Silicon bulk etching is an important part of micro-electro-mechanical system(MEMS) technology. In this work, a novel etching method is proposed based on the vapor from tetramethylammonium hydroxide(TMAH) solution heat...Silicon bulk etching is an important part of micro-electro-mechanical system(MEMS) technology. In this work, a novel etching method is proposed based on the vapor from tetramethylammonium hydroxide(TMAH) solution heated up to boiling point. The monocrystalline silicon wafer is positioned over the solution surface and can be anisotropically etched by the produced vapor. This etching method does not rely on the expensive vacuum equipment used in dry etching. Meanwhile, it presents several advantages like low roughness, high etching rate and high uniformity compared with the conventional wet etching methods. The etching rate and roughness can reach 2.13 μm/min and 1.02 nm, respectively. Furthermore,the diaphragm structure and Al-based pattern on the non-etched side of wafer can maintain intact without any damage during the back-cavity fabrication. Finally, an etching mechanism has been proposed to illustrate the observed experimental phenomenon. It is suggested that there is a water thin film on the etched surface during the solution evaporation. It is in this water layer that the ionization and etching reaction of TMAH proceed, facilitating the desorption of hydrogen bubble and the enhancement of molecular exchange rate. This new etching method is of great significance in the low-cost and high-quality micro-electromechanical system industrial fabrication.展开更多
基金supported by the National Natu-ral Science Foundation of China(No.51675493 and No.51975542)the National Key R&D Program of China(No.2018YFF0300605,No.2019YFF0301802,and No.2019YFB2004802)Program for the Outstanding Innovative Teams of Higher Learning Institutions of Shanxi and Shanxi"1331 Project"Key Subject Construction(1331KSC).
文摘Silicon bulk etching is an important part of micro-electro-mechanical system(MEMS) technology. In this work, a novel etching method is proposed based on the vapor from tetramethylammonium hydroxide(TMAH) solution heated up to boiling point. The monocrystalline silicon wafer is positioned over the solution surface and can be anisotropically etched by the produced vapor. This etching method does not rely on the expensive vacuum equipment used in dry etching. Meanwhile, it presents several advantages like low roughness, high etching rate and high uniformity compared with the conventional wet etching methods. The etching rate and roughness can reach 2.13 μm/min and 1.02 nm, respectively. Furthermore,the diaphragm structure and Al-based pattern on the non-etched side of wafer can maintain intact without any damage during the back-cavity fabrication. Finally, an etching mechanism has been proposed to illustrate the observed experimental phenomenon. It is suggested that there is a water thin film on the etched surface during the solution evaporation. It is in this water layer that the ionization and etching reaction of TMAH proceed, facilitating the desorption of hydrogen bubble and the enhancement of molecular exchange rate. This new etching method is of great significance in the low-cost and high-quality micro-electromechanical system industrial fabrication.
