This paper numerically investigates the effect of the location of a horizontal fin on the melting of a phase change material(PCM)inside a rectangular enclosure heated by multiple discrete pulsed protruding heat source...This paper numerically investigates the effect of the location of a horizontal fin on the melting of a phase change material(PCM)inside a rectangular enclosure heated by multiple discrete pulsed protruding heat sources.The fin and the phase change material filling the enclosure store the thermal energy extracted from the heat sources,in sensible and latent forms.The heat sources are assumed to simulate electronic components undergoing a superheating technical issue.By extracting heat from the electronics,the PCM plays the role of a heat sink.To analyze the thermal behavior and predict the cooling performance of the proposed cooling system,we derive a nonlinear mathematical model based on mass,momentum and energy conservation laws.Several numerical investigations are conducted to quantify the influence of the fin position on the thermal behavior and the cooling performance of the heat sink.Predictions include the transient maximum temperature occurring inside the heat sources and the liquid volume.A comparison between our numerical results and experimental data selected from the literature shows a good agreement.The main conclusion is that the presence of the fin leads to a slight increase in the melting time.展开更多
This work aims to numerically study the melting natural convection in a rectangular enclosure heated by three discreet protruding electronic chips. The beat sources generate heat at a constant and uniform volumetric r...This work aims to numerically study the melting natural convection in a rectangular enclosure heated by three discreet protruding electronic chips. The beat sources generate heat at a constant and uniform volumetric rate. A part of the power generated in the heat sources is dissipated to a phase change material （PCM, n-eicosane with melting temperature, Tm = 36℃）. Numerical investigations were carded out in order to examine the effects of the plate thickness on the maximum temperature of electronic components, the percentage contribution of plate heat conduction on the total removed heat and temperature profiles in the plate. Con＇elations for the dimensionless secured working time （time to reach the threshold temperature, Tcr = 75℃） and the corresponding liquid fraction were derived.展开更多
文摘This paper numerically investigates the effect of the location of a horizontal fin on the melting of a phase change material(PCM)inside a rectangular enclosure heated by multiple discrete pulsed protruding heat sources.The fin and the phase change material filling the enclosure store the thermal energy extracted from the heat sources,in sensible and latent forms.The heat sources are assumed to simulate electronic components undergoing a superheating technical issue.By extracting heat from the electronics,the PCM plays the role of a heat sink.To analyze the thermal behavior and predict the cooling performance of the proposed cooling system,we derive a nonlinear mathematical model based on mass,momentum and energy conservation laws.Several numerical investigations are conducted to quantify the influence of the fin position on the thermal behavior and the cooling performance of the heat sink.Predictions include the transient maximum temperature occurring inside the heat sources and the liquid volume.A comparison between our numerical results and experimental data selected from the literature shows a good agreement.The main conclusion is that the presence of the fin leads to a slight increase in the melting time.
文摘This work aims to numerically study the melting natural convection in a rectangular enclosure heated by three discreet protruding electronic chips. The beat sources generate heat at a constant and uniform volumetric rate. A part of the power generated in the heat sources is dissipated to a phase change material （PCM, n-eicosane with melting temperature, Tm = 36℃）. Numerical investigations were carded out in order to examine the effects of the plate thickness on the maximum temperature of electronic components, the percentage contribution of plate heat conduction on the total removed heat and temperature profiles in the plate. Con＇elations for the dimensionless secured working time （time to reach the threshold temperature, Tcr = 75℃） and the corresponding liquid fraction were derived.
