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Thermal residual stress of polycrystalline diamond compacts 被引量:6
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作者 陈枫 徐根 +1 位作者 马春德 徐国平 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2010年第2期227-232,共6页
Thermal residual stresses in polycrystalline diamond compact(PDC)cutter arising from the difference in thermal expansion between the polycrystalline diamond(PCD)and the supporting tungsten carbide substrate after sint... Thermal residual stresses in polycrystalline diamond compact(PDC)cutter arising from the difference in thermal expansion between the polycrystalline diamond(PCD)and the supporting tungsten carbide substrate after sintering at high pressure and high temperature were investigated using finite element simulation,laboratory tests and theoretical analysis.The obtained results show that although compressive residual stresses exist both in the interface of PCD table and in the most region of PCD table surface, the tensile residual stress,which is a fatal shortage to PDC,can also occur near the outer diameter area of PCD table,and the maximum value is 690 MPa.Distribution of tensile stress in the PCD table is given through experimental results,which is well consistent with the numerical results.This finding may be significant in designing new PDC cutters with lower residual stress and high cutting behavior. 展开更多
关键词 热残余应力 聚晶金刚石 PDC刀具 实验室试验 压缩残余应力 有限元模拟 PCD 硬质合金
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