Cu-based composites with multiscale configuration for electrical contact applications are fabricated via a ball milling(BM)-spark plasma sintering(SPS)-aging process.Synergistic strengthening of the Cu alloy matrix by...Cu-based composites with multiscale configuration for electrical contact applications are fabricated via a ball milling(BM)-spark plasma sintering(SPS)-aging process.Synergistic strengthening of the Cu alloy matrix by micro-scale metallic glass particles and nanoscale intracrystalline precipitation phases is realized.The annealing technique achieves the decomposition of solute atoms in the Cu alloy,ensuring the excellent electrical properties of the matrix conductive network.The composite with multiscale configuration achieves an outstanding combination of ultimate compressive strength of(1114±15)MPa and electrical conductivity of 33.0%±1.1%International Annealed Copper Standard(IACS)after annealing at 400.C for 10.0 h.Investigation of the strengthening and conductivity mechanisms suggests that the precipitation of the Cr-rich phase within the matrix crystals is a critical contributor to the concerted enhancement of strength and conductivity.In addition,the positive role of nanocrystals precipitated at the edges of metallic glass particles on the interfacial bonding of composites is addressed.展开更多
基金financially supported by Shenzhen Knowledge Innovation Plan—Fundamental Research(Discipline Distribution)(No.JCYJ20180507184623297)the National Natural Science Foundation of China(No.51871077)+4 种基金Guangdong Basic and Applied Basic Research Foundation(No.2021A1515012626)Shenzhen Science and Technology Plan—Technology Innovation(No.KQJSCX20180328165656256)Development and Reform Commission of Shenzhen Municipality-Shenzhen R&D Center for Al-based Hydrogen Hydrolysis Materials(No.ZX20190229)Startup Foundation from ShenzhenStartup Foundation from Harbin Institute of Technology(Shenzhen)。
文摘Cu-based composites with multiscale configuration for electrical contact applications are fabricated via a ball milling(BM)-spark plasma sintering(SPS)-aging process.Synergistic strengthening of the Cu alloy matrix by micro-scale metallic glass particles and nanoscale intracrystalline precipitation phases is realized.The annealing technique achieves the decomposition of solute atoms in the Cu alloy,ensuring the excellent electrical properties of the matrix conductive network.The composite with multiscale configuration achieves an outstanding combination of ultimate compressive strength of(1114±15)MPa and electrical conductivity of 33.0%±1.1%International Annealed Copper Standard(IACS)after annealing at 400.C for 10.0 h.Investigation of the strengthening and conductivity mechanisms suggests that the precipitation of the Cr-rich phase within the matrix crystals is a critical contributor to the concerted enhancement of strength and conductivity.In addition,the positive role of nanocrystals precipitated at the edges of metallic glass particles on the interfacial bonding of composites is addressed.
