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Microstructure of fly ash cenosphere/AZ91D composite during solution treatment at 380-420℃ 被引量:1
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作者 Huang Zhiqiu Yu Sirong +1 位作者 Li Muqin Liu Hongli 《China Foundry》 SCIE CAS 2011年第1期117-120,共4页
The fly ash cenosphere/AZ91D (FAC/AZ91D) composites containing 5 wt.% and 100 μm in size of fly-ash cenosphere particles were fabricated by means of the compcasting method.The microstructures of the as-cast samples a... The fly ash cenosphere/AZ91D (FAC/AZ91D) composites containing 5 wt.% and 100 μm in size of fly-ash cenosphere particles were fabricated by means of the compcasting method.The microstructures of the as-cast samples and the effect of the solution treatment at 380℃,400℃,and 420℃ for 16 h on the microstructures of the samples were investigated by using of OM,SEM,XRD and EDS.The results showed that the cenospheres distributed homogeneously in the Mg alloy,and were almost filled with Mg alloy.The main interfacial phase between the cenospheres and AZ91D Mg alloy was identified as MgAl2O4 according to XRD,EDS and thermodynamic analysis.Mg2Si particles tended to be spheroidized via the solution treatment and the β phase (Mg17Al12) dissolved completely at 400℃. 展开更多
关键词 composite materials liquid-solid reactions QUENCHING MICROSTRUCTURE
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Diffusion Bonding of Ti-6Al-4V to QAl 10-3-1.5 with Ni/Cu Interlayers
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作者 Wei GUO Xihua ZHAO +2 位作者 Minxia SONG Jicai FENG Biao YANG 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2006年第6期817-820,共4页
Ti-6Al-4V and QAl 10-3-1.5 diffusion bonding has been carried out with Ni/Cu interlayers. The diffusionbonded joints are evaluated by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and mi... Ti-6Al-4V and QAl 10-3-1.5 diffusion bonding has been carried out with Ni/Cu interlayers. The diffusionbonded joints are evaluated by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and microhardness test. Intermetallic compounds at the interface zone are detected by X-ray diffraction (XRD). Interracial microstructure of TiNi+CuTi3+α-Ti forms at the Ni/Ti-6Al-4V transition zone and Cu (ss. Ni) solid solution forms between Ni/Cu interlayers. The thickness of reaction layer (TiNi) increases with bonding time by a parabolic law: y^2=Koexp(-150000/RT)t, and K0=2.g×10^-7 m^2/s is figured out from the experiment data. 展开更多
关键词 Diffusion bonding MICROSTRUCTURE INTERFACE Ni/Cu interlayers
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