Out of Plane Thermal Conductivity of Carbon Fiber Reinforced Composite Filled with Diamond Powder

Highly conductive fillers have a strong influence on improving the poor out of plane thermal conductivity of carbon fiber reinforced composites. The objective of this study has been to investigate the role of the diamond powder (DP) in enhancing the out-of-plane thermal conductivity of the woven composites. Samples of the standard modulus T300 carbon fiber composite with 44% and 55% fiber volume fraction and the high modulus YS90A carbon fiber composite with 50% volume fraction were fabricated with their matrices comprising of neat epoxy and different loading of diamond powder within epoxy resin. Steady state thermal conductivity measurements were carried out and it was found from the measurements that the out of plane thermal conductivity of the standard modulus composite increased by a factor of 2.3 with 14% volume fraction of diamond powder in the composite while the out of plane thermal conductivity of the high modulus composite increased by a factor of 2.8 with 12% volume fraction of diamond powder in the composite. Finite Element Modeling (FEM) with the incorporation of microstructural characteristics is presented and good consistency between the measurements and FEM results were observed.

Validation of Numerical Modeling for the Prediction of Elastic and Failure Behavior of Diamond Powder Filled Woven Composites

A numerical investigation was carried out to examine the role of micro-sized diamond powder filler on the on-axis tensile stiffness properties of the standard modulus T300 and the high modulus YS90A woven fabric composite plates by progressive damage modeling. Finite element modeling (FEM) results for the T300 composite with and without diamond powder predicted a specific case of fiber failure in all the plies showing the characteristics of brittle failure. Static tensile tests were carried out on the YS90A composite coupons containing no diamond powder (DP) and filled with 6% and 12% volume fractions of DP. A higher content of diamond powder in the coupons led to agglomeration. This induced stress concentrations and subsequently reduced the mechanical properties. FEM was carried out considering specimens with and without an induced stress concentration geometry in the YS90A coupons filled with DP. The results of the on-axis tensile tests indicated a delamination type of failure in both cases with additional fiber fracture in the Open Hole Tensile (OHT) coupons.

表面接枝改性纳米二氧化硅填充聚丙烯的结晶行为

应用差示扫描量热方法研究了纳米二氧化硅 (SiO2 )及其表面接枝改性对聚丙烯 (PP)结晶过程、等温与非等温结晶动力学的影响 ,并研究了上述等温结晶的熔融行为和平衡熔点 .研究发现纳米SiO2 具有明显的异相成核效应 ,能够提高PP的结晶温度、熔融温度、结晶度和结晶速率 ,但降低聚丙烯结晶的完善程度 .粒子的表面接枝处理 ,因改善了粒子与基体的亲和性而有利于粒子成核效应的提高 。

纳米碳化硅填充环氧树脂复合材料的摩擦磨损特性

以提高环氧树脂的摩擦磨损性能为目的,研究了纳米碳化硅粒子填充环氧树脂复合材料的滑动干摩擦磨损特性,着重探讨纳米粒子表面接枝改性、纳米粒子含量、摩擦条件等对复合材料摩擦学性能的影响。通过对复合材料磨损表面的形貌分析,以及复合材料的热变形性能和表面硬度的测定,探讨了复合材料的磨损机理。结果表明,纳米碳化硅粒子能在很低的含量下提高环氧树脂耐磨性、并降低其摩擦系数,而经过接枝处理后的纳米碳化硅粒子填充复合材料的上述性能改善更为明显,耐磨性比环氧树脂提高近4倍,摩擦系数降低36%。这说明在SiC纳米粒子表面引入聚丙烯酰胺接枝链后,由于界面的强相互作用(包括化学键合与链纠缠),有效地提高了复合材料的抵抗裂纹引发能力等性能,从而有利于改善其摩擦学性能。

纳米Al_2O_3填充环氧树脂复合材料的摩擦学性能

研究了干摩擦条件下纳米Al2O3微粒含量及其表面改性处理对环氧树脂基复合材料滑动摩擦磨损性能的影响.结果表明,经过表面化学接枝处理后,少量的纳米Al2O3(体积分数约0.24%)即可大幅度提高环氧树脂的摩擦磨损性能,起到显著的减摩和耐磨作用.复合材料的热变形稳定性、显微硬度及磨损表面形貌分析结果表明,对纳米Al2O3微粒进行适当的表面处理有利于加强纳米微粒同基体树脂的结合,从而改善复合材料的摩擦学性能.

减摩耐磨用无机颗粒/高分子复合材料研究的进展

综述了减摩抗磨用无机颗粒 /高分子复合材料的最新研究进展 ,重点阐述了不同类型无机颗粒的作用机理及其对复合材料最终性能的影响 ,指出这类材料的发展趋势在于应用纳米填料 ,通过发展适当的分散技术 ,同时加强粒子与基体的结合 ,有可能克服现有微米颗粒复合材料中存在的缺点 。

纳米粒子/环氧树脂复合材料的固化动力学研究

在纳米Al2 O3、Si3N4 、SiC填充环氧树脂复合材料体系中 ,纳米粒子表面活性及粒子与环氧树脂之间的相互作用影响着环氧树脂的固化过程。本文利用傅立叶红外光谱表征了纳米粒子与环氧树脂之间的化学作用情况 ,并利用差视扫描量热仪研究了不同纳米粒子 环氧树脂复合材料的固化动力学。结果表明 ,具有相对最强表面活性的纳米Al2 O3粒子与基体之间的相互作用最强 ,同时该粒子对环氧树脂固化过程的促进作用最显著。

纳米SiO_2/聚丙烯复合材料的微观结构

利用原子力显微镜和透射电镜分析了聚苯乙烯辐射接枝纳米二氧化硅粒子(SiO2-g-PS)填充聚丙烯(PP)的微观结构,并与该复合材料的拉伸和冲击强度相关联,为探讨纳米粒子的增强增韧作用机制提供了直观证据。利用原子力显微镜进行的微划痕和纳米压痕实验,通过与显微硬度和动态力学性能测试结果的比较,证实了接枝改性后的纳米粒子团聚体具有承载能力,而这些团聚体对复合材料的局部和整体力学响应不同,揭示了团聚体增强效应的内在原因,即在纳米粒子团聚体内部以及团聚体之间形成了特定的应力双逾渗结构。

二氧化硅纳米颗粒对碳纤维与环氧树脂基体粘合强度的增强

纤维与基体的粘合强度是决定纤维增强高分子复合材料性能的关键因素。本文采用横向纤维束拉伸实验的方法研究了碳纤维与经过纳米颗粒改性的环氧树脂基体间的粘合强度。平均直径为25纳米的二氧化硅纳米颗粒用特殊的溶胶-凝胶法引入环氧基体(由Hanse ChemieAG提供) ,可以达到很高的含量,同时保持较为理想的分散状态。实验结果表明,二氧化硅纳米颗粒对于碳纤维与改性环氧基体的粘合强度有显著的增强效应。当纳米颗粒含量为14 vol .%时,横向纤维束拉伸的断裂强度相比纯环氧基体提高了104 %。通过对横向纤维束拉伸样品断裂面的扫描电镜观察,以及二氧化硅纳米颗粒改性环氧树脂基体材料的力学性质的测量,可以发现横向纤维束拉伸的断裂强度与改性环氧基体本身的断裂韧性之间存在良好的相关性。由此可推测纳米颗粒对环氧树脂基体材料的增韧是碳纤维与基体间界面增强的一个重要原因。