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A New High Performance Realization of Hyperchaotic Modified Canonical Chua Circuit Using JFETs
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作者 Prem Bhushan Mital Umesh Kumar R.S. Prasad 《Chinese Physics Letters》 SCIE CAS CSCD 2008年第8期2803-2805,共3页
A new implementation of hyperchaotic modified canonical Chua circuit using junction field-effect transistors (JFETs) is proposed. The design is based on a source coupled JFET circuit to approximate a smooth cubic no... A new implementation of hyperchaotic modified canonical Chua circuit using junction field-effect transistors (JFETs) is proposed. The design is based on a source coupled JFET circuit to approximate a smooth cubic nonlinearity and a two-terminal negative resistance element containing a p-n-p silicon transistor and an n-channel JFET. The realization is supported by Orcad Pspice simulation and numerical MATLAB results. The hyperchaotic nature is confirmed by two positive Lyapunov exponents associated with the attractor which is a fractal with a Lyapunov dimension between 3 and 4. 展开更多
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On-road emissions of CO,CO2 and NOx from four wheeler and emission estimates for Delhi 被引量:1
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作者 Jaiprakash Gazala Habib +2 位作者 Anil Kumar Akash Sharma Minza Haider 《Journal of Environmental Sciences》 SCIE EI CAS CSCD 2017年第3期39-47,共9页
This study presents the emission factor of gaseous pollutants (CO, CO2, and NOx) from on-road tailpipe measurement of 14 passenger cars of different types of fuel and vintage. The trolley equipped with stainless ste... This study presents the emission factor of gaseous pollutants (CO, CO2, and NOx) from on-road tailpipe measurement of 14 passenger cars of different types of fuel and vintage. The trolley equipped with stainless steel duct, vane probe velocity meter, flue gas analyzer, Nondispersive infra red (NDIR) C02 analyzer, temperature, and relative humidity (RH) sensors was connected to the vehicle using a towing system. Lower CO and higher NOx emissions were observed from new diesel cars (post 2010) compared to old cars (post 2005), which implied that new technological advancement in diesel fueled passenger cars to reduce CO emission is a successful venture, however, the use of turbo charger in diesel cars to achieve high temperature combustion might have resulted in increased NOx emissions. Based on the measured emission factors (g/kg0, and fuel consumption (kg), the average and 95% confidence interval (CI) bound estimates of CO, CO2, and NOx from four wheeler (4W) in Delhi for the year 2012 were 15.7 (1.4-37.1), 6234 (386-12,252), and 30.4 (0.0-103) Gg/year, respectively. The contribution of diesel, gasoline and compressed natural gas (CNG) to total CO, C02 and NOx emissions were 7:84:9, 50:48:2 and 58:41:1 respectively. The present work indicated that the age and the maintenance of vehicle both are important factors in emission assessment therefore, more systematic repetitive measurements coveting wide range of vehicles of different age groups, engine capacity, and maintenance level is needed for refining the emission factors with CI. 展开更多
关键词 Mobile sampling systemOn-road emissionEmission factorPassengers cars
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Propagation delay and power dissipation for different aspect ratio of single-walled carbon nanotube bundled TSV
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作者 Tanu Goyal Manoj Kumar Majumder Brajesh Kumar Kaushik 《Journal of Semiconductors》 EI CAS CSCD 2015年第6期99-104,共6页
Through-silicon vias (TSVs) have provided an attractive solution for three-dimensional (3D) integrated devices and circuit technologies with reduced parasitic losses and power dissipation, higher input-output (I/... Through-silicon vias (TSVs) have provided an attractive solution for three-dimensional (3D) integrated devices and circuit technologies with reduced parasitic losses and power dissipation, higher input-output (I/O) den- sity and improved system performance. This paper investigates the propagation delay and average power dissipation of single-walled carbon nanotube bundled TSVs having different via radius and height. Depending on the physical configuration, a comprehensive and accurate analytical model of CNT bundled TSV is employed to represent the via (vertical interconnect access) line of a driver-TSV-load (DTL) system. The via radius and height are used to estimate the bundle aspect ratio (AR) and the cross-sectional area. For a fixed via height, the delay and the power dissipation are reduced up to 96.2% using a SWCNT bundled TSV with AR = 300 : 1 in comparison to AR = 6:1. 展开更多
关键词 carbon nanotube through-silicon vias equivalent RLC circuit model propagation delay power-delay product area-delay product
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