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Electrodeposition behavior of nanocrystalline CoNiFe soft magnetic thin film 被引量:5
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作者 李劲风 张昭 +3 位作者 阴军英 俞耿华 蔡超 张鉴清 《中国有色金属学会会刊:英文版》 EI CSCD 2006年第3期659-665,共7页
The electroplating behavior of nanocrystalline CoNiFe soft magnetic thin film with high saturation magnetic flux density (Bs>2.1 T) and low coercivity (Hc) was investigated using cyclic voltammetry and chronoampero... The electroplating behavior of nanocrystalline CoNiFe soft magnetic thin film with high saturation magnetic flux density (Bs>2.1 T) and low coercivity (Hc) was investigated using cyclic voltammetry and chronoamperometry methods in conjunction with the scanning electron microscopy (SEM/EDX). The results show that, under the experimental conditions, the co-deposition of CoNiFe film behaves anomalously due to the atomic radii of iron series elements following the order of rFe>rCo>rNi. In the case of lower electroplating current density, the co-deposition of CoNiFe film follows a 3-D progressive nucleation/growth mechanism, while in the case of higher electroplating current density, which follows a 3-D instantaneous nucleation/growth mechanism. Meanwhile, the change of nucleation mechanism of CoNiFe film with electroplating current density was interpreted theoretically in the light of quantum chemistry. 展开更多
关键词 CoNiFe 纳米晶薄膜 软磁材料 脉冲电镀 晶化机制
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