Nanoscale surface texturing,drilling,cutting,and spatial sculpturing,which are essential for applications,including thin-film solar cells,photonic chips,antireflection,wettability,and friction drag reduction,require n...Nanoscale surface texturing,drilling,cutting,and spatial sculpturing,which are essential for applications,including thin-film solar cells,photonic chips,antireflection,wettability,and friction drag reduction,require not only high accuracy in material processing,but also the capability of manufacturing in an atmospheric environment.Widely used focused ion beam(FIB)technology offers nanoscale precision,but is limited by the vacuum-working conditions;therefore,it is not applicable to industrial-scale samples such as ship hulls or biomaterials,e.g.,cells and tissues.Here,we report an optical far-field-induced near-field breakdown(O-FIB)approach as an optical version of the conventional FIB technique,which allows direct nanowriting in air.The writing is initiated from nanoholes created by femtosecondlaser-induced multiphoton absorption,and its cutting“knife edge”is sharpened by the far-field-regulated enhancement of the optical near field.A spatial resolution of less than 20 nm(λ/40,withλbeing the light wavelength)is readily achieved.O-FIB is empowered by the utilization of simple polarization control of the incident light to steer the nanogroove writing along the designed pattern.The universality of near-field enhancement and localization makes O-FIB applicable to various materials,and enables a large-area printing mode that is superior to conventional FIB processing.展开更多
Microelectronics has solved the challenge of packaging different functional elements with integrated chips(ICs)in modern computing and communication by wire bonding.Miniaturization was a trend guided by the requiremen...Microelectronics has solved the challenge of packaging different functional elements with integrated chips(ICs)in modern computing and communication by wire bonding.Miniaturization was a trend guided by the requirements for faster,more portable and less expensive(smaller amount of materials)solutions,where wire bonding evolved to accommodate increasingly more complex 3D architectures of chips and printed circuit boards.展开更多
基金supported in part by the National Key R&D Program of China under Grant 2017YFB1104600in part by the National Natural Science Foundation of China(NSFC)under Grants#61960206003,#61825502,#61590930,and #61805100+1 种基金support via the Changjiang Distinguished Professor project on 3D laser nano-/microprinting at Jilin Universitythe Australian Research Council Discovery project DP190103284.
文摘Nanoscale surface texturing,drilling,cutting,and spatial sculpturing,which are essential for applications,including thin-film solar cells,photonic chips,antireflection,wettability,and friction drag reduction,require not only high accuracy in material processing,but also the capability of manufacturing in an atmospheric environment.Widely used focused ion beam(FIB)technology offers nanoscale precision,but is limited by the vacuum-working conditions;therefore,it is not applicable to industrial-scale samples such as ship hulls or biomaterials,e.g.,cells and tissues.Here,we report an optical far-field-induced near-field breakdown(O-FIB)approach as an optical version of the conventional FIB technique,which allows direct nanowriting in air.The writing is initiated from nanoholes created by femtosecondlaser-induced multiphoton absorption,and its cutting“knife edge”is sharpened by the far-field-regulated enhancement of the optical near field.A spatial resolution of less than 20 nm(λ/40,withλbeing the light wavelength)is readily achieved.O-FIB is empowered by the utilization of simple polarization control of the incident light to steer the nanogroove writing along the designed pattern.The universality of near-field enhancement and localization makes O-FIB applicable to various materials,and enables a large-area printing mode that is superior to conventional FIB processing.
文摘Microelectronics has solved the challenge of packaging different functional elements with integrated chips(ICs)in modern computing and communication by wire bonding.Miniaturization was a trend guided by the requirements for faster,more portable and less expensive(smaller amount of materials)solutions,where wire bonding evolved to accommodate increasingly more complex 3D architectures of chips and printed circuit boards.
