Video over IP using standard-compatible multiple description coding: an IETF proposal

Standard-compatible multiple description coding (MDC) and layered coding (LC) are efficient ways to ensure erasure resilient, scalable transmission of encoded multimedia sources via RTP, allowing a gradual degradation of the application quality with increasing packet loss rate and decreasing bandwidth/throughput on the network. In this paper we review the stan- dard-compatible framework proposed to IETF. Alternative techniques such as robust source coding and channel coding techniques (ARQ: automatic repeat request, FEC: forward error correction) are presented; their integration into the proposed framework is also discussed. The performances of MDC and LC either coupled with channel coding or not, are summarized by reference to current literature. Typical cases and examples are illustrated.

Ceramic-copper substrate technology introduction

Ceramic-copper substrate is used to achieve the combination between copper and ceramic(Al_(2)O_(3) or AlN)under high temperatures by bonding or brazing process,then through dedicate lamination–etching technology to develop the designed layout in copper surface,finally parts go with plating and singulation process for surface treatment before shipping to the end-user.Ceramic-copper substrate has perfect performance in terms of insulation,thermal conductivity,solderability,and adhesion strength.Besides,the copper on surface can afford huge current due to the fact that ceramic has good reliability and thermal-cycling performance.According to technical visit and audit to suppliers’manufacturing process and based on several years’experience of mass production for electric vehicle power module package,this article introduces two mainstream ceramic-copper substrate processing methods currently on the market:direct bond copper(DBC)and active metal brazing(AMB)which can be widely used for the intelligent power module and electric vehicle power module,also introduces the major failure mode during application and analyzes the root cause for each failure mode,clarifies key incoming monitoring method,like crosshatch,silver plating thickness measurement and blister test.This article also clarifies the Incoming Quality Control system,which can provide guidance to process engineer during the application.

Electrical Homo-Junction Delineation Techniques: A Comparative Study

In active semiconductor devices, the junction characteristics are critical for the electrical performance. As an alternative of the atomic force microscopy (AFM)-based electrical techniques which provide unique junction characterization, other methods are dedicated for the delineation of the electrical junction such as the wet chemical etching, the electrochemical plating method, the Seebeck effect imaging (SEI) method, the electron-beam induced current (EBIC) technique and the secondary electron potential contrast (SEPC) method. The aim of this paper is in the one hand to compare these five techniques in term of sample preparation, spatial application range, spatial resolution, simplicity and information displayed. In the other hand, this review aims to provide some guidelines for the appropriate delineation method(s) selection. It was confirmed that chemical based techniques are the simplest junction delineation methods but exhibit some drawbacks in term of spatial resolution and reproducibility. Despite of a limited spatial resolution, it was evidenced that EBIC can provide accurate electrical characterization of the junction. Finally, it was demonstrated that SEPC is the most promising technique providing the higher spatial resolution. The effect of the sample preparation method has been described. Even if the comparison was mainly based on homo-micro-Silicon junctions (n-p and n-p-n-p), the results were also discussed for short SiC junctions. The importance of the analysis context was considered in this paper and analysis flow was suggested for specific analysis cases.

Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application

Packaging of MEMS ( micro-electro-mechanical system ) devices poses more challenges than conventional IC packaging, since the performance of the MEMS devices is highly dependent on packaging processes. A Land Grid Array ( LGA ) package is introduced for MEMS technology based linear multi-axis accelerometers. Finite element modeling is conducted to simulate the warpage behavior of the LGA packages. A method to correlate the package warpage to matrix block warpage has been developed. Warpage for both package and sensor substrate are obtained. Warpage predicted by simulation correlates very well with experimental measurements. Based on this validated method, detailed design analysis with different package geometrical variations are carried out to optimize the package design. With the optimized package structure, the packaging effect on accelerometer signal performance is well controlled.

Nanoparticles Production and Inclusion in <i>S. aureus</i>Incubated with Polyurethane: An Electron Microscopy Analysis

This study shows that submicron/nanoparticles found in bacterial cells (S. aureus) incubated with polyurethane (a material commonly used for prostheses in odontostomatology) are a consequence of biodestruction. The presence of polyurethane nanoparticles into bacterial vesicles suggests that the internalization process occurs through endocytosis. TEM and FIB/SEM are a suitable set of correlated instruments and techniques for this multi facet investigation: polyurethane particles influence the properties of S. aureus from the morpho-functional standpoint that may have undesirable effects on the human body. S. aureus and C. albicans are symbiotic microorganisms;it was observed that C. albicans has a similar interaction with polyurethane and an increment of the biodestruction capacity is expected by its mutual work with S. aureus.

