Validating the accuracy of a multifunctional smartwatch sphygmomanometer to monitor blood pressure

BACKGROUND Hypertension is the most modifiable factor associated with cardiovascular events and complications.The conventional blood pressure(BP) meter method is simple but is limited in terms of real-time monitoring abnormal BP.Therefore,the development of a multifunction smartwatch(HUAWEI WATCH D) sphygmomanometer could significantly improve integrated BP monitoring.METHODS We enrolled 361 subjects from Chinese PL A General Hospital,Beijing,China to validate the accuracy of the smartwatch versatile sphygmomanometer using ISO 81060-2:2018.Resting and ambulatory BP accuracy of the smartwatch were compared with gold standard clinical sphygmomanometers using ISO 81060-2:2018 guidelines,the accuracy of 24 h systolic blood pressure(SBP) circadian rhythm monitoring,and diurnal high SBP alert for this smartwatch were assessed using a confusion matrix approach.Additionally,we analyzed online users of different ages for compliance.RESULTS Eighty-five subjects underwent resting BP measurements;the mean resting BP differences between two devices were-0.683±6.203 mmHg(SBP)(P=0.723) and 1.628±5.028 mmHg(diastolic blood pressure,DBP)(P=0.183).In 35 subjects’ ambulatory BP measurements,the mean differences of ambulatory BP were-1.943±5.475 mmHg(SBP)(P=0.923) and 3.195±5.862 mmHg(DBP)(P=0.065).All data complied with ISO 81060-2:2018 guidelines(mean ≤±5 mmHg and standard deviation ≤±8 mmHg) with no significant differences.Positive predictive values(PPV) of resting SBP and DBP were 0.635 and 0.671,respectively.The PPV of ambulatory SBP and DBP were 0.686.Also,24 h SBP circadian rhythm monitoring was performed in 107 subjects:accuracy=0.850,specificity=0.864,precision/PPV=0.833,sensitivity=0.833,and F1-measure(F1)=0.833.The accuracy,specificity,precision,sensitivity,and F1 values in 85 subjects undergoing diurnal high SBP alerting were 0.858,0.876,0.706,0.809,and 0.754,respectively.CONCLUSIONS When compared with the gold standard clinical sphygmomanometer,smartwatch results were consistent and accurate.Online user feedback showed that elderly individuals cared more about BP monitoring accuracy,with better compliance.

Conductive microsphere monolayers enabling highly conductive pressure-sensitive adhesive tapes for electromagnetic interference shielding

Conductive adhesive tape is one kind of electromagnetic interference(EMI)shielding materials for electronic packaging.However,the inferior conductivity of the pressure-sensitive adhesive(PSA)layer results in serious electromagnetic leakage at the conjunctions between the conductive tapes and target objects.Adding conductive fillers is a traditional method for highly conductive adhesive tapes.However,the content of conductive fillers is needed to reach the percolation threshold,which is usually as high as tens of percent.High-content fillers result in significant loss of adhesive property and high fabrication cost.Herein,we introduce a rational architecture of conductive microsphere monolayer(CMM)in the PSA layer.The CMM connects the top and bottom surfaces of the PSA layer and improves its conductivity in the z-direction.Importantly,low contents of conductive microspheres(≤5%(mass fraction,w))can achieve the target of conductivity improvement,but not result in the serious loss of the adhesive property.Therefore,the strategy of CMMs can balance the tradeoff between the conductivity and the adhesive property of conductive PSA tapes.Finally,we demonstrate the superior EMI shielding performance of as-made conductive adhesive tapes,indicating their potential applications as the advanced EMI shielding materials in the electronic packaging.

Manufacturability and mechanical reliability study for heterogeneous integration system in display(HiSID)

In this paper,the system on display panel(SoDP)architecture,the primary stage of heterogeneous integration system in display(HiSID),is introduced for the first time.In this architecture,the driving components of display,which are supposed to be on the display flexible print circuit(FPC)in traditional architecture,are innovatively integrated onto the backside of display panel.Through the SoDP architecture,the simulated impact strain in the panel fan-out region can decrease about 30%compared to the traditional architecture,and SoDP provides more the 10 mm extra space in the in-plane Y-direction for holding a larger battery.Also,the SoDP is compatible with the current organic laser emitted diode(OLED)and system in package(SiP)processes.Besides the primary stage,this paper also presents a comprehensive and extensive analysis on the challenges of the manufacturability for the advanced stage of HiSID from four key technologies perspectives:device miniaturization,massive manufacturing,driving technology,and advanced heterogeneous integration.