Due to their unique thermal, electronic and mechanical properties, carbon nanotubes （CNTs） have aroused various attentions of many researchers. Among all the techniques to fabricate CNTs, plasma enhanced chemical va...Due to their unique thermal, electronic and mechanical properties, carbon nanotubes （CNTs） have aroused various attentions of many researchers. Among all the techniques to fabricate CNTs, plasma enhanced chemical vapor deposition （PECVD） has been extensively developed as one growth technique to produce verticallyaligned car bon nanotubes （VACNTs）. Though CNTs show a trend to be integrated into nanoelectromechanical system （NEMS）, CNT growth still remains a mysterious technology. This paper attempts to reveal the effects of substrates and un derlayers to CNT synthesis. We tried five different substrates by substituting intrinsic Si with high resistivity ones and byincreasing the thickness of SiO2 insulativity layer. And also, we demonstrated an innovative way of adjusting CNT den sity by changing the thickness of Cu underlayer.展开更多
Manufacturing technologies for making advanced micro systems have been developing in a rapid pace recently. Research progress towards nanosized structures and devices opens up a whole new horizon for miniaturized syst...Manufacturing technologies for making advanced micro systems have been developing in a rapid pace recently. Research progress towards nanosized structures and devices opens up a whole new horizon for miniaturized system integration. Advances in this field will have an enormous societal impact and economic benefit in areas such as information technology, energy, healthcare, and many more. There has been an enormous scientific and industrial interest in nanosized advanced technologies. The theories, tools and practices for the design, manufacturing and test of these systems are emerging. The aim of this special section is to capture some of the latest developments in integration technologies for the micro/nanosystems, with the following topics： Molecular and crystal assembly inside the carbon nanotube： encapsulation and manufacturing approachesElectroplating for high aspect ratio vias in PCB manufacturing： enhancement capabilities of acoustic streaming Local synthesis of carbon nanotubes for direct integra tion in Si microsystemsdesign considerations Waferlevel SLID bonding for MEMS encapsulation Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD These papers will briefly highlight important advance ments in manufacturing technologies of the micro/nano systems, and outline the blueprint of upcoming information technology revolution from the manufacturing point of view.展开更多
基金supported by EU programs "Nanotec","Mercure","Nanocom","Nano-RF" and "Nanotherm", the SSF program"Scalable Nanomaterials and Solution Processable Thermoelectric Generators", and also Contract No.EM11-0002a part of the Sustainable Production Initiative and the Production Area of Advance at Chalmerssupported by the Shanghai Science and Technology Program(Grant No.12JC1403900) and NSFC(Grant No.51272153)
文摘Due to their unique thermal, electronic and mechanical properties, carbon nanotubes （CNTs） have aroused various attentions of many researchers. Among all the techniques to fabricate CNTs, plasma enhanced chemical vapor deposition （PECVD） has been extensively developed as one growth technique to produce verticallyaligned car bon nanotubes （VACNTs）. Though CNTs show a trend to be integrated into nanoelectromechanical system （NEMS）, CNT growth still remains a mysterious technology. This paper attempts to reveal the effects of substrates and un derlayers to CNT synthesis. We tried five different substrates by substituting intrinsic Si with high resistivity ones and byincreasing the thickness of SiO2 insulativity layer. And also, we demonstrated an innovative way of adjusting CNT den sity by changing the thickness of Cu underlayer.
文摘Manufacturing technologies for making advanced micro systems have been developing in a rapid pace recently. Research progress towards nanosized structures and devices opens up a whole new horizon for miniaturized system integration. Advances in this field will have an enormous societal impact and economic benefit in areas such as information technology, energy, healthcare, and many more. There has been an enormous scientific and industrial interest in nanosized advanced technologies. The theories, tools and practices for the design, manufacturing and test of these systems are emerging. The aim of this special section is to capture some of the latest developments in integration technologies for the micro/nanosystems, with the following topics： Molecular and crystal assembly inside the carbon nanotube： encapsulation and manufacturing approachesElectroplating for high aspect ratio vias in PCB manufacturing： enhancement capabilities of acoustic streaming Local synthesis of carbon nanotubes for direct integra tion in Si microsystemsdesign considerations Waferlevel SLID bonding for MEMS encapsulation Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD These papers will briefly highlight important advance ments in manufacturing technologies of the micro/nano systems, and outline the blueprint of upcoming information technology revolution from the manufacturing point of view.
