Microelectronic power converters such as buck and boost converter are required to be tolerant to radiations including electron radiation. This paper examines electron radiation effects on the Ⅰ-Ⅴ characteristics of ...Microelectronic power converters such as buck and boost converter are required to be tolerant to radiations including electron radiation. This paper examines electron radiation effects on the Ⅰ-Ⅴ characteristics of VDMOSFET and its corresponding effects in buck converter. Analysis of the electrical characteristics shows that after irradiation the threshold voltage and drain current for all VDMOSFETs degraded more than two orders of magnitude. The impact of this electrical degradation has been investigated in an application of typical buck converter circuit. The buck converter with n-channel switching transistor shows that after irradiation its output voltage increased with the drain current in the n-channel ZVN4424 A VDMOSFET, while the buck converter with p-channel switching transistor shows its output voltage decreased with the drain current in the p-channel ZVP4424 A VDMOSFET after irradiation.展开更多
Hot plate forming using a cell-typed die is a process for forming a large thick plate with a spherical shape for the manufacture of a large spherical LNG tank.Cell-typed upper and lower dies made of a framework of ste...Hot plate forming using a cell-typed die is a process for forming a large thick plate with a spherical shape for the manufacture of a large spherical LNG tank.Cell-typed upper and lower dies made of a framework of steel plates fitted to make a grid pattern are used in this process,and an air-cooling device is separately installed inside the lower die.A finite element analysis (FEA) technique was developed,which included hot forming,air flow,cooling and thermal deformation analysis for the hot plate forming process using the cell-typed die.Further,the convective and interface heat transfer coefficients were used to reproduce analytically the effects of the cooling device in the hot plate forming analysis.A small-scale model test of the process was conducted to verify the FEA technique.The analysis results show that the curvature of the final plate agrees well with that of the designed experiment within a maximum relative error of 0.03% at the corner of the plate.展开更多
基金funded by International Islamic University Malaysia(No.EDW B14-159-1044)
文摘Microelectronic power converters such as buck and boost converter are required to be tolerant to radiations including electron radiation. This paper examines electron radiation effects on the Ⅰ-Ⅴ characteristics of VDMOSFET and its corresponding effects in buck converter. Analysis of the electrical characteristics shows that after irradiation the threshold voltage and drain current for all VDMOSFETs degraded more than two orders of magnitude. The impact of this electrical degradation has been investigated in an application of typical buck converter circuit. The buck converter with n-channel switching transistor shows that after irradiation its output voltage increased with the drain current in the n-channel ZVN4424 A VDMOSFET, while the buck converter with p-channel switching transistor shows its output voltage decreased with the drain current in the p-channel ZVP4424 A VDMOSFET after irradiation.
基金Project(2010-0008-277)supported by the NCRC(National Core Research Center)Program through the National Research Foundation of Korea,funded by the Ministry of Education,Science,and TechnologyProject supported by R&D for Technology Development Program of Ministry of Knowledge Economy,Korea
文摘Hot plate forming using a cell-typed die is a process for forming a large thick plate with a spherical shape for the manufacture of a large spherical LNG tank.Cell-typed upper and lower dies made of a framework of steel plates fitted to make a grid pattern are used in this process,and an air-cooling device is separately installed inside the lower die.A finite element analysis (FEA) technique was developed,which included hot forming,air flow,cooling and thermal deformation analysis for the hot plate forming process using the cell-typed die.Further,the convective and interface heat transfer coefficients were used to reproduce analytically the effects of the cooling device in the hot plate forming analysis.A small-scale model test of the process was conducted to verify the FEA technique.The analysis results show that the curvature of the final plate agrees well with that of the designed experiment within a maximum relative error of 0.03% at the corner of the plate.