基于统一平台的高清机顶盒系统级芯片

STiH253全功能数字视频广播芯片集成一个DVB-T2解调器，让设备厂商能够研发高集成度的地面机顶盒。另一款新增的机顶盒芯片STiH271EL特别适用于只需入门级机顶盒功能且不影响视频质量的中低端市场。

16x4通道DOCSIS 3.0线缆调制解调器芯片

自2012年9月首次发布其DOCSIS3．0技术后，意法半导体随即推出用于机顶盒或有显示器的网关前端的STiD12512通道和STiD12716通道调制解调器芯片，以及STiD12816通道线缆调制解调器和数据网关（包括有显示器的网关前端）调制解调器芯片。作为市场公认首款可支持DOCSIS3．0规范的产品，

新一代闪存M58LW064系列的先进特性

M58LW064是ST新推出的最先进的闪存家族的第一个成员,具有很多先进的特性,可满足现在和未来产品的苛刻的要求.这一系列荟萃了最新的多位单元技术、32位脉冲串总线访问和写缓存以及标准闪存技术,是闪存技术发展过程中新一代闪存产品的代表作.

热湿存储环境下须状晶体的生长机理与影响因素

纯哑锡表面的晶须特性已经成为IC封装中无铅焊接工艺实施的主要影响因素之一。由于其它替代方法,例如预先在引脚上镀Ni/Pd/Au层,会导致成本无法预估以及可靠性下降等问题,因此,目前的关注点是进一步减少纯锡表面须状晶体的生长。

Implementing a 1GHz Four-Issue Out-of-Order Execution Microprocessor in a Standard Cell ASIC Methodology

这篇论文介绍微建筑学；Godson-2E 处理器的物理实现，它是支持 64 位 MIPS 指令表的四问题的超标量 RISC。好攻击的打乱次序的实行的采纳；存储器层次技术帮助 Godson-2E 完成高效。Godson-2E 处理器身体上与某切小点的用手的放置用基于房间的方法论在 7 金属 90nm CMOS 工艺被设计了；很多个精心制作的房间；宏。处理器能在 1GHz 被运用；比 500 高完成说明 CPU2000 率。

Ba substitution for enhancement of the thermoelectric properties of LaCoO_(3) ceramics(0≤x≤0.75)

In the present work, dense perovskite ceramics were successfully prepared from a series of La1-xBaxCoO3 solid solutions in the range of substitution 0 ≤ x ≤ 0.75 using solid state reaction and conventional sintering. Structural properties of La1-xBaxCoO3 were systematically investigated and thermoelectric properties were measured in the temperature range of 330–1000 K. The results show that the thermoelectric properties of Ba-substituted LaCoO3 depend on x. Indeed, at 330 K, electrical conductivity presents an optimum value for x = 0.25 with a value of σmax ≈ 2.2×105 S·m–1 whereas the Seebeck coefficient decreases when x and/or the temperature increases. The Ba-substituted LaCoO3 samples exhibit p-type semiconducting behaviour. The best power factor value found is 3.4×10–4 W·m–1·K–2 at 330 K for x = 0.075, which is 10% higher than the optimum value measured in La1–xSrxCoO3 for x = 0.05. The thermal diffusivity and thermal conductivity increase with increasing temperature and Ba concentration. La1-xBaxCoO3 shows a maximum figure of merit(ZT = 0.048) for x = 0.05 at 330 K, 25% higher than the best value in La1–xSrxCoO3 compounds.

Synthesis,sintering,and thermoelectric properties of the solid solution La_(1–x)Sr_(x)CoO_(3±δ)(0≤x≤1)

In this work, we synthesized cubic perovskite ceramics of the whole La_(1–x)Sr_xCoO_3(0 ≤ x ≤ 1) solid solution for the first time. Synthesis was carried out by solid state reaction and conventional sintering to reach dense ceramics. For x > 0.8, it was necessary to substitute 3% cobalt by silicon to stabilize the cubic perovskite structure. Electrical conductivity increased with Sr content to reach 3×10~5 S·m^(–1) at 330 K for x = 0.3. However, the optimum electrical properties have been found for x = 0.05 at 330 K with PF_(max) = 3.11×10^(–4)W·m^(–1)·K^(–2). Indeed, the Seebeck coefficient was decreasing when x increased to reach values close to 0 for x ≥ 0.3. Thermal conductivity was low at low temperature(≈ 2.5 W×m^(–1)·K^(–1)) and increased up to 6.5 W·m^(–1)·K^(–1) when temperature increased. As the highest power factor was reached at low temperature as well as the lowest thermal conductivity, La_(1–x)Sr_xCoO_3 compounds with low x values appeared as very promising thermoelectric materials around room temperature, on the contrary to layered cobalt oxides. For high x values, Seebeck coefficient values close to zero made these materials unsuitable for thermoelectric applications.

Silicon photonics phase and intensity modulators for flat frequency comb generation

Flat electro-optical frequency combs play an important role in a wide range of applications,such as metrology,spectroscopy,or microwave photonics.As a key technology for the integration of optical circuits,silicon photonics could benefit from on-chip,tunable,flat frequency comb generators.In this article,two different architectures based on silicon modulators are studied for this purpose.They rely on a time to frequency conversion principle to shape the comb envelope.Using a numerical model of the silicon traveling-wave phase modulators,their driving schemes are optimized before their performances are simulated and compared.A total of nine lines could be obtained within a 2 dB flatness,with a line-spacing ranging from 0.1 to 7 GHz.Since this tunability is a major asset of electro-optical frequency combs,the effect of segmenting the phase modulators is finally investigated,showing that the flat lines spacing could be extended up to 39 GHz by this method.