Recalescence Velocity and Microstructure Evolution of Deeplyundercooled Cu_(65)Ni_(35) Alloy

The Cu_(65)Ni_(35) alloy liquid was undercooled by the fluxing method,and the rapid solidification structure was obtained by natural cooling.The solidification interface migration information of Cu_(65)Ni_(35) alloy liquid in rapid solidification stage was photographed with the help of high-speed camera,and the recalescence velocity was calculated.The microstructure evolution of the alloy was systematically studied by observing the microstructure morphology and taking photos on the metallographic microscope.By analyzing the evolution of dendrite grain size and microstructure microhardness with undercoolingand relying on electron backscatter diffraction(EBSD)technology,the grain refinement mechanism of microstructure under high undercooling and low undercooling is finally confirmed.

Rapid Dendrite Growth in Solidification of Highly Undercooled Alloys

Nonequilibrium thermodynamics and transportation kinetics near the propagating solid-liquid interface dominates the rapid solidification process,which is far from a thermodynamically stable state.Rapid solidification process can be described more precisely using quantitative thermodynamic calculation of phase diagram with nonlinear liquidus and solidus and evaluating the nonequilibrium effect in diffusion kinetics.Based on these basic principles,we used a current nonequilibrium dendrite growth model to describe rapid solidification process of deeply undercooled alloys.Evolution of the key fundamental solidification parameters was also evaluated.

Recalescence Behavior, Solidification Characteristics and Microstructure Transformation of Rapidly Solidified Undercooled Cu-based Alloys

The undercooled solidification microstructures of Cu55Ni45,Cu55Ni43Co2,and Cu60Ni38Co2 Cu-base alloys were obtained by fluxing method.Using infrared temperature measuring device,the law of the change of the recalescence degree with the increase of the undercooling during rapid solidification was studied.At the same time,high-speed camera was used to capture and photograph the images of solid/liquid interface migration during rapid solidification of undercooled melt,and the morphology evolution of solidification front was discussed.Finally,the microstructure morphology and transformation process of the Cubased alloys were systematically analyzed.It is found that the microstructure morphology of the alloys goes through the same evolution process and appeared two grain refinement phenomena,that is,“coarse dendrite-equiaxed grain-oriented fine dendrite-equiaxed grain”.But its characteristics undercoolingΔT_(1),ΔT_(2),and critical undercoolingΔT^(*)varies.Electron backscatter diffraction(EBSD)and transmission electron microscopy(TEM)were used to characterize the grain refinement structure with high undercooling.EBSD results show that the grain refinement structure with high undercooling presents a very high proportion of high angle grain boundaries,the grain orientation is random and there is no high strength texture,and a large number of annealing twins,which indicates that recrystallization occurs in the structure.TEM results show that dislocation network and stacking fault density are relatively low in most areas of grain refinement structure with high undercooling,which can confirm the theory that stress induces recrystallization of the structure.