In this study, a new unified creep constitutive relation and a mod- ified energy-based fatigue model have been established respectively to describe the creep flow and predict the fatigue life of Sn-Pb solders. It is f...In this study, a new unified creep constitutive relation and a mod- ified energy-based fatigue model have been established respectively to describe the creep flow and predict the fatigue life of Sn-Pb solders. It is found that the relation successfully elucidates the creep mechanism related to current constitutive relations. The model can be used to describe the temperature and frequency dependent low cycle fatigue behavior of the solder. The relation and the model are further employed in part Ⅱ to develop the numerical simulation approach for the long-term reliability assessment of the plastic ball grid array (BGA) assembly.展开更多
In this paper, a novel interferometric method with a wide range of sensitivities, called holography quasi projection moire, is proposed. It combines the features of the variated double projection moire method and the ...In this paper, a novel interferometric method with a wide range of sensitivities, called holography quasi projection moire, is proposed. It combines the features of the variated double projection moire method and the holographic interferometry method. This technique is used to study the failure modes of microelectronic packaging modules.展开更多
In the present study,a facility,i.e.,a mechanical deflection system (MDS),was established and applied to assess the long-term reliability of the solder joints in plastic ball grid array (BGA) assembly.It was found tha...In the present study,a facility,i.e.,a mechanical deflection system (MDS),was established and applied to assess the long-term reliability of the solder joints in plastic ball grid array (BGA) assembly.It was found that the MDS not only quickly assesses the long-term reliability of solder joints within days,but can also mimic similar failure mechanisms in accelerated thermal cycling (ATC) tests. Based on the MDS and ATC reliability experiments,the acceleration factors (AF) were obtained for different reliability testing conditions.Furthermore,by using the creep constitutive relation and fatigue life model developed in part I,a numerical approach was established for the purpose of virtual life prediction of solder joints. The simulation results were found to be in good agreement with the test results from the MDS.As a result,a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of plastic BGA assembly.展开更多
基金The project supported by the National Natural Science Foundation of China (59705008)
文摘In this study, a new unified creep constitutive relation and a mod- ified energy-based fatigue model have been established respectively to describe the creep flow and predict the fatigue life of Sn-Pb solders. It is found that the relation successfully elucidates the creep mechanism related to current constitutive relations. The model can be used to describe the temperature and frequency dependent low cycle fatigue behavior of the solder. The relation and the model are further employed in part Ⅱ to develop the numerical simulation approach for the long-term reliability assessment of the plastic ball grid array (BGA) assembly.
基金The project supported by the National Natural Science Foundation of China
文摘In this paper, a novel interferometric method with a wide range of sensitivities, called holography quasi projection moire, is proposed. It combines the features of the variated double projection moire method and the holographic interferometry method. This technique is used to study the failure modes of microelectronic packaging modules.
基金The project supported by the National Natural Science Foundation of China (59705008)
文摘In the present study,a facility,i.e.,a mechanical deflection system (MDS),was established and applied to assess the long-term reliability of the solder joints in plastic ball grid array (BGA) assembly.It was found that the MDS not only quickly assesses the long-term reliability of solder joints within days,but can also mimic similar failure mechanisms in accelerated thermal cycling (ATC) tests. Based on the MDS and ATC reliability experiments,the acceleration factors (AF) were obtained for different reliability testing conditions.Furthermore,by using the creep constitutive relation and fatigue life model developed in part I,a numerical approach was established for the purpose of virtual life prediction of solder joints. The simulation results were found to be in good agreement with the test results from the MDS.As a result,a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of plastic BGA assembly.
