UMAT,并将其嵌入到商用软件ABAQUS中,对圆柱形工件在弹性工具中镦粗和闭合模镦粗时的回弹和二次屈服进行了分析。比较模拟和实验所测得的载荷-位移关系,可以看出在镦粗的第一阶段发生塑性变形,工件在轴向加载过程中产生的横向变形受到了由于模具的弹性变形引起的径向约束,载荷迅速增加;第二阶段轴向压力减少,模具回弹使得工件的径向变形得以恢复,但随着塑性应变的增加,发生工作强化;第三阶段模具约束解除,工作的径向尺寸增加。用该本构模型对闭合模镦粗过程的计算,表明计算结果与实验结果是一致的。

基于遗传中心法则的零件逐步求精创新设计

针对零件创新设计中功能分解标准各异,运算耗时随零件复杂度成指数递增以及设计局限性强等难点。在生物遗传学中心法则和基因互补配对原则的启发下,探索一种结合矢量运算、矢量组合和约束函数的面向全过程全反馈闭环逐步求精零件创新设计方法。由于采用零件特征基因编码和零件特征融合算法,简化了功能分解的依据并提高零件运算速度。文章阐述了实现的具体框架和创新设计算例,并在CATIA5R8平台验证该方法是可行。

Enhancement of surface wettability via micro-and nanostructures by single point diamond turning

Studies on surface wettability have received tremendous interest due to their potential applications in research and industrial processes. One of the strategies to tune surface wettability is modifying surface topography at micro-and nanoscales. In this research, periodic micro-and nanostructures were patterned on several polymer surfaces by ultra-precision single point diamond turning to investigate the relationships between surface topographies at the micro-and nanoscales and their surface wettability. This research revealed that single-point diamond turning could be used to enhance the wettability of a variety of polymers, including polyvinyl chloride(PVC), polyethylene 1000(PE1000), polypropylene copolymer(PP) and polytetrafluoroethylene(PFTE), which cannot be processed by conventional semiconductor-based manufacturing processes. Materials exhibiting common wettability properties(θ≈ 90°) changed to exhibit "superhydrophobic" behavior(θ > 150°). Compared with the size of the structures, the aspect ratio of the void space between micro-and nanostructures has a strong impact on surface wettability.

Compatibility research of laser additive repairing TA15 forgings with Ti6Al4V-xTA15 alloy

The application of mixed powders with different mass fraction on laser additive repairing(LAR)can be an effective way to guarantee the performance and functionality of repaired part in time.A convenient and feasible approach is presented to repair TA15 forgings by employing Ti6Al4V-xTA15 mixed powders in this paper.The performance compatibility of Ti6Al4V-xTA15 powders from the aspects of microhardness,tensile property,heat capacity,thermal expansion coefficient and corrosion resistance with the TA15 forgings was fully investigated.The primaryαlaths were refined and the volume fraction of the secondaryαphase was increased by increasing the mass fraction of TA15 in the mixed Ti6Al4V-xTA15 powders,leading to varied performances.In conclusion,the mixed Ti6Al4V-70%TA15(x=70%)powders is the most suitable candidate and is recommended as the raw material for LAR of TA15 forgings based on overall consideration of the compatibility calculations of the laser repaired zone with the wrought substrate zone.

Fundamentals of atomic and close-to-atomic scale manufacturing:a review

Atomic and close-to-atomic scale manufacturing(ACSM)represents techniques for manufacturing high-end products in various fields,including future-generation computing,communication,energy,and medical devices and materials.In this paper,the theoretical boundary between ACSM and classical manufacturing is identified after a thorough discussion of quantum mechanics and their effects on manufacturing.The physical origins of atomic interactions and energy beams-matter interactions are revealed from the point view of quantum mechanics.The mechanisms that dominate several key ACSM processes are introduced,and a current numerical study on these processes is reviewed.A comparison of current ACSM processes is performed in terms of dominant interactions,representative processes,resolution and modelling methods.Future fundamental research is proposed for establishing new approaches for modelling ACSM,material selection or preparation and control of manufacturing tools and environments.This paper is by no means comprehensive but provides a starting point for further systematic investigation of ACSM fundamentals to support and accelerate its industrial scale implementation in the near future.

Surface defects incorporated diamond machining of silicon

This paper reports the performance enhancement benefits in diamond turning of the silicon wafer by incorporation of the surface defect machining(SDM)method.The hybrid micromachining methods usually require additional hardware to leverage the added advantage of hybrid technologies such as laser heating,cryogenic cooling,electric pulse or ultrasonic elliptical vibration.The SDM method tested in this paper does not require any such additional baggage and is easy to implement in a sequential micro-machining mode.This paper made use of Raman spectroscopy data,average surface roughness data and imaging data of the cutting chips of silicon for drawing a comparison between conventional single-point diamond turning(SPDT)and SDM while incorporating surface defects in the(i)circumferential and(ii)radial directions.Complementary 3D finite element analysis(FEA)was performed to analyse the cutting forces and the evolution of residual stress on the machined wafer.It was found that the surface defects generated in the circumferential direction with an interspacing of 1 mm revealed the lowest average surface roughness(Ra)of 3.2 nm as opposed to 8 nm Ra obtained through conventional SPDT using the same cutting parameters.The observation of the Raman spectroscopy performed on the cutting chips showed remnants of phase transformation during the micromachining process in all cases.FEA was used to extract quantifiable information about the residual stress as well as the sub-surface integrity and it was discovered that the grooves made in the circumferential direction gave the best machining performance.The information being reported here is expected to provide an avalanche of opportunities in the SPDT area for low-cost machining solution for a range of other nominal hard,brittle materials such as SiC,ZnSe and GaAs as well as hard steels.

