Currently most light emitting diode （LED） components are made with individual chip packaging technology. The main manufacturing processes follow conventional chip-based IC packaging. In the past several years, there...Currently most light emitting diode （LED） components are made with individual chip packaging technology. The main manufacturing processes follow conventional chip-based IC packaging. In the past several years, there has been an uprising trend in the IC industry to migrate from chip-based packaging to wafer level packaging （WLP）. Therefore, there is a need for LEDs to catch up. This paper introduces advanced LED WLP technologies. The contents cover key enabling processes such as preparation of silicon sub-mount wafer, implementation of interconnection, deposition of phosphor, wafer level encapsulation, and their integration. The emphasis is placed on how to achieve high throughput, low cost manufacturing through WLE展开更多
Modulation bandwidth and the emission region are essential features for the widespread use of visible light communications(VLC).This paper addresses the contradictory requirements to achieve broadband and proposes ult...Modulation bandwidth and the emission region are essential features for the widespread use of visible light communications(VLC).This paper addresses the contradictory requirements to achieve broadband and proposes ultrafast,asymmetric pyramids grown on adjacent deep concave holes via lateral overgrowth.Multicolor emission with an emission region between 420 nm and 600 nm is obtained by controlling the growth rate at different positions on the same face,which also can provide multiple subcarrier frequency points for the employment of wavelength division multiplexing technology.The spontaneous emission rate distinction is narrowed by lowering the number of the crystal plane,ensuring a high modulation bandwidth over broadband.More importantly,the residual stress and dislocation density were minimized by employing a patterned substrate,and lateral overgrowth resulted in a further enhancement of the recombination rate.Finally,the total modulation bandwidth of multiple subcarriers of the asymmetric pyramids is beyond GHz.These ultrafast,multicolor microLEDs are viable for application in VLC systems and may also enable applications for intelligent lighting and display.展开更多
文摘Currently most light emitting diode （LED） components are made with individual chip packaging technology. The main manufacturing processes follow conventional chip-based IC packaging. In the past several years, there has been an uprising trend in the IC industry to migrate from chip-based packaging to wafer level packaging （WLP）. Therefore, there is a need for LEDs to catch up. This paper introduces advanced LED WLP technologies. The contents cover key enabling processes such as preparation of silicon sub-mount wafer, implementation of interconnection, deposition of phosphor, wafer level encapsulation, and their integration. The emphasis is placed on how to achieve high throughput, low cost manufacturing through WLE
基金Major State Basic Research Development Program of China(2016YFB0400801)National Natural Science Foundation of China(61774121,6190030620)+2 种基金Natural Science Foundation of Shaanxi Province(2020JQ-074)Postdoctoral Research Foundation of China(2019M653640,2019M663718)Fundamental Research Funds for the Central Universities(xjh012019038).
文摘Modulation bandwidth and the emission region are essential features for the widespread use of visible light communications(VLC).This paper addresses the contradictory requirements to achieve broadband and proposes ultrafast,asymmetric pyramids grown on adjacent deep concave holes via lateral overgrowth.Multicolor emission with an emission region between 420 nm and 600 nm is obtained by controlling the growth rate at different positions on the same face,which also can provide multiple subcarrier frequency points for the employment of wavelength division multiplexing technology.The spontaneous emission rate distinction is narrowed by lowering the number of the crystal plane,ensuring a high modulation bandwidth over broadband.More importantly,the residual stress and dislocation density were minimized by employing a patterned substrate,and lateral overgrowth resulted in a further enhancement of the recombination rate.Finally,the total modulation bandwidth of multiple subcarriers of the asymmetric pyramids is beyond GHz.These ultrafast,multicolor microLEDs are viable for application in VLC systems and may also enable applications for intelligent lighting and display.
