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Improved performance of back-gate MoS2 transistors by NH3-plasma treating high-k gate dielectrics
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作者 陈建颖 赵心愿 +1 位作者 刘璐 徐静平 《Chinese Physics B》 SCIE EI CAS CSCD 2019年第12期338-344,共7页
NH3-plasma treatment is used to improve the quality of the gate dielectric and interface. Al2O3 is adopted as a buffer layer between HfO2 and MoS2 to decrease the interface-state density. Four groups of MOS capacitors... NH3-plasma treatment is used to improve the quality of the gate dielectric and interface. Al2O3 is adopted as a buffer layer between HfO2 and MoS2 to decrease the interface-state density. Four groups of MOS capacitors and back-gate transistors with different gate dielectrics are fabricated and their C–V and I–V characteristics are compared. It is found that the Al2O3/HfO2 back-gate transistor with NH3-plasma treatment shows the best electrical performance: high on–off current ratio of 1.53 × 107, higher field-effect mobility of 26.51 cm2/V·s, and lower subthreshold swing of 145 m V/dec.These are attributed to the improvements of the gate dielectric and interface qualities by the NH3-plasma treatment and the addition of Al2O3 as a buffer layer. 展开更多
关键词 MoS2 transistor high-k dielectric NH3-plasma treatment oxygen vacancy mobility
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