Modelling of grinding mechanics:A review

Grinding is one of the most widely used material removal methods at the end of many process chains.Grinding force is related to almost all grinding parameters,which has a great influence on material removal rate,dimensional and shape accuracy,surface and subsurface integrity,thermodynamics,dynamics,wheel durability,and machining system deformation.Considering that grinding force is related to almost all grinding parameters,grinding force can be used to detect grinding wheel wear,energy calculation,chatter suppression,force control and grinding process simulation.Accurate prediction of grinding forces is important for optimizing grinding parameters and the structure of grinding machines and fixtures.Although there are substantial research papers on grinding mechanics,a comprehensive review on the modeling of grinding mechanics is still absent from the literature.To fill this gap,this work reviews and introduces theoretical methods and applications of mechanics in grinding from the aspects of modeling principles,limitations and possible future trendencies.

A Simulated Investigation of Ductile Response of GaAs in Single-Point Diamond Turning and Experimental Validation

In this paper,molecular dynamic(MD)simulation was adopted to study the ductile response of single-crystal GaAs during single-point diamond turning(SPDT).The variations of cutting temperature,coordination number,and cutting forces were revealed through MD simulations.SPDT experiment was also carried out to qualitatively validate MD simulation model from the aspects of normal cutting force.The simulation results show that the fundamental reason for ductile response of GaAs during SPDT is phase transition from a perfect zinc blende structure(GaAs-I)to a rock-salt structure(GaAs-II)under high pressure.Finally,a strong anisotropic machinability of GaAs was also found through MD simulations.

Toolpath Interpolation and Smoothing for Computer Numerical Control Machining of Freeform Surfaces: A Review

Driven by the ever increasing demand in function integration,more and more next generation high value-added products,such as head-up displays,solar concentrators and intra-ocular-lens,etc.,are designed to possess freeform(i.e.,non-rotational symmetric)surfaces.The toolpath,composed of high density of short linear and circular segments,is generally used in computer numerical control(CNC)systems to machine those products.However,the discontinuity between toolpath segments leads to high-frequency fluctuation of feedrate and acceleration,which will decrease the machining efficiency and product surface finish.Driven by the ever-increasing need for high-speed high-precision machining of those products,many novel toolpath interpolation and smoothing approaches have been proposed in both academia and industry,aiming to alleviate the issues caused by the conventional toolpath representation and interpolation methods.This paper provides a comprehensive review of the state-of-the-art toolpath interpolation and smoothing approaches with systematic classifications.The advantages and disadvantages of these approaches are discussed.Possible future research directions are also offered.

Insight into Atomic-Scale Adhesion at the C-Cu Interface During theInitial Stage of Nanoindentation

Adhesion is a common phenomenon in nanomachining which affects processing accuracy and repeatability.As material removal approaches the atomic or close-to-atomic scale,quantum mechanics becomes the dominant principle behind the atomic-level interaction.However,atomic-scale effects cannot be properly described by empirical potential function-based molecular dynamics simulations.This study uses a first-principles method to reveal the atomic-scale adhesion between a diamond tip and a copper slab during initial-stage nanoindentation.Using a simplified tip and slab model,adhesion energy,electronic distribution,and density of states are analyzed based on quantum chemistry calculation.Results show that atomic adhesion is primarily due to the covalent bonding interaction between C and Cu atoms,which can induce structural changes to the diamond tip and copper slab.The effects of tip position and angles on adhesion are further studied through a series of simulations.The results show that adhesion between the tip and slab is sensitive to the lattice structure and a variant in angstroms is enough to cause different adhesion and structural changes.The actual determinants of adhesion can only be the atomic and electronic structures at the tip-slab interface.Bond rotation and breakage are observed during simulation and their effects on adhesion are further discussed.To conclude,the first-principles method is important for the analysis of an atomic-scale interaction system,even if only as an aid to describing adhesion at atomic and electronic scales.

Atomic-Scale Friction Studies on Single-Crystal Gallium Arsenide Using Atomic Force Microscope and Molecular Dynamics Simulation

This paper provides a fresh perspective and new insights into nanoscale friction by investigating it through molecular dynamics(MD)simulation and atomic force microscope(AFM)nanoscratch experiments.This work considered gallium arsenide,an importantⅢ-Ⅴdirect bandgap semiconductor material residing in the zincblende structure,as a reference sample material due to its growing usage in 5G communication devices.In the simulations,the scratch depth was tested as a variable in the fine range of 0.5-3 nm to understand the behavior of material removal and to gain insights into the nanoscale friction.Scratch force,normal force,and average cutting forces were extracted from the simulation to obtain two scalar quantities,namely,the scratch cutting energy(defined as the work performed to remove a unit volume of material)and the kinetic coefficient of friction(defined as the force ratio).A strong size effect was observed for scratch depths below 2 nm from the MD simulations and about 15 nm from the AFM experiments.A strong quantitative corroboration was obtained between the specific scratch energy determined by the MD simulations and the AFM experiments,and more qualitative corroboration was derived for the pile-up and the kinetic coefficient of friction.This conclusion suggests that the specific scratch energy is insensitive to the tool geometry and the scratch speed used in this investigation.However,the pile-up and kinetic coefficient of friction are dependent on the geometry of the tool tip.

Foreword to the Special Issue on Nanofabrication,Atomic and Close-to-atomic Scale Manufacturing

Nanomanufacturing covers a wide range of manufacturing technologies for enabling nanoscale materials,structures,components,devices,and systems through the manipula-tion and control of matter at the nano-scale.This is pivotal to our economy,as nanoproducts such as nano materials,nanooptics,nanosensors,nanoelectronics,NEMS,etc.,are becoming established in major areas of our daily lives and can already be found across a broad spectrum of application areas,especially in sectors such as autos,appliances,electronics,photonics,food,healthcare,and fitness.