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Investigation of the tarnish on the surface of a panda gold coin 被引量:1
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作者 YANG Changjiang LIANG Chenghao WANG Peng 《Rare Metals》 SCIE EI CAS CSCD 2007年第1期68-73,共6页
In natural environment, tarnish was observed on the surface of historic and contemporary gold coins in several countries. Few years after the emergence of panda gold coins, several red spots were appeared on the surfa... In natural environment, tarnish was observed on the surface of historic and contemporary gold coins in several countries. Few years after the emergence of panda gold coins, several red spots were appeared on the surface. To identify the stains and to examine the spots, optical microscope (OM), scanning electron microscope (SEM), electron microprobe analysis (EMPA), X-ray photoelectron spectroscopy (XPS), and X-ray diffraction (XRD) were used. It was found by microscopic observation that the stain has a dark blue central area surrounded by a large area with a nuance of colors from brown to red. Red spots usually contain holes in the center, which are distributed along the forging stress zones formed in the struck process. From the surface analyses using EMPA, sulfur and silver are detected besides gold, and the contents of Ag and S at the tarnish part are higher than those at the other part. Furthermore, distributions of Ag and S are correlated with the morphology of stains. XPS shows that components of stains are Ag2S and Ag2SO4 and the former is much predominant. These results are confirmed using XRD analysis. Accelerated tarnish test of gold in an atmosphere containing sulfur compound proves that the similar phenomenon appears when a small amount of silver is present on the surface of gold. It can be concluded that the occurrence of tarnish stains is caused by the presence of Ag and S. 展开更多
关键词 gold coins CORROSION ANALYSES tarnish SILVER
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Electrochemical Behavior of Antimierobial Stainless Steel Bearing Copper in Sulfate Reducing Bacterial Medium
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作者 王华 LIANG Chenghao 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2008年第1期113-117,共5页
The electrochemical characteristic of antimicrobial stainless steel bearing copper NSSAM3 in sulfate reducing bacterial (SRB) was investigated by electrochemical impedance spectroscopy (EIS) and potentiodynamic po... The electrochemical characteristic of antimicrobial stainless steel bearing copper NSSAM3 in sulfate reducing bacterial (SRB) was investigated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization. The results show that inoculation of SRB into the culture medium significantly affects the anodic polarization behavior of NSSAM3 and accelerates anodic depolarization process, however, it has little effect on cathodic polarization curves of NSSAM3. Under the same exposure time, the anodic polarization curves of NSSAM3 in culture medium with SRB are in anodic active dissolution state when anodic polarization potential value is below 0 V(SCE), whose anodic polarization current density is bigger than that of in culture medium without SRB. Moreover, when the concentration of Cu^2+ in SRB medium increases, anodic polarization current density of NSSAM3 decreases and polarization resistance increases with increasing time. Scanning electron microscope (SEM) observations indicate that SRB unevenly attaches on the surface of NSSAM3, and induces the sensitivity to local corrosion. 展开更多
关键词 antimicrobial stainless steel sulfate reducing bacterial electrochemical characteristic electrochemical impedance spectroscopy
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