Integration of GaN thin films with silicon substrates by fusion bonding and laser lift-off

GaN thin films grown on sapphire substrates by metalorganic chemical vapor deposition （MOCVD） are successfully bonded and transferred onto Si receptor substrates using fusion bonding and laser lift-off （LLO） technique. GaN/Al2O3 structures are joined to Si substrates by pressure bonding Ti/Au coated GaN surface onto Ti/Au coated Si receptor substrates at the temperature of 400℃. KrF excimer laser with 400-mJ/cm^2 energy density, 248-nm wavelength, and 30-ns pulse width is used to irradiate the wafer through the transparent sapphire substrates and separate GaN films from sapphire. Cross-section scanning electron microscopy （SEM） combined with energy dispersive X-ray spectrometer （EDS） measurements show that Au/Si solid solution is formed during bonding process. Atomic force microscopy （AFM） and photoluminescence （PL） measurements show that the qualities of GaN films on Si substrates degrade little after substrates transfer.

Roughening surface morphology on free-standing GaN membrane with laser lift-off technique

An ultraviolet (UV) laser lift-off (LLO) technique was presented to form a roughened surface morphol-ogy on GaN membrane grown by metalorganic chemical vapor deposition (MOCVD). The etched sur-face showed cone-like structures on a free-standing GaN membrane. Based on the scanning electron microscopy (SEM) and atom force microscopy (AFM) measurements, the etching mechanism was proposed, which was related to the different decomposition depth caused by the dislocations in the GaN membrane. The etching efficiency and morphology of GaN by the LLO technique and the photo-electrochemical (PEC) wet etching technique was compared and analyzed. This roughed cone-like surface morphology by LLO can enhance the external efficiency of vertical structure n-side-up GaN-based light-emitting diodes (LEDs) simultaneously while being released of the performance con-strains impeded by sapphire.