Design of a Light, Foldable and Flexibility Lunar Base

In this paper, to meet the environmental requirements for the lunar surface, we outline the design of an intelligent shape memory polymer(SMP) capsule structure of lightweight using a flexible composite skin. Key breakthrough technology for manufacturing the high-performance multilayer composite is utilized to realize the requirements for folding and compressing during launching, and unfolding on the lunar surface, taking into account the current opposing requirements for launching and the space transportation mission of large equipment. Based upon the reduced constraints, better expansibility and easy assembly, this lunar base is suited to the initial and interim phases of a moon construction, and provides a national solution in the construction of lunar base on moon.

Optimization of Dimples in Microchannel Heat Sink with Impinging Jets Part A： Mathematical Model and the Influence of Dimple Radius

With increasing heat fluxes caused by electronic components, dimples have attracted wide attention by researchers and have been applied to microchannel heat sink in modern advanced cooling technologies. In this work, the combination of dimples, impinging jets and microchannel heat sink was proposed to improve the heat transfer performance on a cooling surface with a constant heat flux 500 W/cm^2. A mathematical model was advanced for numerically analyzing the fluid flow and heat transfer characteristics of a microchannel heat sink with impinging jets and dimples(MHSIJD), and the velocity distribution, pressure drop, and thermal performance of MHSIJD were analyzed by varying the radii of dimples. The results showed that the combination of dimples and MHSIJ can achieve excellent heat transfer performance; for the MHSIJD model in this work, the maximum and average temperatures can be as low as 320 K and 305 K, respectively when mass flow rate is 30 g/s; when dimple radius is larger than 0.195 mm, both the heat transfer coefficient and the overall performance h/ΔP of MHSIJD are higher than those of MHSIJ.

Numerical Study on the Thermal Stress and its Formation Mechanism of a Thermoelectric Device

The strong thermo-mechanical stress is one of the most critical failure mechanisms that affect the durability of thermoelectric devices. In this study, numerical simulations on the formation mechanism of the maximum thermal stress inside the thermoelectric device have been performed by using finite element method. The influences of the material properties and the thermal radiation on the thermal stress have been examined. The results indicate that the maximum thermal stress was located at the contact position between the two materials and occurred due to differential thermal expansions and displacement constraints of the materials. The difference in the calculated thermal stress value between the constant and the variable material properties was between 3% and 4%. At a heat flux of 1 W·cm^(-2) and an emissivity of 0.5, the influence of the radiation heat transfer on the thermal stress was only about 5%; however, when the heat flux was 20 W·cm^(-2) and the emissivity was 0.7, the influence of the radiation heat transfer was more than 30%.

Optimization of Dimples in Microchannel Heat Sink with Impinging Jets-Part B： the Influences of Dimple Height and Arrangement

The combination of a microchannel heat sink with impinging jets and dimples(MHSIJD) can effectively improve the flow and heat transfer performance on the cooling surface of electronic devices with very high heat fluxes. Based on the previous work by analysing the effect of dimple radius on the overall performance of MHSIJD, the effects of dimple height and arrangement were numerically analysed. The velocity distribution, pressure drop, and thermal performance of MHSIJD under various dimple heights and arrangements were presented. The results showed that: MHSIJD with higher dimples had better overall performance with dimple radius being fixed; creating a mismatch between the impinging hole and dimple can solve the issue caused by the drift phenomenon; the mismatch between the impinging hole and dimple did not exhibit better overall performance than a well-matched design.